SL1935D/KG/NP4P [MICROSEMI]
Consumer Circuit, PDSO36, 7.50 MM, LEAD FREE, SSOP-36;型号: | SL1935D/KG/NP4P |
厂家: | Microsemi |
描述: | Consumer Circuit, PDSO36, 7.50 MM, LEAD FREE, SSOP-36 光电二极管 商用集成电路 |
文件: | 总23页 (文件大小:620K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SL1935
Single Chip Synthesized Zero IF Tuner
February 2005
Features
Ordering Information
SP1935D/KG/NP3Q
SL1935D/KG/NP2Q
SL1935D/KG/NP1P
SL1935C/KG/NP1P
SL1935D/KG/NP3P
SL1935D/KG/NP4P
SL1935C/KG/NP1Q
SL1935D/KG/NP2P
SL1935D/KG/NP1Q
SL1935D/KG/NP4Q
36 Pin SSOP
36 Pin SSOP*
36 Pin SSOP
36 Pin SSOP
36 Pin SSOP
36 Pin SSOP*
36 Pin SSOP*
36 Pin SSOP*
36 Pin SSOP
36 Pin SSOP*
Tape & Reel
Tape & Reel
Tubes
•
•
•
•
•
•
Singlechipsynthesisedtunersolutionforquadrature
down conversion, L-band to Zero IF.
DVB compliant, operating dynamic range -70 to
-20dBm.
Compatible with DSS and DVB variable symbol rate
applications.
Tubes
Tubes
Tape & Reel
Tape & Reel
Tubes
Tape & Reel
Tape & Reel
Selectable baseband path, programmable through
2
*Pb Free Matte Tin
I C bus.
Excellent quadrature balance up to 30MHz
baseband
Excellent immunity to spurious second harmonic
(RF and LO) mixing effects.
Description
2
•
•
Low oscillator phase noise and reradiation.
High output referred linearity for low distortion and
multi channel application.
The SL1935 is a complete single chip
bus controlled
I C
Zero IF tuner and operates from 950 to 2150MHz. It
includes an on-board low phase noise PLL frequency
synthesiser and low noise LNA/AGC. The SL1935 is
intendedprimarilyforapplicationindigitalsatellite Network
Interface Modules and performs the complete tuner
function.
2
•
Integral fast mode compliant I C bus controlled PLL
frequencysynthesiser, designedforhighcomparison
frequencies and low phase noise performance.
Buffered crystal output for clocking QPSK
demodulator.
•
•
ESD protection (Normal ESD handling procedures
should be observed).
Applications
•
•
Satellite receiver systems.
Data communications systems.
1
36
XTALC AP
P UMP
DR IVE
P ORT P 0
VE E
XTAL
S DA
S C L
BUFR E F
VC C D
VC C
TANKS
TANKS B
VE E
R F
TANKV
TANKVB
VE E
R FB
VC C
IFIA
IFQA
IFIB
IFQB
VC C
VC C
OFIA
OFIB
VE E
OFQA
OFQB
VE E
IOUT
ADD
QOUT
AG C C ONT
18
19
Figure1. Pin connections
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003 - 2005, Zarlink Semiconductor Inc. All Rights Reserved.
SL1935
The device contains all elements necessary, with the
exception of local oscillator tuning network and crystal
reference, to produce a high performance I(n-phase) &
Q(uadrature) downconversion tuner function. Due to the
high signal handling design the device does not require
any front end tracking filters.
The S L1935 includes selectable baseband signal paths,
allowing application with two externally definable filter
bandwidths, facilitating application in variable symbol
rate and simulcast systems. The S L1935 is optimised to
interface with the VP 310 (ADC /QP S K/FE C ) S atellite
C hannel Decoder, available from Zarlink S emiconductor
and offers a full front end solution.
