WSE128K16-73H1C [MICROSEMI]

Memory Circuit, 128KX16, CMOS, CHIP66, CERAMIC, HIP-66;
WSE128K16-73H1C
型号: WSE128K16-73H1C
厂家: Microsemi    Microsemi
描述:

Memory Circuit, 128KX16, CMOS, CHIP66, CERAMIC, HIP-66

静态存储器 内存集成电路
文件: 总15页 (文件大小:635K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY*  
128Kx16 SRAM/EEPROM MODULE  
„
Commercial, Industrial and Military Temperature  
Ranges  
FEATURES  
„
„
„
„
Access Times of 35ns (SRAM) and 150ns (EEPROM)  
„
„
TTL Compatible Inputs and Outputs  
Access Times of 45ns (SRAM) and 120ns (EEPROM)  
Access Times of 70ns (SRAM) and 300ns (EEPROM)  
Packaging  
Built-in Decoupling Caps and Multiple Ground Pins  
for Low Noise Operation  
„
Weight - 13 grams typical  
• 66 pin, PGA Type, 1.075" square HIP, Hermetic  
Ceramic HIP (H1) (Package 400)  
EEPROM MEMORY FEATURES  
• 68 lead, Hermetic CQFP (G2T), 22mm (0.880")  
square (Package 509). Designed to t JEDEC 68  
lead 0.990" CQFJ footprint (FIGURE 2)  
„
„
„
„
„
„
„
„
Write Endurance 10,000 Cycles  
Data Retention at 25°C, 10 Years  
Low Power CMOS Operation  
„
„
„
128Kx16 SRAM  
Automatic Page Write Operation  
Page Write Cycle Time 10ms Max.  
Data Polling for End of Write Detection  
Hardware and Software Data Protection  
TTL Compatible Inputs and Outputs  
128Kx16 EEPROM  
Organized as 128Kx16 of SRAM and 128Kx16 of  
EEPROM Memory with separate Data Buses  
„
„
Both blocks of memory are User Congurable as  
256Kx8  
Low Power CMOS  
* This product is under development, is not qualied or characterized and is subject to  
change without notice.  
FIGURE 1 – WSE128K16-XH1X PIN  
CONFIGURATION  
PIN DESCRIPTION  
ED0-15  
SD0-15  
A0-16  
EEPROM Data Inputs/Outputs  
SRAM Data Inputs/Outputs  
Address Inputs  
Top View  
1
12  
23  
34  
45  
56  
SWE#1-2  
SCS#1-2  
OE#  
VCC  
GND  
NC  
EWE#1-2  
ECS#1-2  
SRAM Write Enable  
SRAM Chip Selects  
Output Enable  
Power Supply  
Ground  
Not Connected  
EEPROM Write Enable  
EEPROM Chip Select  
SD8  
SD9  
SD10  
A13  
SWE2#  
SCS2#  
GND  
SD11  
A10  
SD15  
SD14  
SD13  
SD12  
OE#  
NC  
ED8  
ED9  
ED10  
A6  
VCC  
ECS2#  
EWE2#  
ED11  
A3  
ED15  
ED14  
ED13  
ED12  
A0  
A14  
A7  
A15  
A11  
NC  
A8  
A4  
A1  
A16  
A12  
SWE#1  
SD7  
A5  
A2  
BLOCK DIAGRAM  
SWE1  
#
SCS1  
#
SWE2  
#
SCS2  
#
EWE1  
#
ECS1  
#
EWE2# ECS2#  
NC  
VCC  
A9  
EWE1#  
ECS1#  
GND  
ED3  
ED7  
ED6  
ED5  
ED5  
OE#  
A0-16  
SD0  
SD1  
SD2  
SCS1#  
NC  
SD6  
ED0  
ED1  
ED2  
128K x 8  
EEPROM  
128K x 8  
EEPROM  
128K x 8  
SRAM  
128K x 8  
SRAM  
SD5  
SD3  
SD4  
8
8
8
8
11  
22  
33  
44  
55  
66  
ED0-7  
ED8-15  
SD0-7  
SD8-15  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
FIGURE 2 WSE128K16-XG2TX PIN CONFIGURATION  
Top View  
PIN DESCRIPTION  
ED0-15  
SD0-15  
A0-16  
EEPROM Data Inputs/Outputs  
SRAM Data Inputs/Outputs  
Address Inputs  
9
8
7
6
5
4
3
2
1
68 67 66 65 64 63 62 61  
60  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
SD0  
SD1  
SD2  
SD3  
SD4  
SD5  
SD6  
SD7  
GND  
SD8  
ED0  
ED1  
ED2  
ED3  
ED4  
ED5  
ED6  
ED7  
GND  
ED8  
ED9  
ED10  
ED11  
ED12  
ED13  
ED14  
ED15  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
SWE#1-2 SRAM Write Enable  
SCS#1-2  
OE#  
VCC  
SRAM Chip Selects  
Output Enable  
Power Supply  
Ground  
GND  
NC  
Not Connected  
EWE#1-2 EEPROM Write Enable  
SD9  
SD10  
SD11  
SD12  
SD13  
SD14  
SD15  
ECS#1-2  
EEPROM Chip Select  
BLOCK DIAGRAM  
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43  
SWE1  
#
SCS1  
#
SWE2  
#
SCS2  
#
EWE1  
#
ECS1  
