MWS11-GB11T [MICROSEMI]

Wide Band Low Power Amplifier, 0MHz Min, 6000MHz Max, PLASTIC, SOT-23, 5 PIN;
MWS11-GB11T
型号: MWS11-GB11T
厂家: Microsemi    Microsemi
描述:

Wide Band Low Power Amplifier, 0MHz Min, 6000MHz Max, PLASTIC, SOT-23, 5 PIN

射频 微波
文件: 总5页 (文件大小:119K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
C O N F I D E N T I A L  
MWS11-GB11  
InGaP HBT Gain Block  
A
M I C R O S E M I  
C O M P A N Y  
PREVIEW  
This general purpose amplifier is a low  
This RFIC amplifier is initially  
Advanced InGaP HBT  
cost, broadband RFIC manufactured with available in a high performance ceramic  
an InGaP/GaAs Heterojunction Bipolar micro-X package to handle P1dB output  
Transistor (HBT) process (MOCVD). power up to 19dBm (5V) and lower  
This RFIC amplifier was designed as an powers in an industry-standard SOT-23 5-  
easily cascadable 50 ohm gain block. The lead surface mount package. The same  
device is self-contained with 50 ohm input RFIC will be available later in an  
and output impedance. Applications in- advanced Microsemi Gigamite™ package  
clude IF and RF amplification in wireless/ with ceramic Micro-X performance but  
wired voice and data communication with the cost similar to the SOT-23 plastic  
products and broadband test equipment package.  
DC to 6GHz  
Single +5V Supply  
Small Signal Gain = 16dB  
P1dB = 19dBm (5V),  
f=1GHz  
SOT-23 5-Pin, Micro-X, &  
Gigamite Packages  
Mcrosemi  
.
Broadband Gain Blocks  
IF or RF buffer Amplifiers  
Driver Stage for Power  
Amps  
Final Power Amp for Low to  
Medium Power Applications  
Broadband Test Equipment  
operating up to 6 GHz.  
IMPORTANT:  
For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
4 5  
4 0  
3 5  
3 0  
2 5  
2 0  
1 5  
1 0  
5
f = 5 . 7 G H z  
V c c = 5 V  
N o m in a l C u r re n t  
2 0 m A  
0
-5  
-1 0  
-2 0  
-1 5  
-1 0  
-5  
0
5
1 0  
1 5  
P o u t  
P in (d B m )  
G a in  
C u rre n t  
SE SOT-23 5-Pin  
Plastic  
Ceramic Micro-X  
4-PIN  
Gigamite  
TJ (°C)  
0 to 70  
MWS11-GB11  
MWS11-GB11  
MWS11-GB11-X1  
Note: Available in Tape & Reel.  
Append the letter “T” to the part number. (i.e. MSW11-GB11-X1T)  
Copyright 2000  
Rev. 0.1b,2000-08-30  
Microsemi  
Page 1  
11861 Western Avenue, Garden Grove, CA. 92841. Tel: (714) 898-8121  
C O N F I D E N T I A L  
MWS11-GB11  
InGaP HBT Gain Block  
A
M I C R O S E M I  
C O M P A N Y  
PREVIEW  
Mcrosemi  
DC Supply Voltage ................................................................................................. 5.0 Vdc  
Absolute Max. Limit ..................................................................................................60mA  
RF Input Power (Pin) .............................................................................................. 10 dBm  
Operating Case Temperature..........................................................................-40º to +85ºC  
Storage Temperature ....................................................................................-60º to +150ºC  
GND  
4
.
RF  
RF  
1
3
IN  
OUT  
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to  
Ground. Currents are positive into, negative out of specified terminal.  
2
GND  
Ceram ic Micro-  
X Package  
PW  
PACKAGE  
xx C/W  
°
THERMAL RESISTANCE-JUNCTION TO AMBIENT,  
θJA  
149 C/W  
°
THERMAL RESISTANCE-JUNCTION TO CASE,  
THERMAL RESISTANCE-JUNCTION TO LEAD,  
θJC  
θJT  
xx C/W  
°
Junction Temperature Calculation: TJ = TA + (PD x θJA).  
The θJA numbers are guidelines for the thermal performance of the device/pc-board  
system. All of the above assume no ambient airflow.  
RF IN  
GND  
RF Input pin. A DC blocking capacitor should be used in most applications.  