RF
RFB
AGCCONT
19
8
9
23 OFQA
22 OFQB
26 IFQA
25 IFQB
20 QOUT
RF Section
VCC
RF section
AGC
Sender
7,10,13,24
VCCD
6
VEE
16,21,27,30,33
PLL section
BS
90deg
17 IOUT
11 IFIA
TANKV 29
TANKVB 28
Frequency
Agile
VCOV
Phase
12 IFIB
Splitter
TANKS 32
TANKSB 31
Divide
by 2
0deg
14 OFIA
15 OFIB
VCOS
36 PUMP
35 DRIVE
Fpd
15 bit
Charge
Pump
Programmable
Divider
PLL Section
VS
BS
SDA 3
SCL 4
I2C Bus Interface
34 PORT P0
5 BUFREF
ADD 18
Fpd/2
REF
OSC
XTAL 2
XTALCAP 1
Reference
Divider
Fcomp
Figure 2. Block diagram
2
SL1935
Table 1. QuickReferenceData
Characteristic
Value
Units
MHz
dBm
dB
950 to 2150
-75 to -15
10
Operating range
Input dynamic range
VSWR with input match
Input NF
dB
dB
dBm
dBm
dBm
V
dB
deg
dB
10
15
+5
+20
-5
2.0
0.2
0.7
1
@ -70dBm operating sensitivity
@ -60dBm operating sensitivity
IPIP3 @ -20dBm operating sensitivity
IPIP2@ -20dBm operating sensitivity
IPP1dB@ -20dBm operating sensitivity
Baseband output limit voltage
Gain match up to 22MHz
Phase match up to 22MHz
Gain flatness up to 30MHz
Local oscillator phase noise
SSB at 10kHz offset
In band LO reradiation from RF input
LO second harmonic interference level at input level of
-20dBm per carrier
dBc/Hz
dBm
dBc
-80
<-70
-55
dBc
-35
LNA second harmonic interference level at input level
of -25dBm per carrier
MHz
dBc/Hz
4
-152
PLL maximum comparison frequency
PLL phase noise at phase detector
Note: `6dB interstage filter loss assumed in external base band paths.
dBm assumes 75Ω characteristic impedance.
`
Quadrature Downconverter Section
FunctionalDescription
In normal application the tuner IF frequency of typically
950 to 2150MHz is fed direct to the SL1935 RF input
through an appropriate impedance match (Fig.16) and
LNB switching. The input stage is optimised for both NF
and signal handling.
General
The SL1935 is a complete wideband direct conversion
tuner incorporating an on board frequency synthesiser
andLNA/AGC, optimisedforapplicationindigitalsatellite
receiver systems. The device offers a highly integrated
2
The signal handling of the front end is designed to offer
immunity to input composite overload without the
requirement of a tracking filter. RF input impedance is
shown in Fig.3.
solutiontoasatellitetunerfunction, incorporatinganI C
businterfacecontroller, alowphasenoisePLLfrequency
synthesiser and all tuner analogue functionality. The
analogue blocks include the reference oscillator,
consistingoftwoindependentoscillators,aphasesplitter,
RF preamplifier with AGC facility, channel mixers and
baseband amplifiers incorporating two selectable
baseband paths, allowing for two externally definable
bandwidths. In this application two varactor tuned tanks,
a reference crystal and baseband filtering components
are required to complete the tuner system.
The RF input amplifier feeds an AGC stage and provides
system gain control. The system AGC gain range will
guarantee anoperating dynamicrange of-70to-20dBm.
TheAGCiscontrolledbytheAGCsenderandisoptimised
for S/N and S/I performance across the full dynamic
range. Details of the AGC characteristics, variations in
IIP3, IIP2, P1dB and NF are illustrated in Figs.4, 5, 6, 7,
and 8 respectively.
A buffered crystal frequency output is available to clock
the QPSK demodulator and powers up in the active
state.
The required I and Q local oscillator frequencies for
quadrature downconversion are generated by the on-
board reference oscillators designated ‘VCOS’ and
‘VCOV’. VCOSoperatesnominallyfrom1900to3000MHz
and is then divided by two to provide 950 to 1500MHz.
VCOV operates nominally from 1400 to 2200MHz. Only
2
TheI C businterfacecontrolsthefrequencysynthesiser,
the local oscillator, the baseband path selection, the
buffered reference frequency output and an external
switching port.
2
the oscillator selected via bit VS in the I C data
transmission is powered.
Figure 2 shows the device block diagram and pin
allocations are shown in Figure 1.
3
SL1935
Quadrature DownconverterSection - continued
The oscillators share a common varactor line drive and
both require an external varactor tuned resonator
optimised for low phase noise performance. The
recommended application circuit for the local oscillators
is detailed in Fig.9 and the typical phase noise
performance is detailed in Fig.10. The local oscillator
frequency is coupled internally to the PLL frequency
synthesiser programmable divider input.
The output of the phase detector feeds a charge pump
and a loop amplifier. When used with an external loop
filterandahighvoltage transistoritintegrates thecurrent
pulses into the varactor line voltage used to control the
selected oscillator.
The programmable divider output Fpd divided by two
and the reference divider output Fcomp are switched to
port P0 by programming the device into test mode. Test
modes are detailed in Table 4.
The mixer outputs are coupled to the baseband buffer
amplifiers, providing for one of two selectable baseband
outputs in each channel. The required output is selected
The crystal reference frequency can be switched to the
BUFREF output by bit RE as detailed in Table 7.
2
by bit BS in the I C bus transmission (Table 6). These
outputs are fed off chip via ports ‘OPIA’ and ‘OPIB’
(‘OPQA’ and ‘OPQB’), then back on chip through ports
‘IPIA’ and ‘IPIB’ (‘IPQA’ and ‘IPQB’), allowing for the
insertion of two independent user definable filter
bandwidths. Each output provides a low impedance
drive(Fig.11) andeachinputprovides ahighimpedance
load . An example filter for 30MS/s is detailed in Fig.13.
