WEDPS512K32-35BM [MICROSEMI]

SRAM Module, 512KX32, 35ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143;
WEDPS512K32-35BM
型号: WEDPS512K32-35BM
厂家: Microsemi    Microsemi
描述:

SRAM Module, 512KX32, 35ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143

静态存储器
文件: 总6页 (文件大小:202K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ADVANCED*  
n Commercial, Industrial and Military Temperature Ranges  
n TTL Compatible Inputs and Outputs  
n 5 Volt Power Supply  
n Access Times of 12, 15, 17, 20, ns  
n Packaging  
• 16mm x 18mm, 143 PBGA  
n Low Power CMOS  
n Organized as 512Kx32, User Configurable as 1Mx16 or  
*This data sheet describles a product that is developmental, is not qualified and  
is subject to change or cancellation without notice.  
2Mx8  
FIG. 1  
-
A2  
A3  
A1  
A4  
A0  
D14  
D12  
GND  
GND  
GND  
VCC  
GND  
D15  
D13  
GND  
GND  
GND  
VCC  
GND  
NC  
VCC  
CS4  
VCC  
VCC  
D24  
D26  
VCC  
A18  
D25  
D27  
VCC  
A17  
O E  
A16  
A15  
D31  
D28  
VCC  
GND  
NC  
CS2  
D 9  
D 8  
NC  
GND  
GND  
GND  
GND  
VCC  
WE4  
VCC  
D30  
D29  
NC  
D10  
WE2  
GND  
VCC  
D11  
GND  
GND  
VCC  
VCC  
D 0  
GND  
GND  
GND  
VCC  
VCC  
VCC  
NC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
GND  
GND  
GND  
GND  
WE3  
GND  
GND  
GND  
GND  
D17  
D19  
GND  
GND  
GND  
GND  
D16  
D18  
A10  
GND  
GND  
GND  
CS3  
A14  
A11  
GND  
GND  
D23  
D20  
A13  
A12  
GND  
NC  
CS1  
D 1  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
D22  
D21  
NC  
D 2  
D 3  
D 7  
D 5  
VCC  
WE1  
GND  
A6  
A5  
D 6  
D 4  
NC  
A7  
A8  
A9  
VCC  
VCC  
VCC  
I/O0-31 DataInputs/Outputs  
A0-18  
WE1-4  
CS1-4  
OE  
AddressInputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
VCC  
GND  
NC  
Not Connected  
May 2002 Rev. 3  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
H
L
X
L
X
H
H
L
Standby  
Read  
High Z  
Data Out  
High Z  
Standby  
Active  
Active  
Active  
Operating Temperature  
Storage Temperature  
Signal Voltage Relative to GND  
Junction Temperature  
Supply Voltage  
TA  
TSTG  
VG  
-55  
-65  
-0.5  
+125  
+150  
Vcc+0.5  
150  
°C  
°C  
V
L
H
X
Out Disable  
Write  
L
Data In  
TJ  
°C  
V
VCC  
-0.5  
7.0  
Supply Voltage  
VCC  
VIH  
VIL  
4.5  
5.5  
VCC + 0.3  
+0.8  
V
V
Input High Voltage  
Input Low Voltage  
Operating Temp (Mil)  
2.2  
-0.5  
-55  
OEcapacitance  
COE  
CWE  
CCS  
V
V
IN = 0 V, f = 1.0 MHz  
IN = 0 V, f = 1.0 MHz  
30  
pF  
pF  
pF  
V
WE1-4 capacitance  
CS1-4 capacitance  
DataI/Ocapacitance  
10  
10  
TA  
+125  
°C  
V
IN = 0 V, f = 1.0 MHz  
CI/O  
CAD  
V
I/O = 0 V, f = 1.0 MHz  
10  
30  
pF  
pF  
Addressinputcapacitance  
VIN = 0 V, f = 1.0 MHz  
This parameter is guaranteed by design but not tested.  
InputLeakageCurrent  
OutputLeakageCurrent  
ILI  
ILO  
VCC = 5.5, VIN =GND to VCC  
10  
10  
µA  
µA  
CS=VIH, OE=VIH,VOUT =GNDtoVCC  
CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5  
