596-10-169-07-001461 [MILL-MAX]

IC Socket, BGA169, 169 Contact(s),;
596-10-169-07-001461
型号: 596-10-169-07-001461
厂家: MILL-MAX MFG. CORP.    MILL-MAX MFG. CORP.
描述:

IC Socket, BGA169, 169 Contact(s),

文件: 总2页 (文件大小:682K)
中文:  中文翻译
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BALL GRID ARRAYS  
For 0.8mm Grid  
Series 5XX  
Male Pin Adapters & Female Socket  
BGA adapter/socket systems are a reliable way to make BGAs  
pluggable, they may also be used as a  
high density board-to-board interconnect.  
The BGA device is soldered to a 9929  
adapter (or a 7929 adapter is soldered  
to a PCB); and then either one can be  
plugged into a 9645 surface mount socket.  
Both socket and adapter have the same  
footprint as the BGA device.  
Insertion force is only .4N per pin, and a pry-bar tool  
(part #828-01-010) is available for extraction.  
Insulator material is FR-4 epoxy having a TCE to match the BGA  
device and circuit board.  
Mill-Max offers the option of having the solder surfaces of the 7929  
adapter pre-tinned, the 9645 socket is pre-tinned as standard.  
Ordering Information  
BGA MOUNT  
ADAPTER PIN TYPE 9929  
FOR BGA MOUNT ADAPTERS  
Locate footprint pattern from page 111.2, the middle 8 digits of the part  
number will be located under the pattern.  
.024 DIA.  
Series  
Plating  
Code  
Window  
.047  
.010 DIA.  
.054  
5 9 9  
1 0  
- -  
4 2 9  
- -  
.123  
No. of pins  
Grid size  
Pattern #  
Determined from footprint pattern on page 111.2  
FOR PCB MOUNT ADAPTERS  
Locate footprint pattern from page 111.2, the middle 8 digits of the part  
PRINTED CIRCUIT MOUNT  
ADAPTER PIN TYPE 7929  
number will be located under the pattern.  
Series  
Plating  
Code  
Window  
PRE-TINNED  
OPTION  
5 7 9  
5 9 6  
1 0  
4 2 9  
4 6 1  
- -  
- -  
- -  
- -  
Grid size  
.018  
.024 DIA.  
.047  
.010 DIA.  
PRE-  
TINNED  
1 0  
.054  
.141  
No. of pins  
Pattern #  
Determined from footprint pattern on page 111.2  
PLATING CODE XX=  
Pin Plating  
10  
10µ” Au  
FOR FEMALE SOCKETS  
Locate footprint pattern from page 111.2, the middle 8 digits of the part  
number will be located under the pattern.  
SURFACE MOUNT  
RECEPTACLE TYPE 9645  
Series  
Plating  
Code  
Window  
.027 DIA.  
.025  
5 9 6  
1 1  
4 4 5  
- -  
- -  
.090  
No. of pins  
Grid size  
Pattern #  
.047  
.024 DIA.  
Determined from footprint pattern on page 111.2  
PRE-TINNED  
STANDARD  
11  
SPECIFY PLATING CODE XX=  
Sleeve (Pin)  
10µ” Au  
10µ” Au  
Contact (Clip)  
www.mill-max.com  
516-922-6000  
111.1  
BALL GRID ARRAY FOOTPRINTS (0.8mm GRID)  
Top view shown. Many other standard footprints are available.  
Visit www.mill-max.com for a complete selection.  
.035 TYP.  
0.8mm TYP.  
13 X 13  
11 X 11  
13 X 13  
14 X 14  
XXX-XX-169-07-001  
XXX-XX-100-06-001  
XXX-XX-144-07-001  
XXX-XX-131-07-001  
14 X 14  
15 X 15  
14 X 14  
18 X 18  
XXX-XX-196-07-001  
XXX-XX-225-08-001  
XXX-XX-324-09-001  
XXX-XX-179-07-001  
20 X 20  
22 X 22  
23 X 23  
26 X 26  
XXX-XX-400-10-007  
XXX-XX-484-11-000  
XXX-XX-424-12-001  
XXX-XX-676-13-001  
SPECIFICATIONS:  
Materials:  
- Dielectric withstanding voltage: 500 V  
RMS  
- Capacitance between adjacent contacts: 1 pF max.  
- Self inductance per pin: 2 nH max.  
- Electrical length: 31 pS  
- Socket contact: Three finger, stamped beryllium  
copper alloy 172, HT (Mill-Max type #04); plated 10µ”  
gold over 50µ” nickel  
- Socket shell and adapter pins: Precision machined  
brass alloy; plated 10µ” gold over 100µ” nickel  
- Insulator material: .047” thick glass-epoxy type FR-4,  
Environmental:  
- Operating temperature range: -55 °C to +125 °C  
BGA adapter/socket systems have withstood the following  
environmental tests without mechanical or electrical failure:  
- Damp heat, steady state: 40 °C, 93% rH, 21 days  
- Damp heat, cyclic: 25/55 °C, 6 days  
rated UL94V-0.  
TCE = 10-13ppm/°C, ε = 5.0  
r
Mechanical:  
- Insertion and withdrawal forces (using .010” dia.  
polished steel gage pin): Insertion: .36N typ. per pin  
Withdrawal: .20N typ. per pin  
- Insertion force of an actual 225 pin device: 90N  
- Durability: 100 cycles  
- Dry heat: 100°C, 1,000 hours  
- Thermal shock: -55 to +125 °C, 5 cycles  
- Random vibration: 50 to 500 Hz, 8g, 20 min. per axis  
- Shock: 50 g per axis  
- Solderability: 235 °C, 2 seconds  
- Resistance to soldering heat: 270 °C, 10 seconds  
- Resistance to corrosion:  
- Coplanarity: <.005”  
Electrical:  
- Current rating (per pin): 1 A  
Salt spray: 48 hours  
- Working voltage: 100 V  
- Low level contact resistance: 10 mmax.  
/150 V  
max.  
DC  
RMS  
Sulphur dioxide: 96 hours @ 25 ppm SO , 25 °C, 75% rH  
2
Hydrogen sulphide: 96 hours @ 12 ppm H S, 25°C, 75% rH  
2
- Insulation resistance @ 500 V  
:
RMS  
Initial value: 1,000,000 Mmin.  
After climatic tests: 10,000 Mmin.  
www.mill-max.com  
516-922-6000  
111.2  

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