#
EWE2# ECS2#  
OE#  
A0-16  
128K x 8  
EEPROM  
128K x 8  
EEPROM  
128K x 8  
SRAM  
128K x 8  
SRAM  
8
8
8
8
ED0-7  
ED8-15  
SD0-7  
SD8-15  
0.940"  
The WEDC 68 lead G2T CQFP lls the same t and  
function as the JEDEC 68 lead CQFJ or 68 PLCC. But  
the G2T has the TCE and lead inspection advantage  
of the CQFP form.  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
2
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
ABSOLUTE MAXIMUM RATINGS  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Symbol  
TA  
Min  
-55  
-65  
-0.5  
Max  
+125  
+150  
VCC+0.5  
150  
Unit  
°C  
°C  
V
Parameter  
Symbol  
VCC  
VIH  
Min  
4.5  
Max  
5.5  
Unit  
V
Operating Temperature  
Storage Temperature  
Signal Voltage Relative to GND  
Junction Temperature  
Supply Voltage  
Supply Voltage  
TSTG  
VG  
Input High Voltage  
Input Low Voltage  
Operating Temp. (Mil.)  
2.0  
VCC + 0.3  
+0.8  
V
VIL  
-0.3  
-55  
V
TJ  
°C  
V
TA  
+125  
°C  
VCC  
-0.5  
7.0  
EEPROM TRUTH TABLE  
CAPACITANCE  
CS# OE# WE#  
Mode  
Standby  
Read  
Data I/O  
High Z  
TA = +25°C  
H
L
X
L
X
H
L
Parameter  
Symbol Conditions  
Max Unit  
Data Out  
Data In  
OE# capacitance  
COE  
VIN = 0 V, f = 1.0 MHz  
VIN = 0 V, f = 1.0 MHz  
VIN = 0 V, f = 1.0 MHz  
50 pF  
L
H
H
X
L
Write  
WE#1-4 capacitance  
HIP (PGA)  
X
X
X
X
H
X
Out Disable  
High Z/Data Out  
20  
pF  
20  
CWE  
Write  
Inhibit  
CQFP G2T  
CS#1-4 capacitance  
Data I/O capacitance  
Address input capacitance  
CCS  
CI/O  
CAD  
20 pF  
VI/O = 0 V, f = 1.0 MHz 20 pF  
VIN = 0 V, f = 1.0 MHz 50 pF  
SRAM TRUTH TABLE  
This parameter is guaranteed by design but not tested.  
SCS# OE# SWE#  
Mode  
Standby  
Read  
Data I/O  
High Z  
Power  
Standby  
Active  
H
L
X
L
X
H
H
L
Data Out  
High Z  
L
H
X
Read  
Active  
L
Write  
Data In  
Active  
DC CHARACTERISTICS  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
Parameter  
Symbol  
ILI  
ILO  
Conditions  
VCC = 5.5, VIN = GND to VCC  
SCS# = VIH, OE# = VIH, VOUT = GND to VCC  
SCS# = VIL, OE# = ECS# = VIH, f = 5MHz, VCC = 5.5  
ECS# = SCS# = VIH, OE# = VIH, f = 5MHz, VCC = 5.5  
IOL = 8.0mA, VCC = 4.5  
Min  
Max  
10  
10  
360  
31.2  
0.4  
0.4  
Unit  
Input Leakage Current  
Output Leakage Current  
SRAM Operating Supply Current x 16 Mode  
Standby Current  
(35 to 45ns)  
SRAM Output Low Voltage  
(70ns)  
μA  
μA  
mA  
mA  
V
I
CCx16  
ISB  
VOL  
VOL  
IOL = 2.1mA, VCC = 4.5  
V
(35 to 45ns)  
SRAM Output High Voltage  
(70ns)  
EEPROM Operating Supply Current x 16 Mode  
EEPROM Output Low Voltage  
VOH  
VOH  
ICC1  
VOL  
IOH = -4.0mA, VCC = 4.5  
IOH = -1mA, VCC = 4.5  
ECS# = VIL, OE# = SCS# = VIH  
IOL = 2.1 mA, VCC = 4.5V  
2.4  
2.4  
V
V
mA  
V
155  
0.45  
EEPROM Output High Voltage  
VOH1  
IOH = 400 μA, VCC = 4.5V  
2.4  
V
NOTES:  
1. The ICC current listed includes both the DC operating current and the frequency dependent component (@ 5 MHz).  
The frequency component typically is less than 2 mA/MHz, with OE at VIH  
.
2. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
3
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
SRAM AC CHARACTERISTICS  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
-35  
-45  
-70  
Parameter  
Read Cycle  
Symbol  
Units  
Min  
Max  
Min  
Max  
Min  
Max  
Read Cycle Time  
tRC  
tAA  
35  
45  
70  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Access Time  
35  
45  
70  
Output Hold from Address Change  
Chip Select Access Time  
tOH  
0
0
5
tACS  
tOE  
35  
20  
45  
25  
70  
35  
Output Enable to Output Valid  
