SG2524BDW-TR [MICROSEMI]
Switching Controller, Current-mode, 0.2A, 600kHz Switching Freq-Max, BIPolar, PDSO16;
| 型号： | SG2524BDW-TR |
| 厂家： | 
Microsemi |
| 描述： | Switching Controller, Current-mode, 0.2A, 600kHz Switching Freq-Max, BIPolar, PDSO16 开关 光电二极管 |
| 文件： | 总10页 (文件大小：535K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SG1524B/SG2524B/SG3524B
Regulatating Pulse Width Modulator
Features
Description
The SG1524B is a pulse width modulator for switching
power supplies that features improved performance over
industry standards like the SG1524. A direct pin-for-pin
replacement for the earlier device, it combines advanced
processing techniques and circuit design to provide
improved reference accuracy, and extended common mode
range at the error amplifier and current limit inputs. A DC-
coupled flip-flop eliminates triggering and glitch problems,
and a PWM data latch prevents edge oscillations.
.
.
.
.
.
.
.
.
.
.
.
7V to 40V Operation
5V Reference Trimmed to 1%
100Hz to 400kHz Oscillator Range
Excellent External Sync Capability
Dual 100 mA Output Transistors
Wide Current Limit Common Mode Range
DC-Coupled Toggle Flip-flop
PWM Data Latch
Undervoltage Lockout
Full Double-pulse Suppression Logic
60V Output Collectors
The circuit incorporates true digital shutdown for high speed
response, while an undervoltage lockout circuit prevents
spurious outputs when the supply voltage is too low for
stable operation.
insures alternating output pulses when the Shutdown pin is
used for pulse-by-pulse current limiting.
Full double-pulse suppression logic
The SG1524B is specified for operation over the full military
High Reliability Features -
ambient temperature range of -55°C to 125°C.
The
SG2524B is characterized for the industrial range of -25°C
to 85C, and the SG3524B is designed for the commercial
range of 0°C to 70°C.
SG1524B
. Available to MIL-STD-883, ¶1.2.1
. MSC-AMS level "S" Processing Available
.
Available to DSCC
– Standard Microcircuit Drawing (SMD)
Block Diagram
VREF
Reference
Regulator
Undervoltage
Lockout
+VIN
Ground
OSC
To Internal
Circuitry
RT
CT
Oscillator
Collector A
Emitter A
Q
_
S
T
_
Q
Q
R
-
Collector B
S
Inverting
-
Memory
F/F
Toggle
F/F
Q
_
Q
P.W.M.
+
D
Error
Non-Inverting
+
+VIN
PWM
Latch
Emitter B
+C.L. Sense
-C.L. Sense
+
C.L.
