WF128K32N-120G2LQ5A_技术文档

WF128K32-XXX5

128KX32 5V NOR FLASH MODULE (SMD 5962-94716**)

FEATURES

 Access times of 50*, 60, 70, 90, 120, 150ns

 Low power CMOS

 Packaging:

 Embedded erase and program algorithms

 TTL compatible inputs and CMOS outputs

• 66 pin, PGA type, 1.075 inch square, Hermetic Ceramic

HIP (Package 400)

 Built-in decoupling caps and multiple ground pins for low

• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch)

square, 3.56mm (0.140 inch) high (Package 510)

noise operation

 Page program operation and internal program control time

 Weight

• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880 inch)

square, 4.06mm (0.160 inch) high (Package 528)

WF128K32-XG2LX5 - 8 grams typical

WF128K32-XG2UX5 - 8 grams typical

WF128K32-XH1X5 - 13 grams typical

 Sector architecture

• 8 equal size sectors of 16KBytes each

• Any combination of sectors can be concurrently erased.

Also supports full chip erase

This product is subject to change without notice.

Note: For programming information and waveforms refer to Flash Programming 1M5 Application

Note AN0036.

 100,000 erase/program cycles minimum

 Organized as 128Kx32

* The access time of 50ns is available in Industrial and Commercial temperature ranges only.

** For reference only. See SMD table on page 10.

 Commercial, industrial and military temperature ranges

 5 volt programming

FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5

Pin Description

Top View

I/O_0-31

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

A_0-16

I/O24

I/O25

I/O26

A7

VCC

CS4#

WE⁴#

I/O²⁷

A4

I/O31

I/O30

I/O29

I/O28

A1

I/O8

I/O9

I/O10

A14

WE2#

CS²#

GND

I/O¹¹

A10

I/O15

I/O14

I/O13

I/O12

OE#

NC

WE_1-4

#

CS_1-4

OE#

V_CC

#

Output Enable

Power Supply

Ground

GND

NC

Not Connected

A12

A16

Block Diagram

NC

A5

A2

A11

A9

WE1# CS1#

WE2# CS2#

WE3# CS3#

WE4# CS4#

128K x 8

OE#

A0-16

A13

A6

A3

A0

A15

WE¹#

I/O7

A8

WE3#

CS3#

GND

I/O¹⁹

I/O23

I/O22

I/O21

I/O20

NC

I/O0

I/O1

I/O2

VCC

128K x 8

I/O16

I/O17

I/O18

CS1#

NC

I/O6

8

I/O5

I/O0-7

I/O8-15

I/O16-23

I/O24-31

I/O³

I/O4

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

1

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

FIGURE 3 – PIN CONFIGURATION FOR WF128K32-XG2UX5 AND WF128K32-XG2LX5

TOP VIEW

PIN DESCRIPTION

I/O_0-31

A_0-16

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

9

8

7

6

5

4

3

2

1

68 67 66 65 64 63 62 61

60 I/O₁₆

WE_1-4

#

I/O₀10

I/O₁11

I/O₂12

I/O₃13

I/O₄14

I/O₅15

I/O₆16

I/O₇17

GND 18

I/O₈19

I/O₉20

I/O₁₀21

I/O₁₁22

I/O₁₂23

I/O₁₃24

I/O₁₄25

I/O₁₅26

CS_1-4

OE#

V_CC

#

59 I/O₁₇

58 I/O₁₈

57 I/O₁₉

56 I/O₂₀

55 I/O₂₁

54 I/O₂₂

53 I/O₂₃

52 GND

51 I/O₂₄

50 I/O₂₅

49 I/O₂₆

48 I/O₂₇

47 I/O₂₈

46 I/O₂₉

45 I/O₃₀

44 I/O₃₁

Output Enable

Power Supply

Ground

GND

NC

Not Connected

BLOCK DIAGRAM

WE1# CS1#

WE2# CS2#

WE3# CS3#

WE4# CS4#

128K x 8

OE#

A0-16

2728 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

128K x 8

8

I/O0-7

I/O8-15

I/O16-23

I/O24-31

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

2

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

ABSOLUTE MAXIMUM RATINGS (1)

RECOMMENDED OPERATING CONDITIONS

Parameter

Unit

°C

Parameter

Symbol

V_CC

T_A

Min

4.5

-55

-40

0

Max

5.5

Unit

V

Operating Temperature

-55 to +125

-2.0 to +7.0

-65 to +150

+300

Supply Voltage

Supply Voltage Range (V_CC

)