Chip Select to Output in Low Z  
Output Enable to Output in Low Z  
Chip Disable to Output in High Z  
Output Disable to Output in High Z  
1. This parameter is guaranteed by design but not tested.  
tCLZ1  
tOLZ1  
tCHZ1  
tOHZ1  
3
0
3
0
5
5
20  
20  
20  
20  
25  
25  
SRAM AC CHARACTERISTICS  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
Parameter  
Write Cycle  
-35  
-45  
-70  
Symbol  
Units  
Min  
35  
25  
25  
20  
25  
0
Max  
Min  
45  
30  
30  
25  
30  
0
Max  
Min  
70  
60  
60  
30  
50  
5
Max  
Write Cycle Time  
tWC  
tCW  
tAW  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Chip Select to End of Write  
Address Valid to End of Write  
Data Valid to End of Write  
Write Pulse Width  
tDW  
tWP  
tAS  
Address Setup Time  
Address Hold Time  
tAH  
0
0
5
Output Active from End of Write  
Write Enable to Output in High Z  
Data Hold Time  
tOW1  
tWHZ1  
tDH  
4
4
5
20  
25  
25  
0
0
0
1. This parameter is guaranteed by design but not tested.  
FIGURE 3 – AC TEST CIRCUIT  
AC TEST CONDITIONS  
Parameter  
Typ  
Unit  
Input Pulse Levels  
VIL = 0, VIH = 3.0  
V
ns  
V
IOL  
Input Rise and Fall  
5
Current Source  
Input and Output Reference Level  
Output Timing Reference Level  
1.5  
1.5  
V
D.U.T.  
Ceff = 50 pf  
VZ ≈ 1.5V  
(Bipolar Supply)  
NOTES:  
VZ is programmable from -2V to +7V.  
IOL & IOH programmable from 0 to 16mA.  
Tester Impedance Z0 = 75 Ω.  
VZ is typically the midpoint of VOH and VOL  
IOL & IOH are adjusted to simulate a typical resistive load circuit.  
ATE tester includes jig capacitance.  
.
IOH  
Current Source  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
4
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
FIGURE 4 – SRAM READ CYCLES  
tRC  
ADDRESS  
SCS#  
tRC  
tAA  
ADDRESS  
tAA  
tACS  
tCLZ  
tCHZ  
tOH  
SOE#  
SRAM  
PREVIOUS DATA VALID  
DATA VALID  
DATA I/O  
tOE  
tOLZ  
tOHZ  
DATA VALID  
SRAM  
DATA I/O  
READ CYCLE 1, (SCS# = OE# = VIL, SWE# = VIH  
)
HIGH IMPEDANCE  
READ CYCEL 2, (SWE# = VIH  
)
FIGURE 5 – SRAM WRITE CYCLE SWE# CONTROLLED  
tWC  
ADDRESS  
tAW  
tAH  
tCW  
SCS#  
tAS  
tWP  
SWE#  
tOW  
tDH  
tDW  
tWHZ  
SRAM  
DATA I/O  
DATA VALID  
WRITE CYCLE 1, SWE# CONTROLLED  
FIGURE 6 – SRAM WRITE CYCEL SCS# CONTROLLED  
tWC  
ADDRESS  
tAW  
tAH  
tAS  
tCW  
SCS#  
SWE#  
tWP  
tDH  
tDW  
SRAM  
DATA VALID  
DATA I/O  
WRITE CYCLE 2, SCS# CONTROLLED  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
EEPROM AC WRITE CHARACTERISTICS  
EEPROM WRITE  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
A write cycle is initiated when OE# is high and a low pulse  
is on EWE# or ECS# with ECS# or EWE# low. The address  
is latched on the falling edge of ECS# or EWE# whichever  
occurs last. The data is latched by the rising edge of ECS#  
or EWE#, whichever occurs rst. A byte write operation  
will automatically continue to completion.  
Write Cycle Parameter  
Write Cycle Time, TYP = 6ms  
Address Set-up Time  
Symbol Min  
Max  
Unit  
ms  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tWC  
10  
tAS  
tWP  
tCS  
0
150  
0
Write Pulse Width (EWE# or ECS#)  
Chip Select Set-up Time  
Address Hold Time  
tAH  
100  
10  
0
WRITE CYCLE TIMING  
Data Hold Time  
tDH  
Chip Select Hold Time  
Data Set-up Time  
tCSH  
tDS  
Figures 7 and 8 show the write cycle timing relationships.  
Awrite cycle begins with address application, write enable  
and chip select. Chip select is accomplished by placing the  
ECS# line low. Write enable consists of setting the EWE#  