Both path gains are nominally equal. NB 6dB insertion
loss is assumed in each channel, however a different pot
down ratio may be applied.
Programming
2
The SL1935 is controlled by an I C data bus and is
compatible with both standard and fast mode formats.
Data and Clock are fed on the SDA and SCL lines
2
respectively as defined by the I C bus format. The
device can either accept data (write mode) or send data
(readmode). TheLSBoftheaddressbyte (R/W)setsthe
device into write mode if it is low and read mode if it is
high. Tables 9a and 9b detail the format of the data. The
SL1935 may be programmed to respond to several
addresses and enables the use of more than one device
Each baseband path is then multiplexed to the final
baseband amplifier stage, providing further gain and a
low impedance output drive. The nominal output load
test condition is detailed in Fig.14.
2
in an I C bus system. Table 9c details the how the
address is selected by applying a voltage to the ‘ADD’
input. When the device receives a valid address byte, it
pulls the SDA line low during the acknowledge period
and during following acknowledge periods after further
data bytes are received. When the device is
programmed into read mode, the controller accepting
the data must pull the SDA line low during all status byte
acknowledge periods to read another status byte. If the
controller fails to pull the SDA line low during this period,
the device generates an internal‘STOP’ condition which
inhibits further reading.
PLL Frequency Synthesiser Section
The PLL frequency synthesiser section contains all the
elements necessary, with the exception of a reference
frequency source and a loop filter to control the selected
oscillator to produce a complete PLL frequency
synthesised source. The device, produced using high
speed logic, allows for operation with a high comparison
frequency and enables the generation of a loop with
excellent phase noise performance.
Write mode
14
0
TheLOsignalfromtheselectedoscillatordrivesfromthe
phasesplitterintoaninternalpreamplifier, providinggain
andreverse isolationfromthedividersignals. Theoutput
of the preamplifier interfaces directly with the 15-bit fully
programmable divider. The programmable divider has
MN+Aarchitecture, thedualmodulusprescaleris16/17,
the A counter is 4-bits and the M counter is 11-bits.
Bytes2and3containfrequencyinformationbits2 to2
inclusive (Table 9). Byte 4 controls the synthesiser
reference divider ratio (Table 3) and the charge pump
setting (Table 5). Byte 5 controls test modes (Table 4),
baseband filter path select BS (Table 6), local oscillator
select VS (Table 8), buffered crystal reference output
select RE (Table 7) and the output port P0.
After reception and acknowledgment of a correct
address (byte 1), the first bit of the following byte
determines whether the byte is interpreted as byte 2 or
4, alogic‘0’ indicatesbyte 2andalogic‘1’indicatesbyte
4. Having interpreted this byte as either byte 2 or 4, the
following byte will be interpreted as byte 3 or 5
respectively. After receiving two complete data bytes,
additional data bytes may be entered and byte
interpretation follows the same procedure without re-
addressing the device. The procedure continues until a
The output of the programmable divider is fed to the
phase comparator and compared in both phase and
frequency domains to the comparison frequency. This
frequency is derived from either the on board crystal
controlledoscillatororfromanexternalreferencesource.
In both cases the reference frequency is divided down to
the comparison frequency by the reference divider,
programmable into 1 of 29 ratios and detailed in Table 3.
The typical application for the crystal oscillator is shown
in Fig.15.
condition is received.
‘STOP’
4
SL1935
Bit1(POR)isthepower-on resetindicator, andthisisset
The STOP condition can be generated after any data
byte, if however it occurs during a byte transmission, the
previous byte data is retained. To facilitate smooth fine
tuning, the frequency data bytes are only accepted by
the device after all 15 bits of frequency data have been
received, or after the generation of a STOP condition.
to a logic ‘1’ if the Vccd supply to the device has dropped
o
below3V(at25 C),e.g. whenthedevice isinitiallyturned
ON. The POR is reset to ‘0’ when the read sequence is
terminatedby a STOP command. When POR is set high
this indicates that the programmed information may
have been corrupted and the device reset to the power
up condition.
Read mode
Bit 2 (FL) indicates whether the synthesiser is phase
locked, a logic ‘1’ is present if the device is locked, and
a logic ‘0’ if the device is unlocked.
When the device is in read mode, the status byte read
from the device takes the form shown in Table 9b.
Table 2. Programmable Features
Programmable features
Function
Function as described above
Function as described above.
Function as described above.
Synthesiser programmable divider
Reference programmable divider
Baseband filter path select
Local oscillator select
Function as described above.
The charge pump current can be programmed by bits C1 & C0 (Table 5).