CS=VIH, OE = VIH, f = 5MHz, Vcc = 5.5  
OperatingSupplyCurrentx32Mode  
StandbyCurrent  
ICC x 32  
ISB  
660  
80  
mA  
mA  
V
OutputLowVoltage  
VOL  
IOL = 8mA for 15 - 35ns,  
0.4  
IOL = 2.1mA for 45 - 55ns, Vcc = 4.5  
OutputHighVoltage  
VOH  
IOH = -4.0mA for 15 - 35ns,  
IOH = -1.0mA for 45 - 55ns, Vcc = 4.5  
2.4  
V
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V  
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520  
Read Cycle Time  
tRC  
tAA  
12  
0
15  
0
17  
0
20  
0
25  
0
35  
0
45  
0
55  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
AddressAccessTime  
12  
15  
17  
20  
25  
35  
45  
55  
OutputHoldfromAddressChange  
Chip Select Access Time  
tOH  
tACS  
tOE  
12  
7
15  
8
17  
9
20  
10  
25  
12  
35  
25  
45  
25  
55  
25  
OutputEnabletoOutputValid  
ChipSelecttoOutputinLowZ  
OutputEnabletoOutputinLowZ  
ChipDisabletoOutputinHighZ  
OutputDisabletoOutputinHighZ  
tCLZ1  
tOLZ1  
tCHZ1  
tOHZ1  
1
0
2
0
2
0
2
0
2
0
4
0
4
0
4
0
7
7
12  
12  
12  
12  
12  
12  
12  
12  
15  
15  
20  
20  
20  
20  
1. This parameter is guaranteed by design but not tested.  
Write Cycle Time  
tWC  
tCW  
tAW  
tDW  
tWP  
12  
10  
10  
8
15  
13  
13  
10  
13  
2
17  
15  
15  
11  
15  
2
20  
15  
15  
12  
15  
2
25  
17  
17  
13  
17  
2
35  
25  
25  
20  
25  
2
45  
35  
35  
25  
35  
2
55  
50  
50  
25  
40  
2
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ChipSelecttoEndofWrite  
AddressValidtoEndofWrite  
DataValidtoEndofWrite  
WritePulseWidth  
10  
0
AddressSetupTime  
tAS  
AddressHoldTime  
tAH  
0
0
0
0
0
0
5
5
OutputActivefromEndofWrite  
tOW1  
2
2
2
3
4
4
5
5
Write Enable to Output in High Z tWHZ1  
7
8
9
11  
13  
15  
20  
20  
Data Hold Time tDH  
0
0
0
0
0
0
0
0
1. This parameter is guaranteed by design but not tested.  
Input Pulse Levels  
Input Rise and Fall  
VIL = 0, VIH = 3.0  
V
ns  
V
5
InputandOutputReferenceLevel  
Output Timing Reference Level  
1.5  
1.5  
V
Notes:  
VZ is programmable from -2V to +7V.  
IOL & IOH programmable from 0 to 16mA.  
Tester Impedance Z0 = 75 W.  
VZ is typically the midpoint of VOH and VOL.  
IOL & IOHare adjusted to simulate a typical resistive load circuit.  
ATE tester includes jig capacitance.  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WS32K32-XHX  
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520  
BOTTOM VIEW  
12 11 10  
9
8
7
6
5
4
3
2
1
A
B
C
16.25 (0.640)  
MAX  
D
E
13.97 (0.550)  
BSC  
1.27  
(0.050)  
BSC  
F
G
H
J
K
L
M
0.61 (0.024)  
BSC  
13.97 (0.550)  
BSC  
2.21 (0.087)  
MAX  
18.25 (0.719)  
MAX  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
M =MILITARY SCREENED  
-55°C TO +125°C  
-40°C TO 85°C  
I
=INDUSTRIAL  
C =COMMERCIAL  
0°C TO +70°C  
B = 143 PBGA, 16mm x 18mm, 288mm2  
User configurable as 1Mx16 or 2Mx8  
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520  

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