MT5C6808C-45/883C [MICROSS]

Standard SRAM, 8KX8, 45ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28;
MT5C6808C-45/883C
型号: MT5C6808C-45/883C
厂家: MICROSS COMPONENTS    MICROSS COMPONENTS
描述:

Standard SRAM, 8KX8, 45ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28

CD 静态存储器 内存集成电路
文件: 总12页 (文件大小:170K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SRAM  
MT5C6408  
8K x 8 SRAM  
SRAM MEMORY ARRAY  
PIN ASSIGNMENT  
(Top View)  
AVAILABLE AS MILITARY  
SPECIFICATIONS  
• SMD 5962-38294  
28-Pin DIP (C)  
(300 MIL)  
28-Pin LCC (EC)  
NC  
A12  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0 10  
DQ1 11  
DQ2 12  
DQ3 13  
Vss 14  
1
2
3
4
5
6
7
8
9
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
Vcc  
WE\  
CE2  
A8  
MIL-STD-883  
FEATURES  
A9  
A11  
OE\  
A10  
CE1\  
DQ8  
DQ7  
DQ6  
DQ5  
DQ4  
• High Speed: 12, 15, 20, 25, 35, 45, 55, and 70ns  
• Battery Backup: 2V data retention  
• High-performance, low-power CMOS double-metal  
process  
• Single +5V (+10%) Power Supply  
• Easy memory expansion with CE1\ and CE2  
• All inputs and outputs are TTL compatible  
28-Pin Flat Pack (F)  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
NC  
A12  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
Vcc  
WE\  
CE2  
A8  
2
3
4
5
A9  
OPTIONS  
• Timing  
MARKING  
6
A11  
OE\  
A10  
CE1\  
DQ8  
DQ7  
DQ6  
DQ5  
DQ4  
7
8
12ns access  
15ns access  
20ns access  
25ns access  
35ns access  
45ns access  
55ns access  
70ns access  
-12  
-15  
-20  
-25  
-35  
-45  
-55*  
-70*  
9
10  
11  
12  
13  
14  
A0  
DQ1  
DQ2  
DQ3  
Vss  
GENERAL DESCRIPTION  
The MT5C6408, 8K x 8 SRAM, employs high-speed,  
low-power CMOS technology, eliminating the need for clocks  
or refreshing. These SRAM’s have equal access and cycle  
times.  
For exibility in high-speed memory applications,  
Micross Components offers dual chip enables (CE1\, CE2)  
and output enable (OE\) capability. These enhancements can  
place the outputs in High-Z for additional exibility in system  
design.  
• Package(s)  
Ceramic DIP (300 mil)  
Ceramic LCC  
C
E C  
F
No. 108  
No. 204  
No. 302  
Ceramic Flatpack  
• Operating Temperature Ranges  
Industrial (-40oC to +85oC)  
Military (-55oC to +125oC)  
IT  
XT  
Writing to these devices is accomplished when write  
enable (WE\) and CE1\ inputs are both LOW and CE2 is HIGH.  
Reading is accomplished when WE\ and CE2 remain HIGH  
and CE1\ and OE\ go LOW. The device offers a reduced power  
standby mode when disabled. This allows system designs to  
achieve low standby power requirements.  
• 2V data retention/low power  
L
*Electrical characteristics identical to those provided for the 45ns ac-  
cess devices.  
These devices operate from a single +5V power supply  
and all inputs and outputs are fully TTL compatible.  
For more products and information  
please visit our web site at  
www.micross.com  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
1
SRAM  
MT5C6408  
FUNCTIONAL BLOCK DIAGRAM  
VCC  
Vss  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
DQ8  
DQ1  
65,536-BIT  
MEMORY ARRAY  
CE1\  
CE2  
COLUMN DECODER  
OE\  
WE\  
A8  
A9  
A10 A11 A12  
POWER  
DOWN  
TRUTH TABLE  
MODE  
STANDBY  
STANDBY  
READ  
READ  
WRITE  
CE1\ CE2 WE\ OE\  
DQ  
POWER  
H
X
L
L
L
X
L
H
H
H
X
X
H
H
L
X
X
L
H
X
HIGH-Z STANDBY  
HIGH-Z STANDBY  
Q
ACTIVE  
HIGH-Z ACTIVE  
ACTIVE  
D
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
2
SRAM  
MT5C6408  
ABSOLUTE MAXIMUM RATINGS*  
*Stresses greater than those listed under “Absolute Maxi-  
Voltage on any Input or DQ Relative to Vss........-0.5V to +7.0V mum Ratings” may cause permanent damage to the device.  
Voltage on Vcc Supply Relative to Vss.................-0.5V to +7.0V This is a stress rating only and functional operation of the  
Storage Temperature….........................................-65oC to +150oC device at these or any other conditions above those indicated  