V

Operating Temp. (Mil, Q)

Operating Temp. (Ind)

Operating Temp. (Com)

+125

+85

+70

°C

Signal voltage range (any pin except A9) (2)

Storage Temperature Range

V

T_A

°C

T_A

Lead Temperature (soldering, 10 seconds)

Data Retention Mil Temp

°C

10

years

cycles

V

Endurance (write/erase cycles) Mil Temp

A9 Voltage for sector protect (V_ID) (3)

NOTES:

100,000 min

-2.0 to +12.5

CAPACITANCE

Ta = +25°C

1. Stresses above the absolute maximum rating may cause permanent damage to the device.

Extended operation at the maximum levels may degrade performance and affect reliability.

2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may

overshoot V_SSto -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins

is Vcc + 0.5V. During voltage transitions, outputs may overshoot to V_CC+ 2.0 V for periods of up

to 20ns.

3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot

Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +12.5V which may

overshoot to 13.5 V for periods up to 20ns.

Parameter

Symbol

C_OE

C_WE

Conditions

V_IN= 0V, f = 1.0 MHz

Max Unit

OE# capacitance

WE_1-4# capacitance

HIP (PGA) H1

50

pF

20

15

20

50

CQFP G2U/G2L

CS_1-4# capacitance

Data# I/O capacitance

Address input capacitance

C_CS

C_I/O

C_AD

V_IN= 0V, f = 1.0 MHz

V_I/O= 0V, f = 1.0 MHz

V_IN= 0V, f = 1.0 MHz

pF

This parameter is guaranteed by design but not tested.

DC CHARACTERISTICS – CMOS COMPATIBLE

Parameter

Symbol

I_LI

Conditions

V_CC= V_{CC MAX}, V_IN= GND to V_CC

Min

Max

10

Unit

Input Leakage Current

Output Leakage Current

μA

mA

V

I_LOx32

I_CC1

I_CC2

I_CC3

I_CC4

V_IH

V_CC= V_{CC MAX}, V_OUT= GND to V_CC

CS# = V_IL, OE# = V_IH, V_CC= V_{CC MAX}

V_CC= V_{CC MAX}, CS# = V_CC±0.5V, OE# = V_IH, f = 5MHz

V_CC= 5.5, CS# = V_IH

10

V_CCActive Current for Read(1)

V_CCActive Current for Program or Erase(2)

V_CCStandby Current

140

200

6.5

V_CCStatic Current

Input High Voltage

0.6

2.0

-0.5

11.5

V_CC+ 0.3

+0.8

12.5

0.45

Input Low Voltage

V_IL

V

Voltage for Auto Select and Sector Protect

Output Low Voltage

Output High Voltage

Low V_CCLock Out Voltage

NOTES:

V_ID

V

V_OL

V_OH1

V_OH2

V_LKO

I_OL= 8.0 mA, V_CC= V_{CC MIN}

I_OH= -2.5 mA, V_CC= V_{CC MIN}

I_OH= -100 μA, V_CC= V_{CC MIN}

V

0.85 x V_CC

V_CC-0.4

3.2

V

1.

2.

I

_CCcurrent is typically less than 8mA/MHz, with OE# at V_IH.

_CCactive while Embedded Algorithm (program or erase) is in progress.

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

3

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, CS# CONTROLLED

Parameter

Symbol

-50

-60

-70

-90

-120

-150

Unit

Min

50

0

Max

Min

60

0

Max

Min

70

0

Max

Min

90

0

Max

Min

120

0

Max

Min

150

0

Max

Write Cycle Time

t_AVAV

t_WLEL

t_ELEH

t_WC

t_WS

t_CP

ns

WE# Setup Time

CS# Pulse Width

25

0

30

0

35

0

45

0

50

0

50

0

ns

Address Setup Time

Data Setup Time

t_AVEL

t_AS

ns

t_DVEH

t_EHDX

t_ELAX

t_DS

25

0

30

0

30

0

45

0

50

0

50

0

ns

Data Hold Time

t_DH

t_AH

t_WH

t_CPH

ns

Address Hold Time

40

0

45

0

45

0

45

0

50

0

50

0

ns

WE# Hold from WE# High

CS# Pulse Width High

Duration of Programming Operation

Duration of Erase Operation

Read Recovery before Write

Chip Programming Time

t_EHWH

t_EHEL

ns

20

14

2.2

0

20

14

2.2

0

20

14

2.2

0

20

14

2.2

0

20

14

2.2

0

20

14

2.2

0

ns

t_WHWH1

t_WHWH2

t_GHEL

μs

sec

ns

60

12.5

sec

FIGURE 4 – AC TEST CIRCUIT

AC TEST CONDITIONS

Parameter

Typ

Unit

Input Pulse Levels

Input Rise and Fall

Input and Output Reference Level

Output Timing Reference Level

V_IL= 0, V_IH= 3.0

V

ns

V

I_OL

5

1.5

Current Source

V

Notes:

D.U.T.

