834-43-016-10-001000 [MILL-MAX]
Board Connector, 16 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT;
| 型号： | 834-43-016-10-001000 |
| 厂家： | 
MILL-MAX MFG. CORP. |
| 描述： | Board Connector, 16 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT |
| 文件： | 总1页 (文件大小：586K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTERCONNECTS
®
-
SERIES 834 & 835 • 2,54 GRID OFP PASS THROUGH SOCKETS
Ø0,76 & £0,64 PINS• SINGLE AND DOUBLE ROW STRIPS
• 834/835 Series PassꢀThrough Sockets have a low
3,30 profile and will accept Ø 0,76 round pin, as
well as industry standard 0,64 square pin
headers.
• They are typically used to interconnect two or
more parallel circuit boards.
• Sockets are designed for hand, wave or reflow*
soldering. The high temperature insulator is
compatible with all solder processes.
• Unique ORGANIC FIBRE PLUG® barriers prevent
solder, paste or flux from contaminating the
internal spring contacts. After soldering, the
OFP® barriers are pushed out of the socket when
the mating header is inserted.
UPPER
CIRCUIT
BOARD
Typical Application
INTERCONNECTION
PIN
• Mill-Max sockets use a receptacle consisting of a
precision-machined brass sleeve with a press-fit
beryllium copper“multiꢀfinger”spring contact.
Ø 0,76 or
#47 SPRING
CONTACT
0,64 PINS
MIDDLE
CIRCUIT
BOARD
• Recommended mounting holes are Ø1,17 ±0,08
PTH (1,2 mm drilled prior to plating).
SOCKET
INSULATOR
*Intrusive reflow (also called “pin-in-paste”) is a technique
of using conventional through-hole components in a
reflow soldering process. The pass-through socket is placed
into plated through-holes in the circuit board (solder paste
has previously been screen printed on pads adjacent to the
holes) and the board is reflowed in the same pass as other
SMT components. Solder will fill the plated through-holes
and achieve solder joints as reliable as wave soldering. The
OFP® barrier prevents solder paste from being picked up
inside the contact during assembly.
PASS THROUGH
SOCKETS
RECEPTACLE
SLEEVE
CIRCUIT
BOARD
LOWER
CIRCUIT
BOARD
®
ORGANIC FIBER PLUG
SOLDER
JOINT
PUSHED OUT BY INTERCONNECT
PIN AFTER SOLDERING
0,64-0,91
0,64 0,64
*
US Patent #7,086,870
Number of Pins
X 2,54
2,54
ORDERING INFORMATION
Series 834...001 Single Row OFP® Pass-Through Socket
834-XX-0 _ _-10-001000
2,24
2,79
3,3
1,55 DIA.
1,09 DIA.
2,03
FIG. 1
FIG. 2
0,91 DIA.
Through-Hole
Specify number of pins
01ꢀ64
®
2,54
Series 835...001 Double Row OFP® Pass-Through Socket
FIG. 1
835-XX-0 _ _-10-001000
0,64-0,91
0,64 0,64
*
Number of Pins
X 2,54 / 2
5,08
Specify number of pins
04ꢀ72
For
2,24
2,79
3,3
Electrical, Mechanical
& Enviromental Data,
See page 264
RoHS-2
XX=Plating Code
See Below
2011/65/EU
1,55 DIA.
1,09 DIA.
2,03
0,91 DIA.
Through-Hole
93
43
SPECIFY PLATING CODE XX=
Sleeve (Pin)
2,54
®
2,54
5,08μm Sn/Pb
5,08μm Sn
0,76μm Au
0,76μm Au
FIG. 2
Contact (Clip)
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
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