Power Dissipation......................................................................1W in the operation section of this specication is not implied.  
Max Junction Temperature..................................................+175°C Exposure to absolute maximum rating conditions for ex-  
Lead Temperature (soldering 10 seconds)........................+260oC tended periods may affect reliability.  
Short Circuit Output Current................................................50mA  
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS  
(-55oC < TC < 125oC; VCC = 5V +10%)  
DESCRIPTION  
CONDITIONS  
SYMBOL  
MIN  
2.2  
MAX  
Vcc+0.5  
0.8  
UNITS  
V
NOTES  
1
VIH  
Input High (Logic 1) Voltage  
Input Low (Logic 0) Voltage  
Input Leakage Current  
VIL  
ILI  
-0.5  
-10  
V
1, 2  
μA  
0V VIN Vcc  
10  
Output(s) disabled  
0V < VOUT < Vcc  
ILO  
Output Leakage Current  
μA  
V
-10  
2.4  
10  
I
OH = -4.0mA  
VOH  
VOL  
Output High Voltage  
Output Low Voltage  
1
1
IOL = 8.0mA  
0.4  
V
MAX  
PARAMETER  
CONDITIONS  
SYM  
-12  
-15  
-20  
-25  
-35  
-45 UNITS NOTES  
CE\ < VIL; VCC = MAX  
f = MAX = 1/tRC (MIN)  
Output Open  
Power Supply  
Current: Operating  
180  
170  
160  
155  
155  
145  
mA  
3
I
cc  
CE\ > VIH; All Other Inputs  
< VIL or > VIH, VCC = MAX  
f = 0 Hz  
40  
30  
20  
10  
40  
30  
20  
10  
40  
30  
20  
10  
40  
30  
20  
10  
40  
30  
20  
10  
40  
30  
20  
10  
mA  
mA  
mA  
mA  
ISBTSP  
ISBTLP  
ISBCSP  
ISBCLP  
Power Supply  
Current: Standby  
CE\ > (VCC -0.2); VCC = MAX  
All Other Inputs < 0.2V  
or > (VCC - 0.2V), f = 0 Hz  
CAPACITANCE  
DESCRIPTION  
CONDITIONS  
SYM  
MAX UNITS NOTES  
TA = 25oC, f = 1MHz  
Vcc = 5V  
Input Capacitance  
6
7
pF  
pF  
4
4
CI  
Output Capacitance  
CO  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
3
SRAM  
MT5C6408  
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS  
(Note 5) (-55oC < TC < 125oC; VCC = 5V +10%)  
-12  
-15  
-20  
-25  
-35  
-45  
DESCRIPTION  
READ CYCLE  
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX UNITS NOTES  
SYMBOL  
tRC  
tAA  
tACE  
tOH  
READ cycle time  
12  
15  
20  
25  
35  
45  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address access time  
12  
12  
15  
15  
20  
20  
25  
25  
35  
35  
45  
45  
Chip Enable access time  
Output hold from address change  
2
2
0
0
0
0
0
0
3
0
3
0
tLZCE  
tHZCE  
tAOE  
tLZOE  
tHZOE  
7
Chip Enable to output in Low-Z  
Chip disable to output in High-Z  
Output Enable access time  
Output Enable to output in Low-Z  
Output disable to output in High-Z  
WRITE CYCLE  
7
8
10  
12  
15  
15  
15  
15  
15  
15  
25  
20  
6, 7  
0
0
0
0
0
0
7
10  
15  
15  
30  
40  
6
tWC  
tCW  
tAW  
WRITE cycle time  
12  
10  
10  
0
15  
13  
13  
0
20  
15  
15  
0
25  
20  
20  
0
35  
30  
30  
0
45  
40  
40  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Chip Enable to end of write  
Address valid to end of write  
Address setup time  
tAS  
tAH  
Address hold from end of write  
WRITE pulse width  
0
0
0
0
0
0
tWP  
10  
7
13  
10  
0
15  
12  
0
20  
15  
0
30  
15  
5
40  
20  
5
tDS  
Data setup time  
tDH  
Data hold time  
0
tLZWE  
tHZWE  
Write disable to output in Low-Z  
Write Enable to output in High-Z  
2
0
0
0
0
0
7
0
7
0
10  
0
10  
0
15  
0
15  
0
25  
6, 7  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
4
SRAM  
MT5C6408  
AC TEST CONDITIONS  
Input pulse levels ...................................... Vss to 3.0V  
Input rise and fall times ......................................... 5ns  
Input timing reference levels ................................ 1.5V  
Output reference levels ....................................... 1.5V  
Output load ................................. See Figures 1 and 2  
167Ω  
167Ω  
Q
Q
VTH = 1.73V  
VTH = 1.73V  
5pF  
30pF  
Fig. 1 Output Load  
Equivalent  