-
Compensation
Shutdown
Figure 5 · Block Diagram
December 2014 Rev. 1.4
www.microsemi.com
1
© 2014 Microsemi Corporation- Analog Mixed Signal Group
Current Mode PWM Controller
Connection Diagrams and Ordering Information
Ambient
Temperature
Packaging
Type
Type
Package
Part Number
Connection Diagram
INV. Input
N.I. Input
16
V
REF
1
2
3
4
5
6
7
8
SG1524BJ
+VIN
EB
CB
15
14
13
12
11
10
9
OSC. Output
+C.L. Sense
-C.L. Sense
RT
16-PIN
Ceramic Dual
Inline Package
55°C to
125°C
J
CERDIP
SG1524BJ-883B
SG1524BJ-DESC
CA
EA
CT
Shutdown
Compensation
Ground
-25°C to 85°C
0°C to 70°C
SG2524BN
SG3524BN
16-PIN Dual
Inline Plastic
Package
N Package: RoHS Compliant / Pb-
free Transition DC: 0503
N Package: RoHS / Pb-free 100%
Matte Tin Lead Finish
N
PDIP
INV. Input
N.I. Input
16
1
2
3
4
5
6
7
8
V
REF
15
14
13
12
11
10
9
+VIN
EB
CB
OSC. Output
+C.L. Sense
-C.L. Sense
RT
-25°C to 85°C
SG2524BDW
SG3524BDW
CA
EA
CT
Shutdown
Compensation
16-PIN Small
Outline Wide
Body Package
Ground
DW
SOWB
DW Package: RoHS Compliant / Pb-
free Transition DC: 0516
DW Package: RoHS / Pb-free 100%
Matte Tin Lead Finish
0°C to 70°C
3
2
1
20 19
1. N.C.
2. INV. Input
3. N.I. Input
11. N.C.
12. Comp
13. Shutdown
14. E A
15. CA
16. N.C.
17. CB
SG1524BL-883B
SG1524BL
4
18
4. OSC. Output
5. +C.L. Sense
6. N.C.
7. -C.L. Sense
8. RT
20-Pin
Ceramic
Leadless Chip
Carrier
5
6
7
8
17
16
15
14
-55°C to
125°C
L
CLCC
18. EB
19. +V
20. VREF
9. CT
10. Ground
IN
11
13
12
9
10
Note:
1. Contact factory for DESC product availability.
2. All packages are viewed from the top.
3. Hermetic Packages J, & L use Sn63/ Pb37 hot solder lead finish, contact factory for availability of RoHS versions
4. Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. SG3524BDW-TR)
2
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Value
Units
V
42
60
Input Voltage, (+V )
IN
V
Collector Voltage
-0.3 to 5.5
-0.3 to VIN
200
V
Logic Inputs
V
Current Limit Sense Inputs
Output Current (Each transistor)
Reference Load Current
mA
mA
mA
50
5
Oscillator Charging Current
Operating Junction Temperature
Hermetic (J, L Packages)
Plastic (N, DW Packages)
Storage Temperature Range
Lead Temperature (Soldering, 10 seconds)
150
150
°C
°C
°C
°C
°C
-65 to 150
300
260 (+0, -5)
RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.)
Note: 1. Values beyond which damage may occur
Thermal Data
Parameter
Value
Units
J Package
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
30
80
°C/W
°C/W
N Package
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
°C/W
°C/W
40
65
DW Package
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
40
95
°C/W
°C/W
L Package
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
°C/W
°C/W
35
120
Note:
1. Junction Temperature Calculation: TJ = TA + (PD x θJA).
2. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting
configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of
the above assume no ambient airflow.
3
Current Mode PWM Controller
Recommended Operating Conditions1
Value
7 to 40
Units
V
Parameter
Input Voltage (+VIN)
0 to 60
V
Collector Voltage
2.3 to VREF
0 to VIN - 2.5V
0 to 100
V
Error Amp Common Mode Range
Current Limit Sense Common Mode Range
Output Current (Each transistor)
Reference Load Current
V
mA
0 to 20
mA
25 to 1.8
100 to 400
2 to 150
µA / mA
Hz / kHz
kΩ
Oscillator Charging Current
Oscillator Frequency Range
Oscillator Timing Resistor (RT)
Oscillator Timing Capacitor (CT)
Operating Ambient Temperature Range
SG1524B
1 to 0.1
nF / µF
-55 to 125
-25 to 85
0 to 70
°C
°C
°C
SG2524B
SG3524B
Note: 1. Range over which the device is functional.
Electrical Characteristics
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for
SG1524B with -55°C ≤ TA ≤ 125°C, SG2524B with -25°C ≤ TA ≤ 85°C, SG3524B with 0°C ≤ TA ≤ 70°C, and
+VIN = 20V. Low duty cycle pulse testing techniques are used that maintains junction and case temperatures
equal to the ambient temperature.)
SG1524B/2524B
SG3524B
Test Conditions
Parameter
Units
Min.
Typ.
Max
Min.
Typ.
Max
Reference Section1
Output Voltage
T
J
= 25°C
IN = 7V to 40V
= 0 to 20mA
4.95
5.00
3
5.05
20
4.90
5.00
3
5.10
30
V
V
Line Regulation
Load Regulation
mV
mV
I
L
5
30
5
50
Over Operating
Temperature Range
Temperature Stability5
15
50
15
50
mV
Over Line, Load and
Temperature
Total Output Voltage
Range
4.90
25
5.10
120
4.80
25
5.20
120
V
VREF = 0V
Short Circuit Current
50
50
mA
Undervoltage Lockout Section
Threshold Voltage
4.3
4.5
4.7
4.2
4.5
4.9
V
Notes:
1.
IL = 0mA
2. FOSC = 45 kHz (RT = 2700 Ω, CT = .01µF)
3. VCM = 2.3V to VREF
4. VCM = 0V to 17.5V
5. These parameters, although guaranteed over the recommended operating conditions, are not tested in production.
4
Electrical Characteristics (continued)
Electrical Characteristics (continued)
SG1524B/2524B
SG3524B
Parameter
Test Conditions
Units
Min.
Typ.
Max
Min.
Typ.
