AS7S32K32P-20L [MICROSS]
SRAM Module, 32KX32, 20ns, CMOS, CPGA66, 1.090 X 1.090 INCH, CERAMIC, PGA-66;型号: | AS7S32K32P-20L |
厂家: | MICROSS COMPONENTS |
描述: | SRAM Module, 32KX32, 20ns, CMOS, CPGA66, 1.090 X 1.090 INCH, CERAMIC, PGA-66 静态存储器 内存集成电路 |
文件: | 总6页 (文件大小:144K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AS7S32K32
32K x 32 SRAM
AUSTIN SEMICONDUCTOR, INC.
SRAM MODULE
FEATURES
MIL-STD 883
•
•
•
•
•
•
•
•
SMD- 5962-94614 Pin Compatible
Access times of 20, 25, 35, 45 ns
Built in decoupling capacitors for low noise operation
Organized as 32K x 32
Operation with single 5 volt supply
Low power CMOS
TTL Compatible Inputs and Outputs
Packaging
66 pin PGA type 1.09 inch square
68 lead J leaded LCC (contact factory)
68 lead quad flatpack (contact factory)
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS7S32K32P is a 1 Mega-
bit CMOS SRAM Module organized as 32Kx32 and user
configurable to 64Kx16 or 128Kx8. The AS7S32K32 achieves
high speed access, low power consumption and high reliability by
employing advanced CMOS memory technology.
These advanced features make ASI modules ideally suited
for military applications.
The AS7S32K32 module is constructed using a 1.09 inch
square ceramic pin grid array substrate. This compact layout re-
duces space requirements for board assembly to a minimum.
PIN CONFIGURATION
I/O8
I/O9
1
2
WE 12 I/O15 23
CE2 13 I/O14 24
1/O24 34 VCC 45 I/O31 56
I/O25 35 CE4 46 I/O30 57
I/O26 36 WE4 47 I/O29 58
I/O10 3 GND 14 I/O13 25
A13
A14
NC
4
5
8
9
I/O11 15 I/O12 26
A6
A7
A9
37 I/O27 48 I/O28 59
38 A3 49 AO 60
41 WE3 52 I/O23 63
AS7S32K32
A10 16 OE
VCC 19 I/O7
CE1 20 I/O6
27
30
31
32
33
I/O0
I/O16 42 CE3 53 I/O22 64
I/O17 43 GND 54 I/O21 65
I/O18 44 I/O19 55 I/O20 66
I/O1 10 NC
21 I/O5
I/O2 11 I/O3 22 I/O4
AS7S128K32
Rev. 10/97
DS000064
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7-1
AS7S32K32
AS7S32K32
32K x 32 SRAM
AUSTIN SEMICONDUCTOR, INC.
ABSOLUTE MAXIMUM RATINGS*
Voltage of Vcc Supply Relative to Vss..........-1V to +7V
Storage Temperature..............................-55°C to +150°C
Short Circuit Output Current(per I/O).....................50mA
Voltage on Any Pin Relative to Vss...............-1V to +7V
Junction Temperature**.......................................+150°C
This is a stress rating only and functional operation on the device at
these or any other conditions above those indicated in the opera-
tional sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may af-
fect reliability.
**Maximum junction temperature depends upon package type,
*Stresses greater than those listed under “Absolute Maximum Rat- cycle time, loading, ambient temperature and airflow.
ings” may cause permanent damage to the device.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS
(-55°C ≤ TA ≤ 125°C; VCC = 5V ± 10%)
DESCRIPTION
CONDITIONS
SYMBOL
VIH
MIN
2.2
-0.5
-5
MAX
VCC+.5
0.8
UNITS
V
NOTES
1
Input High (Logic 1) Voltage
Input Low (Logic 0) Voltage
Input Leakage Current
Output Leakage Current
VIL
V
1, 2
0V ≤ VIN ≤ VCC
ILI
5
µA
µA
Outputs Disabled
ILO
-5
5
0V ≤ VOUT ≤ VCC
Output High Voltage
Output Low Voltage
IOH = -4.0mA
IOL = 8.0mA
VOH
VOL
2.4
4.5
V
V
1
1
0.4
5.5
Supply Voltage
VCC
V
1
MAX
-35
DESCRIPTION
CONDITIONS
SYMBOL
-20
-25
-45
UNITS
NOTES
Power Supply
Current: Operating
CE ≤ VIL; VCC = MAX
f = MAX = 1/ RC (MIN)
t
ICC
600 560 540 520
mA
3, 13
Output Open
Power Supply
Current: Standby
CE ≥ VIH; VCC = MAX
f = MAX = 1/ RC (MIN)
t
ISBT1
ISBT2
180 160 160 160
mA
mA
Output Open
CE ≥ VIH, All Other Inputs
≤ VIL or ≥ VIH, VCC = MAX
f = 0 Hz
100 100 100 100
CE ≥ VCC -0.2V;VCC = MAX
VIL ≤ VSS +0.2V
VIH ≥ VCC -0.2V; f = 0 Hz
ISBC2
ISBC2
20
16
20
16
20
16
20
16
mA
mA
“L” Version Only
CAPACITANCE
DESCRIPTION
CONDITIONS
= 25°C, f = 1MHz
SYMBOL
CI
MIN
MAX
32
UNITS
pF
NOTES
Input Capacitance
Output Capacitance
T
4
4
A
VCC = 5V
CO
12
pF
AS7S128K32
Rev. 10/97
DS000064
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7-2