Fig. 2 Output Load  
Equivalent  
7. At any given temperature and voltage condition,  
tHZCE is less than tLZCE, and tHZWE is less than tLZWE and  
NOTES  
1. All voltages referenced to VSS (GND).  
2. -3V for pulse width < 20ns  
tHZOE is less than tLZOE  
.
3. ICC is dependent on output loading and cycle rates.  
The specied value applies with the outputs  
8. WE\ is HIGH for READ cycle.  
9. Device is continuously selected. Chip enables and  
output enables are held in their active state.  
10. Address valid prior to, or coincident with, latest  
occurring chip enable.  
unloaded, and f =  
1
Hz.  
tRC (MIN)  
4. This parameter is guaranteed but not tested.  
5. Test conditions as specied with the output loading  
as shown in Fig. 1 unless otherwise noted.  
t
11. RC = Read Cycle Time.  
12. CE2 timing is the same as CE1\ timing. The waveform  
6. tLZCE, tLZWE, tLZOE, tHZCE, tHZOE and tHZWE  
are specied with CL = 5pF as in Fig. 2. Transition is  
measured ±200mV typical from steady state voltage,  
allowing for actual tester RC time constant.  
is  
inverted.  
13. Chip enable (CE1\, CE2) and write enable (WE\) can  
initiate and terminate a WRITE cycle.  
DATA RETENTION ELECTRICAL CHARACTERISTICS (L Version Only)  
DESCRIPTION  
CONDITIONS  
SYM  
MIN  
MAX UNITS NOTES  
2
---  
300  
---  
V
V
CC for Retention Data  
VDR  
CE\ > (VCC - 0.2V)  
Data Retention Current  
μA  
VCC = 2V ICCDR  
VIN > (VCC - 0.2V)  
or < 0.2V  
Chip Deselect to Data  
Retention Time  
tCDR  
tR  
0
ns  
ns  
4
Operation Recovery Time  
4, 11  
tRC  
LOW Vcc DATA RETENTION WAVEFORM  
DATA RETENTION MODE  
VCC  
4.5V  
4.5V  
VDR > 2V  
tCDR  
tR  
VIH  
VIL  
VDR  
CE\  
DON’T CARE  
UNDEFINED  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
5
SRAM  
MT5C6408  
READ CYCLE NO. 1 8, 9  
t
RC
VALID  
ADDRESS  
Q  
t
AA
tOH  
PREVIOUS DATA VALID  
DATA VALID  
READ CYCLE NO. 2 7, 8, 10, 12  
tR  
C
CE\  
tA  
OE
tHZOE  
tLZOE  
OE\  
DQ  
Icc  
tLZCE  
tHZCE  
t
E  
ACE  
DATA VALID  
t
PU  
tP  
D
DON’T CARE  
UNDEFINED  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
6
SRAM  
MT5C6408  
WRITE CYCLE NO. 1 12  
(Chip Enabled Controlled)  
tWC  
ADDRESS  
tA  
W
tAH  
tAS  
tCW  
CE\  
tW  
P
WE\  
tDH  
t
DS  
DQ  
DATA VAILD  
7, 12, 13  
WRITE CYCLE NO. 2  
(Write Enabled Controlled)  
tW  
t
C
ADDRESS  
tAW  
tAW  
tAH  
tCW  
CE\  
tAS  
t
WP  
WE\  
tDS  
tDH  
tDH  
DQ  
DATA VALID  
DON’T CARE  
UNDEFINED  
NOTE: Output enable (OE\) is inactive (HIGH).  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
7
SRAM  
MT5C6408  
MECHANICAL DEFINITIONS*  
Micross Case #108 (Package Designator C)  
SMD 5962-38294, Case Outline Z  
D
S2  
A
Q
L
E
e
b
S1  
b2  
eA  
c
SMD SPECIFICATIONS  
MIN  
SYMBOL  
MAX  
0.225  
0.026  
0.065  
0.018  
1.485  
0.310  
A
b
b2  
c
D
E
---  
0.014  
0.045  
0.008  
---  
0.240  
eA  
e
0.300 BSC  
0.100 BSC  
L
0.125  
0.015  
0.005  
0.005  
0.200  
0.070  
---  
Q
S1  
S2  
---  
NOTE: These dimensions are per the SMD. Microsspackage dimensional limits  
may differ, but they will be within the SMD limits.  
* All measurements are in inches.  
MT5C6408  
Micross Components reserves the right to change products or specications without notice.  
Rev. 4.2 01/10  
8
SRAM  
MT5C6408  
MECHANICAL DEFINITIONS*  
Micross Case #204 (Package Designator EC)  
SMD 5962-38294, Case Outline U  
D1  
B2  
D2  
L2  
e
E3  
E
E1  
E2  
h x 45o  
D
L
hx45o  
B1  
D3  
A
A1  
SMD SPECIFICATIONS  
SYMBOL  
MIN  
MAX  
0.075  
0.065  
0.028  
A
A1  
B1  
B2  
D
0.060  
0.050  
0.022  
0.072 REF  
0.342  
0.358  
D1  
D2  
D3  
E
0.200 BSC  
0.100 BSC  
---  
0.540  
0.358  
0.560  
E1  
E2  
E3  
e
0.400 BSC  
0.200 BSC  
---  
0.558  
0.050 BSC  
0.040 REF  
h
L
L2  
0.045  
0.075  
0.055  
0.095  
NOTE: These dimensions are per the SMD. Microsspackage dimensional limits  
may differ, but they will be within the SMD limits.  
* All measurements are in inches.  