Max
Oscillator Section2
Initial Accuracy
T
J
= 25°C
42
45
0.1
1
48
1
40
45
0.1
1
50
1
kHz
%
V
IN = 7V to 40V
Voltage Stability
Temperature Stability5
Minimum Frequency5
Maximum Frequency
Sawtooth Peak Voltage
Sawtooth Valley Voltage
Clock Amplitude
2
2
%
Over Operating Range
RT = 150kΩ, CT = 0.1μF
50
600
3.5
1
140
50
600
3.5
1
120
Hz
kHz
V
R
T
= 2 kΩ, C = 470pF
T
400
400
V
IN = 40V
IN = 7V
3.9
1.2
3.9
1.2
V
0.6
3.0
0.2
0.6
3.0
0.2
V
4.0
0.5
4.0
0.5
V
Clock Pulse Width
μs
Error Amplifier Section3
Input Offset Voltage
Input Bias Current
R
S
≤2kΩ
0.5
1
5
5
1
2
1
10
10
1
mV
μA
μA
dB
Input Offset Current
DC Open Loop Gain
RL
≥ 10MΩ
60
78
60
78
ISINK = 100μA;
Output Low Level
Output High Level
0.2
0.5
0.2
0.5
V
VPIN 1 - VPIN 2 ≥ 150mV
ISOURCE = 100μA;
3.8
70
76
1
4.2
90
100
2
3.8
70
76
1
4.2
90
100
2
V
dB
VPIN 2 - VPIN 1 ≥ 150mV
Common Mode
Rejection
V
CM = 2.3V to VREF
IN = 7V to 40V
Supply Voltage
Rejection
V
dB
Gain-Bandwidth
Product5
TJ
= 25°C
MHz
P.W.M. Comparator2
Minimum Duty Cycle
Maximum Duty Cycle
V
COMP = 0.5V
COMP = 3.9V
0
0
%
%
V
45
49
45
49
Current Limit Amplifier Section4
Sense Voltage
180
200
-3
220
-10
170
200
-3
230
-10
mV
Input Bias Current
μA
Notes:
1.
IL = 0mA
2. FOSC = 45kHz (RT = 2700 Ω, CT = .01µF)
3. VCM = 2.3V to VREF
4. VCM = 0V to 17.5V
5. These parameters, although guaranteed over the recommended operating conditions, are not tested in production.
5
SG1524B/2524B
SG3524B
Parameter
Test Conditions
Units
Min.
Typ.
Max
Min.
Typ.
Max
Shutdown Input Section
HIGH Input Voltage
HIGH Input Current
LOW Input Voltage
2.0
2.0
V
mA
V
VSHUTDOWN = 5V
0.1
1
0.1
1
0.6
0.6
Output Section (Each transistor)
Collector Leakage
Current
VCE = 60V
50
50
μA
IC = 10mA
0.2
1.0
0.4
2.0
0.2
1.0
0.4
2.0
V
V
Collector Saturation
Voltage
IC = 100mA
IE = 10mA
17.5
17
19
18
17.5
17
19
18
V
V
Emitter Output Voltage
IE = 100mA
Emitter Voltage Rise
Time5
RE = 2kΩ, TA = 25°C
0.2
0.1
0.5
0.2
0.2
0.1
0.5
0.2
μs
μs
Collector Voltage Fall
Time
RC = 2kΩ, TA = 25°C
Power Consumption
VIN = 40V,
Standby Current
5
12
5
12
mA
VSHUTDOWN = 2.0 V
Notes:
1. I = 0mA
L
2. FOSC = 45kHz (RT = 2700Ω, CT = .01µF)
3. VCM = 2.3V to VREF
4. VCM = 0V to 17.5V
5. These parameters, although guaranteed over the recommended operating conditions, are not tested in production.
Characteristic Curves
Characteristic Curves
1000000
5
4
3
2
100000
1nF
3nF
10000
10nF
0.1uF
1000
1
0
1uF
100
1000
40
10
60
20
0
70
80
90
100
30
50
1000000
10000
100000
RT(Ohm)
CT(nF)
Figure 2 · Oscillator Frequency vs. Timing Resistor and
Capacitor VIN = 20V, TA = 25°C
Figure 3 · SG1524B Dead Times vs. Timing
Capacitance (RT = 2.7kΩ) VIN = 20V, TA = 25°C
60
RF = 1M
50
RF = 300kΩ
40
RF = 100kΩ
30
20
10
0
100
1000
100000
10000
1000000
Frequency (Hz)
Figure 4 · SG1524B Error Amp Voltage Gain vs. Freq
Over RF ; VIN = 20V, TA = 25°C
7
Package Outline Dimensions
Controlling dimensions are in inches, metric equivalents are shown for general information.