C_eff= 50 pf

V

_Z1.5V

V_Zis programmable from -2V to +7V.

(Bipolar Supply)

I

_OL& I_OHprogrammable from 0 to 16mA.

Tester Impedance Z0 = 75 Ω.

V_Zis typically the midpoint of V_OHand V_OL

.

I

_OL& I_OHare adjusted to simulate a typical resistive load circuit.

ATE tester includes jig capacitance.

I_OH

Current Source

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

4

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED

Parameter

Symbol

-50

-60

-70

-90

-120

Max

-150

Max

Unit

Min

50

0

Max

Min

60

0

Max

Min

70

0

Max

Min

90

0

Max

Min

120

0

Min

150

0

Write Cycle Time

t_AVAV

t_ELWL

t_WLWHt_WP

t_AVWLt_AS

t_DVWHt_DS

t_WHDXt_DH

t_WLAXt_AH

t_WC

ns

μs

sec

ns

μs

sec

ns

Chip Select Setup Time

Write Enable Pulse Width

Address Setup Time

t_CS

25

0

30

0

35

0

45

0

50

0

50

0

Data Setup Time

25

0

30

0

30

0

45

0

50

0

50

0

Data Hold Time

Address Hold Time

40

0

45

0

45

0

45

0

50

0

50

0

Chip Select Hold Time

Write Enable Pulse Width High

Duration of Byte Programming Operation (min)

Sector Erase Time

t_WHEHt_CH

t_WHWLt_WPH

t_WHWH1

20

14

2.2

0

20

14

2.2

0

20

14

2.2

0

20

14

2.2

0

20

14

2.2

0

20

14

2.2

0

t_WHWH2

60

Read Recovery Time Before Write

t_GHWL

V_CCSetup Time

t_VCS

50

Chip Programming Time

Output Enable Setup Time

12.5

t_OES

t_OEH

0

Output Enable Hold Time (1)

1. For Toggle and Data Polling.

10

AC CHARACTERISTICS – READ ONLY OPERATIONS

Parameter

Symbol

-50

-60

-70

-90

-120

-150

Unit

Min

50

Max

Min

60

Max

Min

70

Max

Min

90

Max

Min

Max

Min

Max

Read Cycle Time

t_AVAV

t_RC

120

150

ns

Address Access Time

t_AVQVt_ACC

50

25

20

60

30

20

70

35

20

90

40

25

120

50

150

55

Chip Select Access Time

OE# to Output Valid

t_ELQV

t_GLQV

t_EHQZ

t_GHQZ

t_AXQX

t_CE

t_OE

t_DF

t_OH

Chip Select to Output High Z (1)

OE# High to Output High Z (1)

30

35

30

35

Output Hold from Address, CS# or OE# Change,

0

whichever is ﬁrst

1. Guaranteed by design, not tested.

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

5

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

PACKAGE 400 – 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)

27.3 (1.075) 0.25 (0.010) Sꢀ

PIN 1 IDENTIFIER

SꢀUARE PAD

ON BOTTOM

25.4 (1.0) TYP

4.60 (0.181)

MAX

3.81 (0.150)

0.13 (0.005)

0.76 (0.030) 0.13 (0.005)

15.24 (0.600) TYP

25.4 (1.0) TYP

2.54 (0.100)

TYP

1.27 (0.050) TYP DIA

0.46 (0.018) 0.05 (0.002) DIA

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

6

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

PACKAGE 510 – 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)

25.15 (0.990) 0.25 (0.010) Sꢀ

3.56 (0.140) MAX

22.36 (0.880) 0.25 (0.010) Sꢀ

0.254 (0.010)

+ 0.051 (0.002)

- 0.025 (0.001)

0.254 (0.010) TYP

R 0.127

24.0 (0.946)

(0.005)

0.53 (0.021)

0.18 (0.007)

0.25 (0.010)

MIN

1°/ 7°

1.01 (0.040)

0.13 (0.005)

DETAIL A

1.27 (0.050) TYP

0.38 (0.015)

0.05 (0.002)

SEE DETAIL “A”

20.32 (0.800) TYP

The Microsemi 68 lead G2U CQFP ﬁlls the same

ﬁt and function as the JEDEC 68 lead CQFJ or

68 PLCC. But the G2U has the TCE and lead

inspection advantage of the CQFP form.