AS7S32K32
AS7S32K32
32K x 32 SRAM
AUSTIN SEMICONDUCTOR, INC.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(-55°C ≤ T ≤ 125°C;VCC = 5V ±10%)
A
-20
-25
-35
MIN
DESCRIPTION
SYM
MIN
MAX
MIN
MAX
MAX
UNITS
NOTES
READ Cycle
READ cycle Time
tRC
tAA
tACE
tOH
20
25
35
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address access time
20
20
25
25
35
35
Chip Enable access time
Output hold from address change
Chip Enable to output in Low-Z
Chip disable to output in High-Z
Chip Enable to power-up time
Chip disable to power-down time
Output Enable access time
Output Enable to output in Low-Z
Output disable to output in High-Z
WRITE Cycle
2
3
2
3
2
3
tLZCE
tHZCE
tPU
9
10
12
6,7
4
0
0
0
0
0
0
tPD
20
8
25
10
35
12
4
tAOE
tLZOE
tHZOE
9
10
12
6
WRITE cycle time
tWC
tCW
tAW
tAS
20
15
15
0
25
17
17
0
35
20
20
0
ns
ns
ns
ns
ns
ns
ns
Chip Enable to end of write
Address valid to end of write
Address setup time
Address hold from end of write
WRITE pulse width
tAH
1
1
1
tWP1
tDS
15
10
17
12
20
15
Data setup time
Data hold time tDH
0
0
0
ns
15
Write disable to output in Low-Z
Write Enable to output in High-Z
tLZWE
tHZWE
3
3
3
ns
ns
7
10
12
6,7
AS7S128K32
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
Rev. 10/97
DS000064
7-3
AS7S32K32
32K x 32 SRAM
AUSTIN SEMICONDUCTOR, INC.
AC TEST CONDITIONS
+5V
+5V
480
Input pulse levels........................................VSS to 3V
Input rise and fall times........................................5ns
Input timing reference levels...............................1.5V
Output reference levels........................................1.5V
Output load..................................See Figures 1 and 2
480
Q
Q
255
255
5pF
30pF
Fig. 2 OUTPUT LOAD
EQUIVALENT
Fig. 1 OUTPUT LOAD
EQUIVALENT
NOTES
7. At any given temperature and voltage condition,
HZCE is less than tLZCE and tHZWE is less than tLZWE.
1. All voltages referenced to VSS (GND).
2. -3v for pulse width <20ns.
t
8. WE is HIGH for READ cycle.
3. ICC is dependent on output loading and cycle rates.
The specified value applies with the outputs
4. This parameter is sampled.
9. Device is continuously selected. Chip enables and output
enable are held in their active state.
10. Address valid prior to or coincident with latest occurring
chip enable.
11. tRC= READ cycle time.
12. Chip enable (CE) and write enable (WE) can initiate and
terminate a WRITE cycle.
1
HZ.
unloaded, and f=
tRC(MIN)
5. Test conditions as specified with output loading as
shown in Fig. 1 unless otherwise noted.
6. tHZCE, tHZOE and tHZWE are specified with CL= 5pF
as in Fig. 2. Transition is measured +/- 500 mV
typical from steady state voltage, allowing for actual
tester RC time constant.
13. ICC is for 32 bit mode.
DESCRIPTION
CONDITIONS
SYMBOL
MIN
MAX
—
UNITS
V
NOTES
VCC for Retention Data
Data Retention Current
VDR
2
CE ≥ (VCC - 0.2V) VCC = 2V
VIN ≥ (VCC - 0.2V)
ICCDR
4
mA
or ≤ 0.2V
VCC = 3V
8
mA
ns
Chip Deselect to Data
Retention Time
tCDR
tR
0
—
4
Operation Recovery Time
tRC
ns
4, 11
DATA RETENTION MODE
VCC
VDR>2V
VDR
4.5V
4.5V
tCDR
tR
VIH-
VIL-
CE
AS7S128K32
Rev. 10/97
DS000064
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7-4
AS7S32K32
32K x 32 SRAM
AUSTIN SEMICONDUCTOR, INC.
READ CYCLE NO. 18, 9
t
RC
ADDR
VALID
t
AA
t
OH
PREVIOUS DATA VALID
DATA VALID
Q
READ CYCLE NO. 2 7, 8, 10
t
RC
CE
OE
t
AOE
t
t
t
LZOE
HZOE
t
ACE
HZCE
t
LZCE
HIGH-Z
DATA VALID
DQ
Icc
t
t
PD
PU
AS7S128K32
Rev. 10/97
DS000064
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7-5
AS7S32K32
32K x 32 SRAM
AUSTIN SEMICONDUCTOR, INC.
WRITE CYCLE NO. 1 12
(Chip Enable Controlled)
t
WC
ADDR
t
AW
t
t
t
AH
AS
CW
CE
t
WP
WE
t
t
DH
DS
DQ
DATA VALID
WRITE CYCLE NO. 2 7, 12
(Write Enable Controlled)
t
WC
ADDR
t
AW
t
t
AH
CW
CE
t
t
AS
WP
WE
t
t
DH
DS
DATA VALID
DQ
AS7S128K32
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7-6
Rev. 10/97
DS000064
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