The test modes are defined by bits T2 - T0 as described in Table 4.
The general purpose port can be programmed by bit P0;
Logic ‘1’ = on
Charge pump current
Test mode
General purpose port, P0
Logic ‘0’ = off (high impedance)
The buffered crystal reference frequency can be switched to the BUFREF
output by bit RE as described in Table 7. The BUFREF output defaults to
the ‘ON’ condition at device power up.
Buffered crystal reference output,
BUFREF
o
The typical key performance data at Vcc = 5V and +25 C ambient are detailed in Table 1.
Table 3. Reference division ratios
R2
R1
R0
Ratio
R4
R3
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
4
8
16
32
64
128
256
Illegal state
5
10
20
40
80
160
320
Illegal state
6
12
24
48
96
192
384
Illegal state
7
14
28
56
112
224
448
5
SL1935
Table 4. Test modes
T0
0
Test mode description
Normal operation
T2
0
T1
0
1
0
1
0
Charge pump sink* (status byte FL set to logic '0')
Charge pump source* (status byte FL set to logic '0')
Charge pump disabled* (status byte FL set to logic '1')
Normal operation and port P0 = Fpd/2
0
0
0
1
0
1
1
0
1
0
1
Charge pump sink* (status byte FL set to logic '0'. Port P0 = Fcomp)
Charge pump source* (status byte FL set to logic '0'. Port P0 = Fcomp)
Charge pump disabled* (status byte FL set to logic '1'. Port P0 = Fcomp)
1
1
1
0
1
1
Note: * Clocks need to be present on crystal and RF inputs to enable charge pump test modes and to
toggle status byte bit FL.
Table 5. Charge pump current
Current in µA
C1
C0
min
typ
max
+-194
+-412
+-862
+-116
+-247
+-517
+-155
+-330
+-690
0
0
1
1
0
1
0
1
+-1087 +-1450 +-1812
Table 6. Baseband path select
Path Selected
I Channel Q Channel
Baseband Filter drive Baseband
BS
Filter drive
output
amp input output amp input
IFIB
IFIA
OFQB
OFQA
IFQB
IFQA
0
1
OFIB
OFIA
Table 7. Buffered crystal
reference output select
RE
0
1
BUFREF output
Disabled, high impedance
Enabled
Table 8. Local oscillator select
VS
0
Local oscillator selected
VCOV
1
VCOS
6
SL1935
Table 9a. Write data format (MSB is transmitted first)
MSB
LSB
Address
1
0
1
2
0
2
0
2
0
2
MA1
2
MA0
2
A
A
Byte 1
Byte 2
0
2
14
13
12
11
10
9
8
Programmable
divider
7
6
5
4
3
2
1
0
Programmable
divider
2
2
2
2
2
2
2
A
Byte 3
2
Control data
Control data
1
T2
C1
T1
C0
T0
R4
VS
R3
BS
R2
0
R1
RE
A
A
Byte 4
Byte 5
R0
P0
Table 9b. Read data format (MSB is transmitted first)
MSB
LSB
Address
Status Byte
1
POR
1
FL
0
0
0
0
MA1
0
MA0
0
A
A
Byte 1
Byte 2
1
0
0
0
Table 9c. Address selection
Address input voltage level
0 - 0.1 Vcc
MA1
MA0
0
0
1
1
0
1
0
1
Open circuit
0.4 Vcc - 0.6 Vcc*
0.9 Vcc - Vcc
Note:
Programmed by connecting a 30kΩ resistor between pin and Vcc
*
Key to Tables 9a to 9c
A .........................................Acknowledge bit
MA1, MA0 ........................... Variable address bits (Table 9c)
214 to 20................................ Programmable division ratio control bits
C1 to C0 .............................. Charge pump current select (Table 5)
R4 to R0 .............................. Reference division ratio select (Table 3)
T2 to T0 .............................. Test modes control bits (Table 4)
BS .......................................Baseband path select (Table 6)
VS .......................................Local oscillator select (Table 8)