line low. The write cycle begins when the last of either  
ECS# or EWE# goes low.  
100  
10  
10  
50  
Output Enable Set-up Time  
Output Enable Hold Time  
Write Pulse Width High  
tOES  
tOEH  
tWPH  
The EWE# line transition from high to low also initiates  
an internal 150 μsec delay timer to permit page mode  
operation. Each subsequent EWE# transition from high  
to low that occurs before the completion of the 150 μsec  
time out will restart the timer from zero. The operation of  
the timer is the same as a retriggerable one-shot.  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
6
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
FIGURE 7 – EEPROM WRITE WAVEFORMS EWE# CONTROLLED  
tWC  
OE#  
tOEH  
tOES  
ADDRESS  
ECS#1-2  
tCSH  
tAS  
tAH  
EWE#1-2  
tCS  
tWP  
tWPH  
tDH  
tDS  
EEPROM  
DATA IN  
FIGURE 8 – EEPROM WRITE WAVEFORMS ECS# CONTROLLED  
tWC  
OE#  
tOEH  
tOES  
ADDRESS  
ECS#1-2  
tCSH  
tAS  
tAH  
tCS  
EWE#1-2  
tWP  
tWPH  
tDH  
tDS  
EEPROM  
DATA IN  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
7
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
EEPROM READ  
The WSE128K16-XXX EEPROM stores data at the  
memory location determined by the address pins. When  
ECS# and OE# are low and EWE# is high, this data is  
present on the outputs. When ECS# and OE# are high,  
the outputs are in a high impedance state. This two line  
control prevents bus contention.  
EEPROM AC READ CHARACTERISTICS  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
-120  
-150  
-300  
Unit  
Read Cycle Parameter  
Symbol  
Min  
Max  
Min  
Max  
Min  
Max  
Read Cycle Time  
tRC  
tACC  
tACS  
tOH  
120  
150  
300  
ns  
ns  
ns  
ns  
ns  
ns  
Address Access Time  
120  
120  
150  
150  
300  
300  
Chip Select Access Time  
Output Hold from Add. Change, OE# or ECS#  
Output Enable to Output Valid  
Chip Select or OE# to High Z Output  
0
0
0
0
0
0
tOE  
50  
70  
55  
70  
85  
70  
tDF  
FIGURE 9 – EEPROM READ WAVEFORMS  
tRC  
ADDRESS VALID  
ADDRESS  
ECS#1-2  
tACS  
tOE  
OE#  
tDF  
tACC  
tOH  
EEPROM  
DATA  
OUTPUT  
HIGH Z  
OUTPUT  
VALID  
Note: OE# may be delayed up to tACS - tOE after the falling edge of ECS# without impact on tOE or by tACC - tOE after an address change without impact on tACC  
.
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
8
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
EEPROM DATA POLLING CHARACTERISTICS  
EEPROM DATA POLLING  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
The WSE128K16-XXX offers a data polling feature for  
the EEPROM which allows a faster method of writing to  
the device. Figure 11 shows the timing diagram for this  
function. During a byte or page write cycle, an attempted  
read of the last byte written will result in the complement  
of the written data on D7 (for each chip.) Once the write  
cycle has been completed, true data is valid on all outputs  
and the next cycle may begin. Data polling may begin at  
any time during the write cycle.  
Parameter  
Symbol  
tDH  
Min  
10  
Max  
Unit  
ns  
Data Hold Time  
OE# Hold Time  
OE# To Output Valid  
Write Recovery Time  
tOEH  
tOE  
10  
ns  
55  
ns  
tWR  
0
ns  
FIGURE 10 – EEPROM DATA POLLING WAVEFORMS  
EWE#1-2  
ECS#1-2  
OE#  
tOEH  
tDH  
tOE  
ED7  
HIGH Z  
tWR  
ADDRESS  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
9
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
EEPROM PAGE WRITE OPERATION  
The WSE128K16-XXX has a page write operation  
that allows one to 128 bytes of data to be written into  