MT5C6408  
Micross Components reserves the right to change products or specications without notice.  
Rev. 4.2 01/10  
9
SRAM  
MT5C6408  
MECHANICAL DEFINITIONS*  
Micross Case #302 (Package Designator F)  
SMD 5962-38294, Case Outline M  
e
b
D
S
Top View  
E
L
A
c
Q
E2  
E3  
SMD SPECIFICATIONS  
SYMBOL  
MIN  
0.045  
0.015  
0.004  
---  
0.350  
0.180  
0.030  
MAX  
0.115  
0.019  
0.009  
0.640  
0.420  
---  
A
b
c
D
E
E2  
E3  
e
---  
0.050 BSC  
L
Q
S
0.250  
0.026  
0.000  
0.370  
0.045  
---  
NOTE: These dimensions are per the SMD. Microsspackage dimensional limits  
may differ, but they will be within the SMD limits.  
* All measurements are in inches.  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
10  
SRAM  
MT5C6408  
ORDERING INFORMATION  
EXAMPLE: MT5C6408C-25L/XT  
EXAMPLE: MT5C6408EC-15L/IT  
Package Speed  
Device Number  
Package Speed  
Options** Process  
Device Number  
Options** Process  
Type  
C
ns  
-12  
-15  
-20  
-25  
-35  
-45  
-55  
-70  
Type  
EC  
EC  
EC  
EC  
EC  
EC  
EC  
EC  
ns  
-12  
-15  
-20  
-25  
-35  
-45  
-55  
-70  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
L
L
L
L
L
L
L
L
/*  
/*  
/*  
/*  
/*  
/*  
/*  
/*  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
L
L
L
L
L
L
L
L
/*  
/*  
/*  
/*  
/*  
/*  
/*  
/*  
C
C
C
C
C
C
C
EXAMPLE: MT5C6408F-55/883C  
Package Speed  
Device Number  
Options** Process  
Type  
ns  
-12  
-15  
-20  
-25  
-35  
-45  
-55  
-70  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
MT5C6408  
F
F
F
F
F
F
F
F
L
L
L
L
L
L
L
L
/*  
/*  
/*  
/*  
/*  
/*  
/*  
/*  
*AVAILABLE PROCESSES  
IT = Industrial Temperature Range  
XT = Extended Temperature Range  
883C = Full Military Processing  
-40oC to +85oC  
-55oC to +125oC  
-55oC to +125oC  
** OPTIONS  
L = 2V Data Retention/Low Power  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
11  
SRAM  
MT5C6408  
MICROSS TO DSCC PART NUMBER  
CROSS REFERENCE*  
Micross Package Designator EC  
Micross Package Designator C  
Micross Part #  
SMD Part #  
MT5C6808EC-12/883C  
MT5C6808EC-12L/883C  
MT5C6808EC-20/883C  
MT5C6808EC-20L/883C  
MT5C6808EC-25/883C  
MT5C6808EC-25L/883C  
MT5C6808EC-35/883C  
MT5C6808EC-35L/883C  
MT5C6808EC-45/883C  
MT5C6808EC-45L/883C  
MT5C6808EC-55/883C  
MT5C6808EC-55L/883C  
MT5C6808EC-70/883C  
5962-3829447MUX  
5962-3829446MUX  
5962-3829458MUA  
5962-3829457MUA  
5962-3829456MUA  
5962-3829455MUA  
5962-3829454MUA  
5962-3829453MUA  
5962-3829452MUA  
5962-3829451MUA  
5962-3829450MUA  
5962-3829449MUA  
5962-3829448MUA  
Micross Part #  
SMD Part #  
MT5C6808C-12/883C  
MT5C6808C-12L/883C  
MT5C6808C-20/883C  
MT5C6808C-20L/883C  
MT5C6808C-25/883C  
MT5C6808C-25L/883C  
MT5C6808C-35/883C  
MT5C6808C-35L/883C  
MT5C6808C-45/883C  
MT5C6808C-45L/883C  
MT5C6808C-55/883C  
MT5C6808C-55L/883C  
MT5C6808C-70/883C  
5962-3829447MZX  
5962-3829446MZX  
5962-3829458MZA  
5962-3829457MZA  
5962-3829456MZA  
5962-3829455MZA  
5962-3829454MZA  
5962-3829453MZA  
5962-3829452MZA  
5962-3829451MZA  
5962-3829450MZA  
5962-3829449MZA  
5962-3829448MZA  
Micross Package Designator F  
Micross Part #  
SMD Part #  
MT5C6808F-12/883C  
MT5C6808F-12L/883C  
MT5C6808F-20/883C  
MT5C6808F-20L/883C  
MT5C6808F-25/883C  
MT5C6808F-25L/883C  
MT5C6808F-35/883C  
MT5C6808F-35L/883C  
MT5C6808F-45/883C  
MT5C6808F-45L/883C  
MT5C6808F-55/883C  
MT5C6808F-55L/883C  
MT5C6808C-70/883C  
5962-3829447MMX  
5962-3829446MMX  
5962-3829458MMA  
5962-3829457MMA  
5962-3829456MMA  
5962-3829455MMA  
5962-3829454MMA  
5962-3829453MMA  
5962-3829452MMA  
5962-3829451MMA  
5962-3829450MMA  
5962-3829449MMA  
5962-3829448MZA  
*Micross part number is for reference only. Orders received referencing the SMD part number will be processed per the SMD.  
Micross Components reserves the right to change products or specications without notice.  
MT5C6408  
Rev. 4.2 01/10  
12  

