XP1009-BD-000V [MIMIX]
Wide Band Medium Power Amplifier, 17000MHz Min, 21000MHz Max, ROHS COMPLIANT, DIE-6;
| 型号： | XP1009-BD-000V |
| 厂家： | 
MIMIX BROADBAND |
| 描述： | Wide Band Medium Power Amplifier, 17000MHz Min, 21000MHz Max, ROHS COMPLIANT, DIE-6 射频 微波 |
| 文件： | 总6页 (文件大小：170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Velocium Products
18 - 20 GHz H478
17.0-21.0 GHz GaAs MMIC
Power Amplifier
May 2007 - Rev 02-May-07
P1009-BD
Features
Chip Device Layout
Excellent Linear Output Amplifier Stage
20.0 dB Small Signal Gain
+29.5 dBm P1dB Compression Point
+38.0 dBm Third Order Intercept (OIP3)
100% On-Wafer RF, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883
Method 2010
General Description
Mimix Broadband’s two stage 17.0-21.0 GHz GaAs
MMIC power amplifier is optimized for linear operation
with a third order intercept point of +38.0 dBm.This
MMIC uses Mimix Broadband’s 0.15 µm GaAs PHEMT
device model technology, and is based upon electron
beam lithography to ensure high repeatability and
uniformity.The chip has surface passivation to protect
and provide a rugged part with backside via holes and
gold metallization to allow either a conductive epoxy
or eutectic solder die attach process.This device is well
suited for Millimeter-wave Point-to-Point Radio, LMDS,
SATCOM and VSAT applications.
Absolute Maximum Ratings
Supply Voltage (Vd)
Supply Current (Id1,2)
Gate Bias Voltage
+5.5 VDC
330,660 mA
+0.3 VDC
+12 dBm
Input Power (Pin)
Storage Temperature (Tstg) -65 to +165 OC
Operating Temperature (Ta) -55 to MTTF TAble
3
3
Channel Temperature (Tch) MTTF Table
(3) Channel temperature affects a device's MTTF. It is
recommended to keep channel temperature as low as
possible for maximum life.
Electrical Characteristics (AmbientTemperatureT = 25 oC)
Parameter
Units
GHz
dB
Min.
17.0
-
Typ.
-
8.0
Max.
21.0
-
Frequency Range (f)
Input Return Loss (S11)
Output Return Loss (S22)
Small Signal Gain (S21)
Gain Flatness ( S21)
Reverse Isolation (S12)
Output Power for 1 dB Compression (P1dB)
Output Third Order Intercept Point (OIP3)
Drain Bias Voltage (Vd1,2)
Gate Bias Voltage (Vg1,2)
dB
dB
dB
dB
dBm
dBm
VDC
VDC
mA
-
-
-
-
-
-
7.0
-
-
-
-
-
-
-
20.0
+/-0.5
-
+29.5
+38.0
+5.0
-0.3
900
2
1,2
-
-1.0
-
0.0
-
Supply Current (Id) (Vd=5.0V,Vg=-0.3V Typical)
(1) Measured at +18 dBm per tone output carrier level across the full frequency band.
(2) Measured using constant current.
Page 1 of 6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Velocium Products
18 - 20 GHz H478
17.0-21.0 GHz GaAs MMIC
Power Amplifier
May 2007 - Rev 02-May-07
P1009-BD
Power Amplifier Measurements
Measured performance characteristics (Typical at 25°C)
Vd1= 5 V, Id= 300 mA; Vd2= 5V, Vd2= 600 mA
40
39
38
37
36
35
34
33
32
31
30
29
28
22
20
18
16
14
12
10
17
18
19
20
21
22
17
18
19
20
21
22
Frequency (GHz)
Frequency (GHz)
IP3@18dBm/Tone
*Fixtured data
P1dB
Psat
*Fixtured data
0
-1
-2
-3
-4
-5
-6
-7
-8
0
-2
-4
-6
-8
-10
-12
-14
-9
17.5
18
18.5
19
Frequency (GHz)
19.5
20
20.5
17.5
18
18.5
19
19.5
20
20.5
Frequency (GHz)
Page 2 of 6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Velocium Products
18 - 20 GHz H478
17.0-21.0 GHz GaAs MMIC
Power Amplifier
May 2007 - Rev 02-May-07
P1009-BD
S-Parameters
Measured performance characteristics (Typical at 25°C)
Vd1= 5 V, Id= 300 mA; Vd2= 5V, Vd2= 600 mA
FreqGHz S11Mag
11Ang S21Mag
152.45 -49.302
148.677 -49.981
21Ang S12Mag
S12Ang S22Mag S22Ang
17.5
-12.1
-11.083
-9.815
-8.232
-7.303
-6.66
25.102
-2.561
20.483
20.551
20.729
20.672
20.761
20.685
20.604
20.443
20.622
20.326
20.405
20.472
20.552
89.053
78.835
53.522
28.712
5.571
-8.18
-7.96
-7.52
80.704
76.458
68.884
62.961
59.498
56.325
53.576
52.3
17.752
18.004
18.256
18.508
18.76
141.67
137.03
134.36
-48.911
-49.572
-50.903
-22.915
-31.609
-81.416
-101.36
-65.147
-83.276
-39.293
72.955
117.411
-7.302
-7.192
-6.904
-6.632
-6.522
-6.538
-6.732
-7.011
-7.269
-7.822
-8.006
135.133 -48.936
136.387 -51.589
140.378 -49.295
142.695 -46.339
146.815 -47.459
152.483 -49.064
158.787 -50.862
165.758 -46.658
-18.044
-40.128
-60.3
19.012
19.246
19.498
19.75
-6.134
-6.229
-6.278
-7.16
-82.436
-104.583
-127.721
-152.625
-164.338
52.947
54.435
57.592
62.087
64.406
20.002
20.254
20.5
-8.421
-10.568
-11.674
43.109
Page 3 of 6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
17.0-21.0 GHz GaAs MMIC
Power Amplifier
May 2007 - Rev 02-May-07
P1009-BD
Mechanical Drawing
1.280
(0.050)
0.736
0.736
2
1
(0.029)
(0.029)
6
5
4
3
0.0
0.0
3.920
(0.154)
0.785 1.185
(0.031) (0.047)