the device and consecutively loads during the internal  
programming period. Successive bytes may be loaded  
in the same manner after the rst data byte has been  
loaded. An internal timer begins a time out operation at  
each write cycle. If another write cycle is completed within  
150μs or less, a new time out period begins. Each write  
cycle restarts the delay period. The write cycles can be  
continued as long as the interval is less than the time out  
period.  
After the 150μs time out is completed, the EEPROM  
begins an internal write cycle. During this cycle the entire  
page of bytes will be written at the same time. The internal  
programming cycle is the same regardless of the number  
of bytes accessed.  
EEPROM PAGE WRITE CHARACTERISTICS  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
Page Mode Write Characteristics  
Parameter  
Symbol Min  
Max  
Unit  
Write Cycle Time, TYP = 6ms  
Address Set-up Time  
Address Hold Time (1)  
Data Set-up Time  
Data Hold Time  
tWC  
10  
ms  
ns  
ns  
ns  
ns  
ns  
μs  
ns  
The usual procedure is to increment the least signicant  
address lines from A0 through A6 at each write cycle. In  
this manner a page of up to 128 bytes can be loaded in  
to the EEPROM in a burst mode before beginning the  
relatively long interval programming cycle.  
tAS  
tAH  
0
100  
100  
10  
tDS  
tDH  
Write Pulse Width  
Byte Load Cycle Time  
Write Pulse Width High  
NOTE:  
tWP  
tBLC  
tWPH  
150  
150  
50  
1. Page address must remain valid for duration of write cycle.  
FIGURE 11 – EEPROM PAGE MODE WRITE WAVEFORMS  
OE#  
ECS#1-2  
tWPH  
tBLC  
tWP  
EWE#1-2  
tAS  
tAH  
VALID  
ADDRESS  
ADDRESS  
tDS  
tDH  
tWC  
VALID  
DATA  
EEPROM  
DATA  
BYTE 3  
BYTE 0 BYTE 1  
BYTE 2  
BYTE 127  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
10  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
FIGURE 12 – EEPROM SOFTWARE DATA PROTECTION ENABLE ALGORITHM(1)  
LOAD DATA AA  
TO  
ADDRESS 5555  
È
LOAD DATA 55  
TO  
ADDRESS 2AAA  
È
LOAD DATA A0  
WRITES ENABLED(2)  
TO  
ADDRESS 5555  
È
LOAD DATA XX  
TO  
ANY ADDRESS(4)  
È
LOAD LAST BYTE  
ENTER DATA  
PROTECT STATE  
TO  
LAST ADDRESS  
NOTES:  
1. Data Format: ED7 - ED0 (Hex);  
Address Format: A16 - A0 (Hex).  
2. Write Protect state will be activated at end of write even if no other data is loaded.  
3. Write Protect state will be deactivated at end of write period even if no other data is loaded.  
4. 1 to 128 bytes of data may be loaded.  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
11  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
FIGURE 13 – EEPROM SOFTWARE DATA  
EEPROM SOFTWARE DATA  
PROTECTION  
PROTECTION DISABLE ALGORITHM(1)  
A software write protection feature may be enabled  
or disabled by the user. When shipped by WEDC, the  
WSE128K16-XXX has the feature disabled. Write access  
to the device is unrestricted.  
LOAD DATA AA  
TO  
ADDRESS 5555  
To enable software write protection, the user writes three  
access code bytes to three special internal locations.  
Once write protection has been enabled, each write to the  
EEPROM must use the same three byte write sequence  
to permit writing. After setting software data protection,  
any attempt to write to the device without the three-byte  
command sequence will start the internal write timers. No  
data will be written to the device, however, for the duration  
of twc. The write protection feature can be disabled by  
a six byte write sequence of specic data to specic  