RE .......................................Buffered crystal reference output enable (Table 7)
P0 .......................................P0 port output state
POR .................................... Power on reset indicator
FL........................................Phase lock flag
+j1
+j2
+j0.5
+j0.2
0
+j5
Marker Freq (MHz)
Z real Ω Z imag Ω
1
2
3
4
950
64
40
32
23
-100
-75
-65
-45
1400
1600
2150
0.2
0.5
2
1
5
X
—j5
—j0.2
X
X
4
1
X
2
X
3
—j2
—j0.5
START 950MHz
Normalised to 75Ω
—j1
STOP 2150MHz
Figure 3. RF input impedance (typical)
7
SL1935
90
80
70
70dB minimum, AGC < 0.75V
60
50
40
30
20
10
0
20dB maximum, AGC > 4.25V
0
0.5
1
1.5
2
2.5
AGCCONT Voltage (V)
3
3.5
4
4.5
5
Figure 4. AGC characteristic (typical)
120
110
100
90
80
70
60
20
25
30
35
40
45
50
55
60
65
70
System gain (dB) assuming 6dB interstage filter loss
Figure 5. Variation in IIP3 with system gain (typical)
170
160
150
140
130
120
110
100
Baseband dominated IP2
LNA dominated IP2
20
25
30
35 55
System gain (dB) assuming 6dB interstage filter loss
40
45
50
60
65
70
Figure 6. Variation in IIP2 with system gain (typical)
8
SL1935
110
105
100
95
90
85
80
75
70
65
60
-10
10 25
Converter gain seting (dB) from RF inputs OFIA/OFQA or OFIB/OFQB outputs
-5
0
5
15
20
30
35
40
45
Figure 7. Variation in P1dB with converter gain (typical)
60
50
40
30
20
10
0
20
25
30
35
40
45
50
55
60
System gain (dB) assuming 6dB interstage filter loss
65
70
75
80
Figure 8. Variation in NF with system gain (typical)
BB837
4mm STRIPLINE
6
7
9
Tanks
1kΩ
"vcos"
2kΩ
BB837
4mm STRIPLINE
10mm STRIPLINE
Tanksb
Vcnt
BB831
BB831
Tankv
"vcov"
2kΩ
10mm STRIPLINE
NOTE:
Stripline width = 0.44mm
(dimensions are approximate)
1kΩ
10
Tankvb
Figure 9. Local oscillator application circuit
9
SL1935
LO Frequency (MHz)
1500 1600
900
-70
1000
1100
1200
1300
1400
1700
1800
1900
2000
2100
-72
-74
-76
-78
-80
-82
-84
-86
-88
-90
vcos enabled
cov enabled
Conditions:
Loop filter as per standard application shown in Figure 21
Charge pump = 130uA
Fcomp = 65.5kHz or 125kHz
Figure 10. Local oscillator phase noise variation with frequency (typical)
+j1
+j0.5
+j2
4
3
x
x
+j0.2
0
+j5
2
x
Marker Freq (MHz)
Z real Ω
Z imag Ω
1
2
3
4
1
17
18
22
33
0
1
2
5
x0.5
0.2
1
10
20
30
19
38
60
—j5
—j0.2
—j2
—j0.5
STOP 30MHz
START 1MHz
Normalised to 50Ω
—j1
Figure 11. Converter output impedance; OFIA, OFIB, OFQA, OFQB (typical)
+j1
+j0.5
+j2
+j0.2
0
+j5
Freq (MHz)
Z real Ω
9.5
10.0
10.6
12.6
Z imag Ω
Marker
X
4
1
2
3
4
0.1
10
20
30
-2.0
1.3
3.3
5.5
X
2
5
0.2
3
0.5
1
X
2
X
X
1
—j5
—j0.2
—j2
—j0.5
START 100kHz
Normalised to 50Ω
STOP 30MHz
—j1
Figure 12. Baseband output impedance; IOUT, QOUT (typical)
10
SL1935
100nF
3.9pF
100nF
1k Ω
OFIA/OFIB
OFQA/OFQB
IFIA/IFIB
IFQA/IFQB
1k Ω
Figure 13. Example baseband interstage filter for 30MS/s
220nF
100 Ω
15pF
1k Ω
Figure 14. Nominal baseband output load test condition
1 XTALCAP
150pF
2 XTAL
82pF
4MHz
Figure 15. Crystal oscillator application (typical)
11
SL1935
1pF
100pF
100pF
33Ω
8
9
RF
RFIN
RFB
2.2pF
Figure 16. Input matching network
Table 10. ElectricalCharacteristics
o
o
Test conditions (unless otherwise stated); Tamb = -20 to +80 C, Vee= 0V, Vcc =Vccd = 5V+-5%.
These characteristics are guaranteed by either production test or design. They apply within the specified ambient
temperature and supply voltage unless otherwise stated.