1.585
2.185
(0.062)
(0.086)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.111 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (RF Out)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd1)
Bond Pad #6 (Vg1)
Bias Arrangement
Bypass Capacitors - See App Note [2]
RF In
RF Out
2
1
6
5
4
3
10
10
Vg1
Vd2
Vd1
Vg2
Page 4 of 6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
17.0-21.0 GHz GaAs MMIC
Power Amplifier
May 2007 - Rev 02-May-07
P1009-BD
App Note [1] Biasing - It is recommended to separately bias each stage at Vd(1,2)=5.0V Id1=300mA, and Id2=600mA. It is also
recommended to use active biasing to keep the currents constant as the RF power and temperature vary; this gives the most
reproducible results. Depending on the supply voltage available and the power dissipation constraints, the bias circuit may be a
single transistor or a low power operational amplifier, with a low value resistor in series with the drain supply used to sense the
current.The gate of the pHEMT is controlled to maintain correct drain current and thus drain voltage.The typical gate voltage needed
to do this is -0.3V.Typically the gate is protected with Silicon diodes to limit the applied voltage. Also, make sure to sequence the
applied voltage to ensure negative gate bias is available before applying the positive drain supply.
App Note [2] Bias Arrangement -
For Parallel Stage Bias (Recommended for general applications) -- The same as Individual Stage Bias but all the drain or gate pad DC
bypass capacitors (~100-200 pF) can be combined. Additional DC bypass capacitance (~0.01 uF) is also recommended to all DC or
combination (if gate or drains are tied together) of DC bias pads.
For Individual Stage Bias (Recommended for Saturated Applications) -- Each DC pad (Vd1,2 and Vg1,2) needs to have DC bypass
capacitance (~100-200 pF) as close to the device as possible. Additional DC bypass capacitance (~0.01 uF) is also recommended.
MTTFTable (TBD)
These numbers were calculated based on accelerated life test information and thermal model analysis received from the fabricating foundry.
Backplate
Channel
Rth
MTTF Hours
FITs
Temperature
Temperature
55 deg Celsius
75 deg Celsius
95 deg Celsius
deg Celsius
deg Celsius
deg Celsius
C/W
C/W
C/W
E+
E+
E+
E+
E+
E+
Bias Conditions: Vd1=Vd2=5.0V, Id1=300 mA, Id2=600 mA
Page 5 of 6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Velocium Products
18 - 20 GHz H478
17.0-21.0 GHz GaAs MMIC
Power Amplifier
May 2007 - Rev 02-May-07
P1009-BD
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
• Do not ingest.
• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these
by-products are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this product.This product must be discarded in accordance
with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life
support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices need
careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to
enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible.The mounting surface should
be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured
in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the
die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy
Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately
0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and
provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended.The gold-tin
eutectic (80% Au 20% Sn) has a melting point of approximately 280 ºC (Note: Gold Germanium should be avoided).The work station
temperature should be 310 ºC +/- 10 ºC. Exposure to these extreme temperatures should be kept to minimum.The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during
placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond
pads.The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2%
elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias
connections. Aluminum wire should be avoided.Thermo-compression bonding is recommended though thermosonic bonding may
be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds
should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
Ordering Information
Part Number for Ordering
XP1009-BD-000V
XP1009-BD-000W
Description
Where“V”is RoHS compliant die packed in vacuum release gel paks
Where“W”is RoHS compliant die packed in waffle trays
XP1009 die evaluation module
XP1009-BD-EV1
Page 6 of 6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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