locations. Power transitions will not reset the software  
write protection.  
È
LOAD DATA 55  
TO  
ADDRESS 2AAA  
È
LOAD DATA 80  
TO  
ADDRESS 5555  
È
LOAD DATA AA  
TO  
ADDRESS 5555  
È
LOAD DATA 55  
TO  
ADDRESS 2AAA  
Each 128K byte block of the EEPROM has independent  
write protection. One or more blocks may be enabled and  
the rest disabled in any combination. The software write  
protection guards against inadvertent writes during power  
transitions, or unauthorized modication using a PROM  
programmer.  
È
LOAD DATA 20  
TO  
ADDRESS 5555  
EXIT DATA(3)  
PROTECT STATE  
È
LOAD DATA XX  
TO  
ANY ADDRESS(4)  
EEPROM HARDWARE DATA  
PROTECTION  
These features protect against inadvertent writes to  
the WSE128K16-XXX. These are included to improve  
reliability during normal operation:  
È
LOAD LAST BYTE  
TO  
LAST ADDRESS  
a)  
VCC power on delay  
As VCC climbs past 3.8V typical the device will wait  
5 msec typical before allowing write cycles.  
b)  
V
CC sense  
NOTES:  
1. Data Format: ED7 - ED0 (Hex);  
While below 3.8V typical write cycles are inhibited.  
Address Format: A16 - A0 (Hex).  
2. Write Protect state will be activated at end of write even if no other data  
is loaded.  
3. Write Protect state will be deactivated at end of write period even if no  
other data is loaded.  
4. 1 to 128 bytes of data may be loaded.  
c) Write inhibiting  
Holding OE# low and either ECS# or EWE# high  
inhibits write cycles.  
d) Noise lter  
Pulses of <8ns (typ) on EWE# or ECS# will not  
initiate a write cycle.  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
12  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)  
27.3 (1.075) 0.25 (0.010) SQ  
PIN 1 IDENTIFIER  
SQUARE PAD  
ON BOTTOM  
25.4 (1.0) TYP  
4.34 (0.171)  
MAX  
3.81 (0.150)  
1.42 (0.056) 0.13 (0.005)  
0.13 (0.005)  
0.76 (0.030) 0.13 (0.005)  
2.54 (0.100)  
TYP  
1.27 (0.050) TYP DIA  
15.24 (0.600) TYP  
25.4 (1.0) TYP  
0.46 (0.018) 0.05 (0.002) DIA  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
13  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)  
25.15 (0.990) 0.26 (0.010) SQ  
4.57 (0.180) MAX  
22.36 (0.880) 0.26 (0.010) SQ  
0.27 (0.011) 0.04 (0.002)  
Pin 1  
0.25 (0.010) REF  
R 0.25  
(0.010)  
24.03 (0.946)  
0.26 (0.010)  
0.19 (0.007)  
0.06 (0.002)  
1° / 7°  
1.0 (0.040)  
0.127 (0.005)  
23.87  
(0.940) REF  
DETAIL A  
1.27 (0.050) TYP  
SEE DETAIL "A"  
0.38 (0.015) 0.05 (0.002)  
20.3 (0.800) REF  
The WEDC 68 lead G2T CQFP lls the same  
t and function as the JEDEC 68 lead CQFJ or  
68 PLCC. But the G2T has the TCE and lead  
inspection advantage of the CQFP form.  
0.940"  
TYP  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
14  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
WSE128K16-XXX  
White Electronic Designs  
PRELIMINARY  
ORDERING INFORMATION  
W S E 128K16 - XXX X X X  
LEAD FINISH:  
Blank = Gold plated leads  
A = Solder dip leads  
DEVICE GRADE:  
M = Military Screened  
I = Industrial  
C = Commercial  
-55°C to +125°C  
-40°C to +85°C  
0°C to +70°C  
PACKAGE TYPE:  
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)  
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)  
ACCESS TIME (ns)  
35 = 35ns SRAM and 150ns EEPROM  
42 = 45ns SRAM and 120ns EEPROM  
73 = 70ns SRAM and 300ns EEPROM  
ORGANIZATION, 128K x 16  
EEPROM  
SRAM  
WHITE ELECTRONIC DESIGNS CORP.  
White Electronic Designs Corp. reserves the right to change products or specications without notice.  
March 2005  
Rev. 3  
15  
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  