Value
Conditions
Units
Pin
Characteristic
Supply current
Typ
Min
Max
mA
6,7,10
13,24
8,9
130
175
VCCD (PLL) and VCC
RF input operating frequency
MHz
950
2150
SYSTEM
All system specification items should
be read in conjunction with Note 2
At -70dBm operating sensitivity
At -60dBm operating sensitivity
Above –60dBm operating sensitivity,
(Fig.7)
System noise figure DSB
dB
dB
dB/dB
10
15
12
17
-1
Variation in system NF with gain
adjust
System input referred IP2
dBµV
dBµV
121
112
140
At –20dBm operating sensitivity, see
Notes 3 and 4
(Fig.6)
Variation in system input referred
IP2 with operating sensitivity
System input referred IP3
At -20dBm operating sensitivity,
see Note 5
Variation in system input referred
IP3 with operating sensitivity
(Fig.5)
Continued
12
SL1935
(Continued)
Table 10. ElectricalCharacteristics
Value
Units
Conditions
Pin
Characteristic
Typ
Min
Max
System dynamic range
Note 6
AGCCONT = 0.75V
dBm
-70
-20
dBm AGCCONT = 4.25V
System gain roll off
System gain variation with
temperature
3
2
dB
dB
Within RF band 950-2150MHz
-20˚C to +80˚C
dB
deg
dB
System I Q gain match
System I Q phase balance
System I and Q channel in band 17,20
ripple
17,20
17,20
-1
-3
+1
+3
1
Interstage filter (Fig.13)
Interstage filter (Fig.13)
Interstage filter (Fig.13)
dB
dBc
System baseband path gain
match
LO second harmonic interference
level
LNA second harmonic
interference level
-1
+1
Note 8.
Note 9.
-50
-35
dBc
dBµV
Synthesiser and other spurii on I 17,20
and Q outputs
76
Within 0-100MHz band under all gain
settings, RF input set to deliver
108dBµV on output
Within RF band 950-2150MHz.
Note 11.
dBm
In band leakage to RF input
8,9
-60
75
CONVERTER
Ω
dB
dBµV
Converter input impedance
Converter input return loss
System input referred P1dB
8,9
8,9
8
102
With input matching (Fig.16)
Converter gain =-5dBm (to OFIA/
OPQA, OFIB/OPQB outputs. Fig.7)
0.1 to 30MHz (Fig.11)
Ω
Converteroutputimpedance,OFIA, 14,15
50
25
OFIB, OPQA and OPQB.
22,23
dBc
Converter output leakage to
unselected output, OFIA, OFIB,
OPQA and OPQB.
Relative to selected output
-26
MHz
Oscillator VCOS operating range 31,32 1900
3000
2150
Giving LO = 950 to 1500MHz
(Application as in Fig.9)
(Application as in Fig.9)
@10kHz offset, PLL loop bw < 1kHz
Applicationismeasuredatbaseband
output frequency of 10MHz (Fig.10).
MHz
dBc/Hz
Oscillator VCOV operating range 28,29 1450
Local oscillator SSB phase noise
-78
AGCONT input current
19
-150
150
µA
BASEBANDAMPLIFIERS
The baseband inputs must be
externally ac coupled
Baseband input impedance, IFIA, 11,12
0.1- 30MHz bandwidth
IFIB, IFQA And IFQB.
Resistance
Capacitance
25,26
kΩ
pF
10
5
dBc
Baseband unselected input 17,20
leakage to output
-40
Relative to selected input.
Ω
Baseband amplifier output 17,20
impedance
20
Vp-p
MHz
dB/oct
Baseband output limiting
Baseband bandwidth 1dB
Baseband output roll-off
17,20
17,20
2.0
Level athardclipping(loadasFig.14)
(Load as Fig.14)
Above 3dB point, no load
40
6
Continued
13
SL1935
Table 10. ElectricalCharacteristics (Continued)
Value
Units
Conditions
Pin
Characteristic
Typ
Min
Max
SYNTHESISER
SDA,SCL
Input high voltage
Input low voltage
Input high current
Input low current
3,4
I2C 'fast mode' compliant
3
0
V
V
µA
µA
5.5
1.5
10
Input voltage = Vcc
Input voltage = Vee
-10
Leakage current
Hysterysis
SDA output voltage
10
µA Vcc = Vee = 0V
0.4
+-3
V
V
V
0.4
0.6
400
Isink = 3mA
Isink = 6mA
3
SCL clock rate
kHz
4
Charge pump output current
Charge pump output leakage
Charge pump drive output current
Crystal frequency
Vpin36 = 2V. (Table 5)
nA Vpin36 = 2V
mA Vpin35 = 0.7V
MHz (Fig.15 for application)
36
36
35
1,2
+-10
0.5
2
20
Recommended crystal series
resistance
200
Ω
4MHz parallel resonant crystal
10
Externalreferenceinputfrequency
20
0.5
4
MHz Sinewave coupled via 10nF blocking
2
2
2
capacitor
External reference drive level
Vpp Sinewave coupled via 10nF blocking
capacitor
MHz
0.2
Phase detector comparison
frequency
Equivalent phase noise at phase
detector
-152
dBc/Hz SSB within loop bandwidth, all
comparison frequencies
Local oscillator programmable
divider division ratio
Reference division ratio
Output port P0
Sink current
Leakage current
32767
240
2
(Table 3)
(Note 7)
mA Vport = 0.7
µA Vport = Vcc
AC coupled. (Note 10.)