Ground connection. Traces should be minimized and connect immediately to ground.  
RF output and bias pin. In the bias network, a resistor is selected to set the DC current into this pin as:  
(
V
CC V  
D
)
R =  
RF OUT /  
BIAS  
I
CC  
Note that maximum current limit ICC must not be exceeded and a resistor should always be used. A DC blocking  
capacitor should also be used.  
Copyright 2000  
Rev. 0.1b,2000-08-30  
Microsemi  
Page 2  
11861 Western Avenue, Garden Grove, CA. 92841. Tel: (714) 898-8121  
C O N F I D E N T I A L  
MWS11-GB11  
InGaP HBT Gain Block  
A
M I C R O S E M I  
C O M P A N Y  
PREVIEW  
Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C TA +85°C except where  
otherwise noted. Test conditions: [Enter Test Conditions Here]  
Mcrosemi  
[Part #]  
Typ  
Parameter  
POWER SUPPLY  
Symbol  
Test Conditions  
Units  
Min  
Max  
Application Frequency Range  
Linear Output Power  
Output 3rd Order Intermod  
Product*  
f
DC  
16  
6
19  
GHz  
dBm  
P1dB  
f=2GHz  
.
IP3  
34  
dBm  
Small-Signal Gain  
Noise Figure  
Supply Voltage  
G
NF  
VCC  
f=1 GHz  
f=1.5 GHz  
13  
3.3  
16  
4
5
dB  
dB  
V
3.5  
4.6  
20  
Supply Current  
60  
mA  
OVERALL  
DC to  
>6000  
5.5  
11.3  
11.3  
11.4  
11.5  
11.5  
9.9  
Frequency Range  
1dB Bandwidth  
T=25°C, VD=5.5V, ICC=70mA  
MHz  
GHz  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
Freq = 100MHz  
Freq = 1000MHz  
Freq = 2000MHz  
Freq = 3000MHz  
Freq = 4000MHz  
Freq = 6000MHz  
100MHz to 2000MHz  
Freq = 1000MHz  
In a 50  
10.2  
Gain  
Gain Flatness  
Noise Figure  
0.05  
7.6  
<1.8:1  
<2.5:1  
<1.8:1  
<2.5:1  
34.5  
18.5  
16.5  
Input VSWR  
Output VSWR  
Output IP3  
Freq = 1000MHz  
Freq = 1000MHz  
Freq = 1000MHz  
dBm  
dBm  
dB  
Output P1dB  
Reverse Isolation  
THERMAL  
Maximum Measured Junction  
Temp at DC Bias Conditions  
TA = +85°C  
142  
°C  
TA = +85°C  
TA = +25°C  
TA = -40°C  
1.4x103  
3.4x105  
1.8x109  
Years†  
Years†  
Years†  
Mean Time Between Failures  
* Output power at 1dB gain compression point, f=1 GHz  
In accordance with Manufacturer design  
Copyright 2000  
Rev. 0.1b,2000-08-30  
Microsemi  
Page 3  
11861 Western Avenue, Garden Grove, CA. 92841. Tel: (714) 898-8121  
C O N F I D E N T I A L  
MWS11-GB11  
InGaP HBT Gain Block  
A
M I C R O S E M I  
C O M P A N Y  
PREVIEW  
Mcrosemi  
VCC  
µ
0.01 pF  
.
F
20  
1.0  
220 nH  
4
2
RF IN  
RF OUT  
150 pF  
pF  
150  
1
3
VD  
Ω µ  
50  
strip  
Ω µ  
50  
strip  
VCC  
µ
F
1.0  
µ
F
0.01  
pF  
20  
100  
4
2
λ
TL, /4  
RF IN  
RF OUT  
strip  
150 pF  
pF  
150  
1
3
VD  
Ω µ  
50  
strip  
Ω µ  
50  
Copyright 2000  
Rev. 0.1b,2000-08-30  
Microsemi  
Page 4  
11861 Western Avenue, Garden Grove, CA. 92841. Tel: (714) 898-8121  
C O N F I D E N T I A L  
MWS11-GB11  
InGaP HBT Gain Block  
A
M I C R O S E M I  
C O M P A N Y  
PREVIEW  
4-PIN CERAMIC MICRO-X  
Mcrosemi  
A
. 8 8 9  
4 . 6 9 9  
2 . 1 5 9  
. 3 8 0  
1 . 4 2 9  
5 . 4 6 0  
2 . 9 2 1  
. 6 3 5  
. 0 3 5  
. 1 8 5  
. 0 8 5  
. 0 1 5  
. 0 1 3  
. 0 6 7  
. 0 0 3  
. 0 4 5  
. 2 1 5  
. 1 1 5  
. 0 2 5  
. 0 1 7  
. 0 7 3  
. 0 0 7  
. 0 5 7  
. 0 1 0  
. 0 2 5  
. 0 3 8  
4 5 °  
E
4
.
B
F
3
1
. 3 3 0  
. 4 3 1  
1 . 7 0 1  
. 0 7 6  
1 . 8 5 4  
. 1 7 7  
D
2
G
H
1 . 4 4 7  
. 2 5 4  
C
. 1 5 2  
. 5 5 8  
. 8 1 2  
. 0 0 6  
. 0 2 2  
. 0 3 2  
. 6 3 5  
. 9 6 5  
4 5 °  
I
Note:  
1. Dimensions do not include mold flash or protrusions; these  
shall not exceed 0.15mm (.0006”) on any side. Lead  
dimension shall not include solder coverage.  
J
L
K
Copyright 2000  
Rev. 0.1b,2000-08-30  
Microsemi  
Page 5  
11861 Western Avenue, Garden Grove, CA. 92841. Tel: (714) 898-8121  

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