CMM1434-SM_07 [MIMIX]
13.50-14.50 GHz 2.5-Watt Power Amplifier; 13.50-14.50 GHz的2.5瓦功率放大器
| 型号： | CMM1434-SM_07 |
| 厂家： | 
MIMIX BROADBAND |
| 描述： | 13.50-14.50 GHz 2.5-Watt Power Amplifier |
| 文件： | 总4页 (文件大小：155K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
13.50-14.50 GHz
2.5-Watt Power Amplifier
February 2007 - Rev 19-Feb-07
CMM1434-SM
Features
34.5 dBm (Typ.) Saturated Output Power
31.0 dB (Typ.) Linear Gain
Fully Matched
Uncondtionally Stable
Low-Cost, Surface Mount Package
Optimum Thermal Dissipation
General Description
The CMM1434-SM is a four-stage pHEMT GaAs MMIC power amplifier
that is ideally suited for transmit subsystems designed for Ku-Band
VSAT applications.The CMM1434-SM provides 31.0 dB linear gain and
delivers 2.5 watts of output power at saturation operating from 13.5 to
14.5 GHz frequency.
Applications
The unconditional stability and internal matching provides for
reduction of external components making this product a simple and
low-cost solution.The low-cost 6mm x 6mm x 1.6mm surface mount
package offers the same excellent RF and thermal properties as a
typical flange package.
Ku-Band VSAT Transmit Subsystems
Electrical Characteristics (T = +25ºC,Vd = 6V, Idq = 1.5A)
Parameter
C ondition
Min
13.50
31.5
33
Typ
Max
Units
GHz
dBm
dBm
dBm
dB
Frequency R ange
Output Power
14.50
@ 1dB compression
Pin = 10 dBm
32
34.5
0.5
Saturated Output Power
Saturated Output Power Variation Over operating frequency
Linear Gain
1.0
34.0
3.0
27.0
30.5
1.0
L inear Gain Variation
Input Reflection Coefficient
Output R eflection Coefficient
Gate Supply Voltage
Over operating frequency
dB
-10.0
-7.0
-0.9
1.7
dB
dB
Idq = 1.5A
-1.1
-0.7
1.9
V olts
A
Drain Current
At Saturation
At Saturation
Power Added Efficiency
26
%
Electrical Specifications (TA = -40°C to +75°C)
Parameter
C ondition
Min
-0.5
-2.5
Typ
Max
Units
dBm
dB
Saturated Output Power
L inear Gain
V ariation from R oom Temperature
V ariation from R oom Temperature
3.5
Stability
Unconditionally stable
Maximum Ratings (TA = -40°C to +75°C)
Operation outside these limits can cause permanent damage.
Parameter
Typ
Units
Parameter
Typ
Units
Drain Voltage (+V
)
8.5
Volts
RF Input Power (P
)
in
15
dBm
dd
Gate Voltage (V
)
-3.0
2.1
5
V olts
A
Dissipated Power (P
)
10
Watts
gg
diss
Storage Temperature
Operating Backside Temperature
Quiescent Current (I
)
-50 to +150 °C
dq
Gate Current (I )
mA
-40 to +75
°C
g
Page 1 of 4
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
13.50-14.50 GHz
2.5-Watt Power Amplifier
February 2007 - Rev 19-Feb-07
CMM1434-SM
Power Amplifier Measurements
CMM1434-SM
Small Signal @ 6V, 1.5A
40
35
30
25
20
15
10
5
20
15
10
5
S21
S22
S11
S21
0
-5
S22
S11
-10
-15
0
-20
19
10
11
12
13
14
15
16
17
18
Frequency (GHz)
CMM1434-SM
Psat @ 6V, 1.5A Over Temperature
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
25degC
75degC
-40degC
13
13.2
13.4
13.6
13.8
14
14.2
14.4
14.6
14.8
15
Frequency (GHz)
Page 2 of 4
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
13.50-14.50 GHz
2.5-Watt Power Amplifier
February 2007 - Rev 19-Feb-07
CMM1434-SM
Physical Dimensions (BottomView)
Recommended Application Circuit
Note: This schematic represents the topology of the application circuit
recommended by Celeritek.
Vdd
Vdd
10
9
1
2
3
4
RF IN
50
50
RF OUT
Vgg
8
7
5
6
Vgg
0.1
F
0.1 F
ORIENTATION MARK
Note: Due to the high gain of this device it is highly recommended to maintain the
reverse isolation (S12) above 50 dB.
Biasing Notes
1. Dual bias is required
2. 0.1 F bypass capacitors are needed on PC board as close as possible to pins
1, 5, 6 and 10.
3. Positive (+) bias can be applied either at pin 1 or pin 6.
4. Negative (-) bias can be applied either at pin 5 or pin 6.
5. No DC block is required at RF IN/OUT.
6. Negative (-) bias must be applied before applying positive (+) bias.
Pin Functional Diagram
10 Vdd
Vdd 1
GROUND 2
RF IN 3
9 GROUND
8 RF OUT
7 GROUND
6 Vgg
GROUND 4
Vgg 5
Page 3 of 4
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
13.50-14.50 GHz
2.5-Watt Power Amplifier
February 2007 - Rev 19-Feb-07
CMM1434-SM
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human
body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product.This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As
used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions
for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical
component is any component of a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in anti-
static containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation.
Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the back-
side to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible.The
mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Ablestick 84-1LMI or
84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any
on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. If eutectic mounting is
preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the die and the attach-
ment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total
wetting to prevent void formation in a nitrogen atmosphere is recommended.The gold-tin eutectic (80% Au 20% Sn)
has a melting point of approximately 280º C (Note: Gold Germanium should be avoided).The work station temperature
should be 310º C +/- 10º C. Exposure to these extreme temperatures should be kept to minimum.The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical
during placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the
die's gold bond pads.The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99%
pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge
or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided.Thermo-compression bonding
is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized.
Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the
package or substrate. All bonds should be as short as possible.
Ordering Information
The CMM1434-SM is available in available in tube or tape and reel.
Part Number for Ordering
Package
C M M 1431-SM
Surface mount package
CMM1434-SM-0G0T
PB-CMM1434-SM
Matte tin plated RoHS compliant surface mount package in tape and reel
Evaluation Board
We also offer this product with SnPb (Tin-Lead) or NiPdAu plating. Please contact your regional sales manager for more
information regarding different plating types.
Page 4 of 4
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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