Vpp Enabled by bit RE = 1 and default
34
5
10
BUFREF output
0.45
Output amplitude
Output impedance
Address select
0.25 0.35
250
Ω
state on power-up.
(Table 9c)
18
Input high curent
Input low current
1
-0.5
mA Vin = Vcc
mA Vin = Vee
Notes to Table 10
1.
2.
All power levels are referred to 75Ω, and 0dBm = 109dBµV.
System specifications refer to total cascaded system of converter/AGC stage and baseband amplifier stagewith nominal
6dB pad as interstage filter and load impedance as detailed in Figure 14.
3.
4.
5.
6.
Baseband dominated IP2. AGC set for 20dB system gain with two tones for intermodulation test at fc+146and
fc+155MHz at 100dBµV generating output intermodulation spur at 9MHz. 30MHz 3dB bandwidthinterstage filter included.
LNA dominated IP2. AGC set for 20dB system gain with two tones for intermodulation test at fc+146 and2*fc+155 MHz at
100dBµV generating output intermodulation spur at 9MHz. 30MHz 3dB bandwidthinterstage filter included.
AGC set for 20dB system gain with two tones for intermodulation test at fc+110 and fc+211MHz at 100dBµVgenerating
output intermodulation spur at 9MHz. 30MHz 3dB bandwidth interstage filter included.
Dynamic range assuming termination as detailed in Figure 14, and including 6 dB interstage filter insertion loss,
delivering 700mVp-p at baseband outputs (pins 17,20). AGC monotonic from Vee to Vcc (Fig.4).
Port powers up in high impedance state.
7.
8.
The level of 2.01GHz downconverted to baseband relative to 1.01GHz with the oscillator tuned to 1GHz,measured with
no input pre-filtering.
9.
The level of second harmonic of 1.01GHz input at –25dBm downconverted to baseband relative to 2.01GHz at–40 dBm
with the oscillator tuned to 2GHz, measured with no input pre-filtering.
10.
11.
If the BUFREF output is not used it should be left open circuit or connected to Vccd, and disabled by settingRE = ‘0’.
This parameter is very application dependant. With good RF isolation <-60dBm can be achieved.
14
SL1935
V
CC
V
REF
8
9
RF
5K
30K
19
AGCCONT
RFB
RF inputs
AGC input
V
REF2
1K
1K
TANK
OFIA
OFIB
OFQA
OFQB
TANKB
Converter outputs (pins 14, 15, 22 and 23)
Oscillator inputs (pins 28, 29 and 31, 32)
IFIA
IFIB
IFQA
IFQB
IOUT
and
QOUT
BIAS
Baseband amplifier inputs
(pins 11, 12, 25 and 23)
Baseband outputs (pins 17 and 20)
Figure 17. Input and output interface circuits (RF section)
15
SL1935
V
ccd
V
ccd
36
PUMP
2
XTAL
1
XTALCAP
300
35
DRIVE
Loop amplifier
Reference oscillator
V
V
ccd
ccd
60K
18
3K
47K
ADD
SCL/SDA
]
20K
ACK
]On SDA only
ADD input
SDA/SCL (pins 3 and 4)
V
ccd
P0
34
5
BUFREF
ENABLE/
DISABLE
BUFREF output
Output port
Figure 18. Input and output interface circuits (PLL section)
16
SL1935
Table 11. Absolute Maximum Ratings(All voltages referred to Vee at 0V and Vcc = Vccd)
Characteristic
Min
Max
Units
Conditions
7
6
Supply voltage
-0.3
-0.3
-0.3
V
V
V
SDA, SCL DC offsets
All I/O port DC offsets
Port P0 current
Vcc = Vee to 5.25V
Vcc+0.3
10
150
150
20
mA
o
Storage temperature
-55
C
C
o
Junction temperature
o
Package thermal resistance,
chip to case
Package thermal resistance,
chip to ambient
C/W
o
77
C/W
919
Power consumption at 5.25V
ESD protection
mW
kV
3.5
Mil-std 883 method 3015 cat1
SL1935 Demo Board
The demo board contains an SL1935 I2C bus controlled VCOS oscillates at twice the LO frequency (lower band)
Zero IF tuner IC, plus all components necessary to and is then divided by two to provide the required LO
demonstrate operation of the SL1935. The schematic frequency in the range 950MHz to 1500MHz
and PCB layout of the board are shown in Figures 19, 20 (approximately).
and 21.
VCOV oscillates at the LO frequency (upper band) in the
range 1500MHz to 2150MHz (approximately).
Supplies
The board must be provided with the following supplies:
3. Baseband path select.
5V for the synthesiser section (5VD)
5V for the converter and baseband sections (5V)
30V for the varactor line (30V)
TheSL1935hastwofilterpathsselectedby programming
bit BS of the I2Cdata (see Tables 6 and 9a to 9c). The
value of BS is changed by toggling the switch position to
theleftof‘FilterA’and‘FilterB’onthemainsoftware block
diagram.
