0577-0-67-80-21-01-10-0 [MILL-MAX]

PCB Terminal;
0577-0-67-80-21-01-10-0
型号: 0577-0-67-80-21-01-10-0
厂家: MILL-MAX MFG. CORP.    MILL-MAX MFG. CORP.
描述:

PCB Terminal

PC
文件: 总2页 (文件大小:227K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
solutions  
MAXIMUM  
Receptacles on Tape for Automated Assembly  
Mill-Max offers receptacles (discrete sockets) on carrier tape per EIA-481 to feed automated ‘pick &  
place’ assembly equipment. Our standard reel size is13”.  
• Two types of receptacles are available on carrier tape: surface mount, flat types, which sit on the  
surface of the PCB where the pin or component lead plugs-in parallel to the PCB; and thru-hole types  
where the lead plugs-in perpendicular to the PCB. Thru-hole receptacles are intrusive reflow soldered*.  
Our increasingly popular thru-hole (tubular) receptacles have an Organic Fibre Plug® barrier which  
prevents solder, paste or flux from contaminating the spring contact. After soldering, the OFP®  
barrier is pushed out of the receptacle when the device is plugged in.  
• Also new for Mill-Max is the availability of RoHS compliant plating options. Instead of traditional  
tin/lead plating on the receptacle’s shell and contact, a pure matte tin with oxide and whisker inhibitors  
can be specified.  
*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional thru-hole components in a reflow soldering  
process. The receptacles are placed into plated-thru-holes in the circuit board (solder paste has previously been screen printed  
on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-  
thru-holes and achieve solder joints as reliable as wave soldering. The OFP® barrier prevents solder paste from being picked-  
up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder mask can be used to adjust the volume  
of paste required to fill each hole.  
(10/07-558)  
R
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, Oyster Bay, NY 11771-0300  
516-922-6000 • Fax: 516-922-9253 • www.mill-max.com  
Maximum Interconnect Solutions  
RECEPTACLES ON TAPE per EIA-481  
for automated “pick & place” assembly.  
PINS  
Surface Mount & OFP® thru hole, “intrusive” reflow soldered  
3907  
8806  
6628  
.080  
.059  
.080  
.059  
.078  
.057  
3907-0-5X-XX-30-XX-10-0 8806-0-5X-XX-47-XX-40-0 6628-0-5X-XX-18-XX-10-0  
Surface Mount.  
Surface Mount.  
#47 Contact for Ø.025-.037 pins.  
Supplied on 12mm wide carrier tape,  
4,000 per 13” reel.  
Surface Mount.  
#18 Contact for Ø.037-.043 pins.  
Supplied on 12mm wide carrier tape,  
3,700 per 13” reel.  
#30 Contact for Ø.015-.025 pins.  
Supplied on 12mm wide carrier tape,  
4,000 per 13” reel,.  
9184  
9222  
0577  
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9184-0-5X-XX-02-XX-40-0 9222-2-5X-XX-02-XX-40-0  
0577-0-6X-XX-21-XX-10-0  
OFP® thru hole, “intrusive” reflow  
soldered in Ø.045 .003 ꢀPT.  
#21 Contact for Ø.015-.022 pins.  
Supplied on 12mm wide carrier tape,  
3,000 per 13” reel.  
Bottom entry, “intrusive” reflow  
soldered in Ø.095 .003 ꢀPT.  
#02 Contact for Ø.040-.050 pins.  
Supplied on 12mm wide carrier tape,  
1,500 per 13” reel.  
Bottom entry, “intrusive” reflow  
soldered in Ø.085 .003 ꢀPT.  
#02 Contact for Ø.040-.050 pins.  
Supplied on 12mm wide carrier tape,  
1,500 per 13” reel.  
Carrier tape format for  
9184 & 9222  
4015  
4280  
9873  
5364  
.120 DIA.  
.078 DIA.  
.020  
.100 DIA.  
.030  
.068 DIA.  
.020  
.110  
.062 DIA.  
.093  
.018  
.125  
.150  
.098 DIA.  
.089  
.052 DIA.  
.089  
.125  
.078 DIA.  
.100  
.100  
.075 DIA.  
.067 DIA.  
.056 DIA.  
.068 DIA.  
.009  
.009  
.051 DIA.  
.009  
.043 DIA.  
.009  
4015-0-6X-XX-30-XX-10-0 4280-0-6X-XX-16-XX-10-0 9873-0-6X-XX-02-XX-10-0 5364-0-6X-XX-23-XX-10-0  
OFP® thru hole, “intrusive” reflow  
soldered in Ø.057 .003 ꢀPT.  
#30 Contact for Ø.015-.025 pins.  
Supplied on 8mm wide carrier tape,  
5,500 per 13” reel.  
OFP® thru hole, “intrusive” reflow  
soldered in Ø.067 .003 ꢀPT.  
#16 Contact for Ø.022-.034 pins.  
Supplied on 8mm wide carrier tape,  
5,500 per 13” reel.  
OFP® thru hole, “intrusive” reflow  
soldered in Ø.083 .003 ꢀPT.  
#02 Contact for Ø.040-.050 pins.  
Supplied on 12mm wide carrier tape,  
4,500 per 13” reel.  
OFP® thru hole, “intrusive” reflow  
soldered in Ø.103 .003 ꢀPT.  
#23 Contact for Ø.045-.065 pins.  
Supplied on 12mm wide carrier tape,  
2,000 per 13” reel.  
ORDER CODE: XXXX - X - XX - XX - XX - XX -XX - 0  
BASIC PART #  
REEL SIZE: 7 = 13”  
SPECIFICATIONS  
2O(3  
SHELL MATERIAL:  
Brass Alloy 360, 1/2 Hard  
ꢀꢁꢁꢀꢂꢃꢄꢂ%#  
SPECIFY SHELL FINISH:  
01 200μ" TIN/LEAD OVER NICKEL  
80 200μ" TIN OVER NICKEL  
SPECIFY CONTACT FINISH:  
27 30μ" GOLD OVER NICKEL  
01 200μ" TIN/LEAD or 02 100μ" TIN/LEAD OVER NICKEL  
CONTACT MATERIAL:  
Beryllium Copper Alloy 172, HT  
80 200μ" TIN  
or  
84 100μ" TIN OVER NICKEL  
DIMENSION IN INCHES  
TOLERANCES ON:  
CONTACT TYPE  
#21, #30, #16, #47, #18, #02, #03 or #23  
Use with #21 & #30 Contacts Only  
LENGTHS:  
DIAMETERS: .002  
ANGLES: 2ꢁ  
.00ꢀ  
(DATA ON PAGES 206-214)  
The ORGANIC FIBRE PLUG® (OFP®) barrier prevents solder, paste or flux from contaminating the spring contact.  
After soldering, the OFP® barrier is pushed out of the receptacle when the device is plugged in.  
www.mill-max.com  
516-922-6000  
PR558  

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