24.0 (0.946) TYP

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

7

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

PACKAGE 528 – 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)

25.15 (0.990) 0.25 (0.010) Sꢀ

5.10 (0.200) MAX

22.36 (0.880) 0.25 (0.010) Sꢀ

0.254 (0.010)

+ 0.051 (0.002)

- 0.025 (0.001)

0.254 (0.010) TYP

R 0.127

24.0 (0.946)

(0.005)

0.25 (0.010)

1.37 (0.054) MIN

0.004

MIN

1°/ 7°

1.01 (0.040)

0.13 (0.005)

DETAIL A

1.27 (0.050) TYP

0.38 (0.015)

0.05 (0.002)

SEE DETAIL “A”

20.32 (0.800) TYP

The Microsemi 68 lead G2L CQFP ﬁlls the same

ﬁt and function as the JEDEC 68 lead CQFJ or

68 PLCC. But the G2L has the TCE and lead

inspection advantage of the CQFP form.

24.0 (0.946) TYP

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

8

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

ORDERING INFORMATION

W F 128K32 X - XXX X X 5 X

MICROSEMI CORPORATION

NOR FLASH

Organization, 128K x 32

User conﬁgurable as 256K x 16 or 512K x 8

IMPROVEMENT MARK

N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrade

ACCESS TIME (ns)

PACKAGE TYPE:

H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400)

G2U = 22.4mm Ceramic Quad Flat Pack, Low Proﬁle CQFP (Package 510)

G2L = 22.4mm Ceramic Quad Flat Pack, Low Proﬁle CQFP (Package 528)

DEVICE GRADE:

Q

= MIL - STD 833 Compliant

M = Military Screened -55°C to +125°C

I

= Industrial

-40°C to +85°C

0°C to + 70°C

C

= Commercial

V

_PPProgramming Voltage

5 = 5V

LEAD FINISH:

Blank = Gold plated leads

A

= Solder dip leads

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

9

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

DEVICE TYPE

128K x 32 Flash

SPEED

150ns

120ns

90ns

PACKAGE

66 pin HIP (H1)

SMD NO.

5962-94716 01H8X

5962-94716 02H8X

5962-94716 03H8X

5962-94716 04H8X

5962-94716 05H8X

70ns

60ns

128K x 32 Flash

150ns

120ns

90ns

68 lead CQFP (G2U)

5962-94716 01HNX

5962-94716 02HNX

5962-94716 03HNX

5962-94716 04HNX

5962-94716 05HNX

70ns

60ns

128K x 32 Flash

150ns

120ns

90ns

68 lead CQFP (G2L)

5962-94716 01HAX

5962-94716 02HAX

5962-94716 03HAX

5962-94716 04HAX

5962-94716 05HAX

70ns

60ns

NOTE: This table is for reference only. For 5962-94716 ordering information and speciﬁcations refer to latest SMD document.

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

10

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

WF128K32-XXX5

Document Title

128KX32 5V NOR FLASH MODULE, SMD 5962-94716

Revision History

Rev # History

Release Date Status

Rev 10

Changes (Pg. 1-16)

June 2011

Final

10.1 Change document layout from White Electronic Designs to Microsemi

10.2 Add document Revision History page

Rev 11

Rev 12

Changes (Pg. 1, 16)

August 2011

June 2012

Final

11.1 Add "NOR" to headline

Changes (Pg. 1, 3, 4, 5-15)

12.1 Update features

12.2 Update Absolute Maximum Ratings, Recommended Operating Conditions

and DC Characteristics – CMOS Compatible charts

12.3 Delete subhead from all AC Characteristics charts

12.4 Delete AC Waveforms diagram

12.5 Update package 510 – 68 Lead, Ceramic Quad Flat Pack, CQFP (G2U)

diagram

12.6 Update package 528 – 68 Lead, Ceramic Quad Flat Pack, CQFP (G2L)

diagram

12.7 Add NOR to Flash option in Ordering Information chart

12.8 Update notes to QML chart

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 12

11

Microsemi Corporation • (602) 437-1520 • www.microsemi.com


型号：	WF128K32N-120G2LQ5A
厂家：	Microsemi
描述：	Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68 内存集成电路
文件：	总11页 (文件大小：814K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

WF128K32N-120G2LQ5A [MICROSEMI]

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