The supply connector is a 5 pin 0.1” pin header.
The order of connections is 5V – GND – 30V – GND – 5V.
4. AGC control.
I2C busconnections
The conversion gain of the SL1935 is set by the voltage
applied to the AGCCONT input. On the demo board this
is controlled by the potential divider labelled ‘AGC ADJ’
which varies the AGCCONT input from 0V to Vcc.
The board is provided with a RJ11 I2C bus connector
which feeds directly to the synthesiser. This connects to
a standard 4 way cable.
Operating instructions
1. Software.
CAUTION: Care should be taken to ensure the chip is
powered ON if the board is modified to accept an external
AGC inputvoltage. Damagetothedevice may resultifthis
is not complied with as a result of the IC powering itself up
via the AGCCONT input ESD protection diode. It is
recommended that a low current limit is set on any
external AGC voltage source used.
Use the Zarlink Semiconductor synthesiser software. Pull
down the ‘Device’ menu, then select the ‘SL1935’. It is
suggested that the charge pump is set to 130uA with a
reference divider ratio of 32. These settings give a small
loop bandwidth (i.e. 100’s Hz), which allows detailed
phase noise measurements of the oscillators to be taken
if desired.
5. Free running the VCO’s.
SelecttherequiredVCOasdetailedin(2)above. Program
an LO frequency which is above the maximum capability
of the oscillator. 3GHz is suggested. Under this condition
the varactor control voltage is pumped to its maximum
value, ie to the top of the band. The oscillator frequency
can now be manually tuned by varying the 30V supply.
2. VCO control.
The two VCO’s are selected by toggling the oscillator
switch below the two oscillators on the main software
block diagram. Thisswitch programs bitVSoftheI2C data
(see Tables 8 and 9a to 9c).
17
SL1935
19.
View
Figure 19. Top view
18
SL1935
Figure 20. Bottom view
19
30V
CN8
5VD
+
DC POWER
R20
22K
5
4
3
2
1
R18
13K
R19
13K
C30
C28
100nF
C29
100pF
22uF
C2
82pF
C27
15nF
C26
TP6
68pF
C25
2n2
30V
IC1
XTALCAP
XL1
4MHz
1
2
36
CN7
I2C
PUMP
C3
150pF
TP5
P0
TR1
BCW31
R16
1K
R17
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
5VD
XTAL
SDA
SCL
BUFref
VccD
Vcc
DRIVE
PORT P0
Ve e
TP1
C31
100nF
C32
100pF
1K
3
4
5
6
3
SDA
5V0
GND
D1 BB837
5V
TP2
4
L1
L2
SCL
SK1
RF IN
R23
2K
5
RFinA
TP3
TANKSa
TANKSb
Ve e
5VD
6
C40
100pF
C39
100pF
C38
22uF
BB831
5V
C5
+
D3
7
C33
100pF
C34
100pF
C35
100pF
C36
100nF
C37
100pF
D2 BB837
L3
L4
1nF
RFinA
8
R24
2K
RFin
RFinB
Vcc
TANKVa
TANKVb
Ve e
R7
75R
9
5V
1nF
C6
GND
C24
5V
10
11
12
13
14
15
16
17
18
5VD
D4
BB831
C7
C8
100nF
100nF
100nF
IFIa
IFQA
IFQB
R21
Q OUT
C23
5V
100nF
5V
SK2
I OUT
620R
IOUT
IFIb
R15
2K7
TP8
AGC
Vcc
Vcc
1K
R14
R1 1K
C22
C21
C9
C10
100nF
100nF
100nF
100nF
RV1
5K
AGC
OFIa
OFIb
Ve e
OFQA
OFQB
Ve e
D5
PORT 0
R13 1K
OFQB
R2 1K
R22
R3
1K
R4
1K
R11
1K
R12
1K
620R
QOUT
C11
3p9
SK3
Iout
Qout
C12
3p9
C19
3p9
JP1
C20
3p9
1
2
ADD
AGC cont
C18
C13
220nF
220nF
SL1935
AGC
TP4
R5
100R
TP7
C16
10nF
R10
100R
P0
1K
R9
QOUT
IOUT
C14
15pF
R6
1K
C17
15pF
Figure 21.
SL1935
Purchase of Zarlink Semiconductor I2C components conveys a licence under the Phillips I2C Patent rights to use
these components in an I2C system,provided that the system conforms to the I2C Standard Specification as
defined by Phillips.
21
For more information about all Zarlink products
visit our Web Site at
www.zarlink.com
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However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual
property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in
certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system
conforms to the I2C Standard Specification as defined by Philips.
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