MILLIMETERS
INCHES
MIN
Dim
MIN
1.35
0.10
1.25
0.33
0.19
9.78
5.79
MAX
1.75
0.25
1.52
0.51
0.25
10.01
6.20
MAX
0.069
0.010
0.060
0.020
0.010
0.394
0.244
A
A1
A2
b
0.053
0.004
0.049
0.013
0.007
0.385
0.228
D
18
10
c
D
H
E
E
1
9
e
1.27 BSC
0.050 BSC
H
3.81
0.40
0
4.01
1.27
8
0.150
0.016
0
0.158
0.050
8
e
L
B
L
Θ
A
A2
A1
c
*LC
0.10
0.004
Seating Plane
*Lead coplanarity
Note:
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension
shall not include solder coverage.
Figure 5 · DW 16-Pin SOWB Package Dimensions
MILLIMETERS
INCHES
MAX
Dim
D
MIN
-
MAX
5.08
0.51
MIN
-
A
A1
A2
b
0.200
0.040
9
8
16
0.38
0.015
E1
3.30 Typ.
0.130 Typ.
1
0.38
0.76
0.51
1.52
0.015
0.030
0.008
0.730
0.020
0.060
0.015
0.810
E
b2
A2
b2
c
0.20
0.38
A
L
D
18.54
20.57
e
2.54 BSC
0.100 BSC
A1
H
E1
E
6.10
6.60
15°
0.240
0.260
θ
b
e
7.62 BSC
0.300 BSC
Figure 6 ·
L
3.05
-
0.120
-
θ
15°
Note:
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension
shall not include solder coverage.
Figure 6 · N 16-Pin Plastic Dual Inline Package Dimensions
Package Outline Dimensions
Package Outline Dimensions
MILLIMETERS
INCHES
MAX
Dim
MIN
MAX
5.08
0.51
1.65
0.38
19.94
7.11
MIN
A
b
0.200
0.020
0.065
0.015
0.785
0.280
0.38
1.04
0.20
19.30
5.59
0.015
0.045
0.008
0.760
0.220
D
b2
c
9
8
16
E
D
E
1
eA
b2
e
2.54 BSC
0.100 BSC
eA
H
L
7.37
0.63
3.18
-
7.87
1.78
5.08
15°
0.290
0.025
0.125
-
0.310
0.070
0.200
15°
Q
A
Seating Plane
L
α
θ
H
b
e
Q
0.51
1.02
0.020
0.040
Note:
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension
shall not include solder coverage.
Figure 7 · J 16-Pin Ceramic Dual Inline Package Dimensions
E3
D
MILLIMETERS
INCHES
Dim
MIN
8.64
-
MAX
9.14
MIN
MAX
0.360
0.320
D/E
E3
e
0.340
-
8.128
E
1.270 BSC
0.635 TYP
0.050 BSC
0.025 TYP
B1
L
1.02
1.52
0.040
0.060
0.090
A
1.626
2.286
0.064
A
L2
L
h
1.016 TYP
0.040 TYP
8
A1
A1
A2
L2
B3
1.372
-
1.68
1.168
2.41
0.054
-
0.066
0.046
0.95
3
1
1.91
0.075
0.203R
0.008R
Note:
All exposed metalized area shall be gold plated 60
micro-inch minimum thickness over nickel plated
unless otherwise specified in purchase order.
13
h
18
A2
B3
e
B1
Figure 8 · L 20-Pin Ceramic Leadless Chip Carrier (LCC) Package Outline Dimensions
9
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor
and system solutions for communications, defense & security, aerospace and industrial
markets. Products include high-performance and radiation-hardened analog mixed-signal
integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and
synchronization devices and precise time solutions, setting the world’s standard for time; voice
processing devices; RF solutions; discrete components; security technologies and scalable
anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design
capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has
approximately 3,400 employees globally. Learn more at www.microsemi.com.
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo,
CA 92656 USA
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or
the suitability of its products and services for any particular purpose, nor does Microsemi assume any
liability whatsoever arising out of the application or use of any product or circuit. The products sold
hereunder and any other products sold by Microsemi have been subject to limited testing and should not
be used in conjunction with mission-critical equipment or applications. Any performance specifications are
believed to be reliable but are not verified, and Buyer must conduct and complete all performance and
other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not
rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s
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©
2014 Microsemi Corporation. All
rights reserved. Microsemi and the
Microsemi logo are trademarks of
Microsemi Corporation. All other
trademarks and service marks are the
property of their respective owners.
SG1524B-1.4/12.14
相关型号：
SG2524CD
Switching Regulator/Controller, Voltage-mode, 0.2A, 400kHz Switching Freq-Max, BIPolar, PDSO16,
PHILIPS
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