MX6506A [MICROSEMI]

Rectifier Diode, 8 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC, DIP-14;
MX6506A
型号: MX6506A
厂家: Microsemi    Microsemi
描述:

Rectifier Diode, 8 Element, 0.3A, Silicon, HERMETIC SEALED, CERAMIC, DIP-14

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文件: 总2页 (文件大小:60K)
中文:  中文翻译
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6506A  
Isolated Diode Array with  
HiRel MQ, MX, MV, and SP Screening Options  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
These low capacitance diode arrays with common cathode are multiple, discrete,  
isolated junctions fabricated by a planar process and mounted in a 10-PIN package for  
use as steering diodes protecting up to eight I/O ports from ESD, EFT, or surge by  
directing them to the positive side of the power supply line (see figure 1). This circuit  
application is further complimented by the 1N6507 (separate data sheet) that has a  
common anode. An external TVS diode may be added between the positive supply  
line and ground to prevent overvoltage on the supply rail. They may also be used in  
fast switching core-driver applications. This includes computers and peripheral  
equipment such as magnetic cores, thin-film memories, plated-wire memories, etc., as  
well as decoding or encoding applications. These arrays offer many advantages of  
integrated circuits such as high-density packaging and improved reliability. This is a  
result of fewer pick and place operations, smaller footprint, smaller weight, and  
elimination of various discrete packages that may not be as user friendly in PC board  
mounting.  
14-PIN Ceramic DIP  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
High Frequency Data Lines  
RS-232 & RS-422 Interface Networks  
Ethernet: 10 Base T  
Computer I/O Ports  
LAN  
Hermetic Ceramic Package  
Isolated Diodes to Eliminate Cross-Talk Voltages  
High Breakdown Voltage VBR > 60 V at 10 μA  
Low Leakage IR< 100nA at 40 V  
Low Capacitance C < 4.0 pF  
Switching Core Drivers  
IEC 61000-4 Compatible (see circuit in figure 1)  
61000-4-2 ESD: Air 15 kV, contact 8 kW  
61000-4-4 (EFT): 40 A – 5/50 ns  
61000-4-5 (surge): 12 A 8/20 μs  
Switching Speeds less than 20 ns  
Options for screening in accordance with MIL-PRF-  
19500/474 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or SP prefixes  
respectively to part numbers. For example, designate  
MX6506A for a JANTX screen.  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
14-PIN Ceramic DIP  
VBR Reverse Breakdown Voltage 60 V min (Note 1 & 2)  
IO Continuous Forward Current of 300 mA (Note 1 & 3)  
IFSM Forward Surge Current (tp=1/120 s) 500 mA (Note 1)  
400 mW Power Dissipation per Junction @ 25oC  
600 mW Power Dissipation per Package @ 25oC (Note 4)  
Operating Junction Temperature range –65 to +150oC  
Storage Temperature range of –65 to +150oC  
Weight 2.05 grams (approximate)  
Marking: Logo, part number, date code  
Pin #1 to the left of the indent on top of package  
Carrier Tubes; 25 pcs (standard)  
NOTE 1: Each Diode  
NOTE 2: Pulsed: PW = 100 ms max; duty cycle <20%  
NOTE 3: Derate at 2.4 mA/oC above +25oC  
NOTE 4: Derate at 4.0 mW/oC above +25oC  
MAXIMUM  
REVERSE  
MAXIMUM  
FORWARD  
VOLTAGE  
MAXIMUM  
MAXIMUM  
REVERSE  
CURRENT  
MAXIMUM  
CAPACITANCE  
(PIN TO PIN)  
RECOVERY TIME  
FORWARD  
trr  
RECOVERY TIME  
I = IR = 200 mA  
i = 20 mA  
rr  
F
V
F1  
Ct  
t
fr  
I = 100 mA  
I
VR = 0 V  
F = 1 MHz  
F
R1  
I = 500 mA  
F
R = 100 ohms  
(Note 1)  
VR = 40 V  
L
PART  
NUMBER  
V
μA  
pF  
ns  
ns  
6506A  
1
0.1  
4.0  
40  
20  
NOTE 1: Pulsed: PW = 300 us +/- 50 µs, duty cycle <2%, 90 µs after leading edge.  
Copyright © 2007  
3-27-2007  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
6506A  
Isolated Diode Array with  
HiRel MQ, MX, MV, and SP Screening Options  
S C O T T S D A L E D I V I S I O N  
SYMBOLS & DEFINITIONS  
Symbol  
VBR  
DEFINITION  
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current  
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current  
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and  
temperature  
Forward Surge Current: The peak forward surge current at a specified pulse width  
Capacitance: The capacitance of the TVS as defined @ 0 volts at a frequency of 1 MHz and stated in  
picofarads  
VF  
IR  
IFSM  
Ct  
SCHEMATIC  
PACKAGE DIMENSIONS  
CIRCUIT  
Supply rail (+VCC)  
I/O Port  
GND (or -VCC)  
Steering Diode Application  
FIGURE 1  
Copyright © 2007  
3-27-2007  
Microsemi  
Page 2  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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