相关型号:

WSE128K16-73H1CA

Memory Circuit, Flash+SRAM, 128KX16, CMOS, CPGA66, 1.075 X 1.075 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66
MICROSEMI

WSE128K16-73H1CA

128Kx16 SRAM/EEPROM MODULE
WEDC

WSE128K16-73H1I

Memory Circuit, Flash+SRAM, 128KX16, CMOS, CPGA66, 1.075 X 1.075 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66
MICROSEMI

WSE128K16-73H1I

128Kx16 SRAM/EEPROM MODULE
WEDC

WSE128K16-73H1IA

Memory Circuit, Flash+SRAM, 128KX16, CMOS, CPGA66, 1.075 X 1.075 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66
MICROSEMI

WSE128K16-73H1IA

128Kx16 SRAM/EEPROM MODULE
WEDC

WSE128K16-73H1M

Memory Circuit, Flash+SRAM, 128KX16, CMOS, CPGA66, 1.075 X 1.075 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66
MICROSEMI

WSE128K16-73H1M

128Kx16 SRAM/EEPROM MODULE
WEDC

WSE128K16-73H1MA

Memory Circuit, 128KX16, CMOS, CPGA66, 1.075 X 1.075 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66
MICROSEMI

WSE128K16-73H1MA

128Kx16 SRAM/EEPROM MODULE
WEDC

WSE128K16-XG2TX

SRAM/EEPROM MCP
ETC

WSE128K16-XH1X

SRAM/EEPROM MCP
ETC