S596-10-225-08-001461 [MILL-MAX]
IC Socket, BGA225, 225 Contact(s),;
| 型号： | S596-10-225-08-001461 |
| 厂家： | 
MILL-MAX MFG. CORP. |
| 描述： | IC Socket, BGA225, 225 Contact(s), |
| 文件： | 总2页 (文件大小：106K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
solutions
MAXIMUM
MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS
Mill-Max’s 0.8mm BGA
Socket/Adapter Systems are used for both
socketing BGA devices and interconnecting
circuit boards. Systems are also available to
fit 1mm and .050” grid footprints.
For socketing BGA devices, a Socket
is reflow soldered to the same footprint as
the device using solder paste, and the
balled device is soldered to a BGA Adapter
(pin header) with either flux or paste. The
device may now be plugged into circuit.
For interconnect applications, a PCB
Adapter (pin header) is soldered to the sur-
face of the daughter card, thereby making it
pluggable into a mating Socket surface sol-
dered to the motherboard.
mating pin is used for 0.8mm grid systems.
BGA Socket/Adapters provide a high density and low
profile interconnect system.
The insulator for the socket and both adapters is
.047” thick machined FR-4 glass epoxy laminate that
All pins and sockets utilized in Mill-Max BGA
has a TCE to match the BGA device and circuit
Systems are precision-machined brass and plated
board.
gold. Press-fit into every mating socket is a beryllium
copper “three-finger” contact, also gold plated (heat-
treated BeCu is the best spring material for electrical
contacts). Mill-Max #04 contact with a .010” dia.
The mounting surfaces of the Socket are pre-
tinned to replicate solder balls. For the PCB Adapter,
pre-tinning is optional.
PCB INTERCONNECT APPLICATIONS
BGA MOUNT APPLICATIONS
(11/01-528)
R
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, Oyster Bay, NY 11771-0300
516-922-6000 • Fax: 516-922-9253
e-mail: techserv@mill-max.com or
sales@mill-max.com
Maximum Interconnect Solutions
www.mill-max.com
MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS
This footprint represents a popular 225 position BGA device. Adapters and sockets are sold
separately, order as:
PCB ADAPTER #: S579-10-225-08-001429 (not solder dipped)
or PCB ADAPTER #: S596-10-225-08-001461 (solder dipped)
BGA ADAPTER #: S599-10-225-08-001429 (not solder dipped)
SOCKET #: S596-11-225-08-001445 (solder dipped only)
Contact the Mill-Max Technical Services Department for other standard footprints.
SOLDER DIPPED
.512 SQUARE
.018
.024 DIA.
.047
(OPTIONAL)
0,8mm
TYP.
.035
TYP.
.054
.141
PCB
ADAPTER
.010 DIA.
.047
.054
BGA
.123
.090
ADAPTER
.010 DIA.
.027 DIA.
.140
MATED
HEIGHT
.025
SOCKET
.047
.024 DIA.
SOLDER DIPPED
(62Sn2Ag36Pb)
SPECIFICATIONS:
Materials:
- Socket contact: Three finger, stamped beryllium
copper alloy 172, HT (Mill-Max type #04); plated 10µ”
gold over 50µ” nickel
- Socket shell and adapter pins: Precision machined
brass alloy; plated 10µ” gold over 100µ” nickel
- Dielectric withstanding voltage: 500 V
RMS
- Capacitance between adjacent contacts: 1 pF max.
- Self inductance per pin: 2 nH max.
- Electrical length: 31 pS
Environmental:
- Operating temperature range: -55 °C to +125 °C
- Insulator material: .047” thick glass-epoxy type FR-4,
rated UL94V-0.
Mechanical:
TCE = 10-13ppm/°C,
= 5.0
BGA adapter/socket systems have withstood the following envi-
ronmental tests without mechanical or electrical failure:
- Damp heat, steady state: 40 °C, 93% rH, 21 days
- Damp heat, cyclic: 25/55 °C, 6 days
- Dry heat: 100°C, 1,000 hours
ε
r
- Insertion and withdrawal forces (using .010” dia.
polished steel gage pin): Insertion: .36N typ. per pin
Withdrawal: .20N typ. per pin
- Thermal shock: -55 to +125 °C, 5 cycles
- Random vibration: 50 to 500 Hz, 8g, 20 min. per axis
- Shock: 50 g per axis
- Solderability: 235 °C, 2 seconds
- Resistance to soldering heat: 270 °C, 10 seconds
- Resistance to corrosion:
- Insertion force of an actual 225 pin device: 90N
- Durability: 100 cycles
- Coplanarity: <.005”
Electrical:
- Current rating (per pin): 1 A
- Working voltage: 100 V
- Low level contact resistance: 10 mΩ max.
/150 V
max.
DC
RMS
Salt spray: 48 hours
- Insulation resistance @ 500 V
:
RMS
Sulphur dioxide: 96 hours @ 25 ppm SO , 25 °C, 75% rH
2
Initial value: 1,000,000 MΩ min.
After climatic tests: 10,000 MΩ min.
Hydrogen sulphide: 96 hours @ 12 ppm H S, 25°C, 75% rH
2
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