相关型号:

MT5C6808EC-12L/883C

Standard SRAM, 8KX8, 12ns, CMOS, CQCC28, CERAMIC, LCC-28
MICROSS

MT5C6808EC-20/883C

Standard SRAM, 8KX8, 20ns, CMOS, CQCC28, CERAMIC, LCC-28
MICROSS

MT5C6808EC-25L/883C

Standard SRAM, 8KX8, 25ns, CMOS, CQCC28, CERAMIC, LCC-28
MICROSS

MT5C6808EC-35L/883C

Standard SRAM, 8KX8, 35ns, CMOS, CQCC28, CERAMIC, LCC-28
MICROSS

MT5C6808EC-45/883C

Standard SRAM, 8KX8, 45ns, CMOS, CQCC28, CERAMIC, LCC-28
MICROSS

MT5C6808EC-45L/883C

Standard SRAM, 8KX8, 45ns, CMOS, CQCC28, CERAMIC, LCC-28
MICROSS

MT5C6808EC-70/883C

Standard SRAM, 8KX8, 70ns, CMOS, CQCC28, CERAMIC, LCC-28
MICROSS

MT5C6808F-12/883C

Standard SRAM, 8KX8, 12ns, CMOS, CDSO28, CERAMIC, FLATPACK-28
MICROSS

MT5C6808F-12L/883C

Standard SRAM, 8KX8, 12ns, CMOS, CDSO28, CERAMIC, FLATPACK-28
MICROSS

MT5C6808F-20/883C

Standard SRAM, 8KX8, 20ns, CMOS, CDSO28, CERAMIC, FLATPACK-28
MICROSS

MT5C6808F-20L/883C

Standard SRAM, 8KX8, 20ns, CMOS, CDSO28, CERAMIC, FLATPACK-28
MICROSS

MT5C6808F-25/883C

Standard SRAM, 8KX8, 25ns, CMOS, CDSO28, CERAMIC, FLATPACK-28
MICROSS