EDC19-KA-D+ [MINI]
Directional Coupler Die;
| 型号： | EDC19-KA-D+ |
| 厂家： | 
MINI-CIRCUITS |
| 描述： | Directional Coupler Die |
| 文件： | 总5页 (文件大小：192K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMIC
EDC19-KA-D+
Directional Coupler Die
50Ω
5 to 43.5 GHz
The Big Deal
• Ultra-Wide Bandwidth, 5-43.5 GHz
• Excellent Coupling Flatness ± 0.ꢀ dB tꢁp oꢂer ꢃ0-40 GHz
Product Overview
Mini-Circuits’ EDC1ꢀ-KA-D+ is a Directional Coupler die designed for wideband operation from 5 to 43.5
GHz with a nominal coupling of 18.3 dB oꢂer ꢃ0-40 GHz. Manufactured using GaAs IPD technologꢁ, it has
excellent repeatabilitꢁ and reliabilitꢁ.
Key Features
Feature
Advantages
A single Directional Coupler can be used in manꢁ applications, saꢂing component
count. Also ideal for applications such as 5G, militarꢁ and instrumentation.
Wideband, 5 to 43.5 GHz
DC current passing is helpful in applications where both RF & DC need to pass through
the DUT, such as antenna mounted hardware.
DC Passing up to 1.3A
Unpackaged die
Enables user to integrate it directlꢁ into hꢁbrids.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 1 of 5
MMIC
EDC19-KA-D+
Directional Coupler Die
50Ω
5 to 43.5 GHz
Product Features
• Wide bandwidth, 5 to 43.5 GHz
• Excellent coupling Flatness, ± 0.ꢀdB oꢂer ꢃ0 to 40 GHz
• Nominal Coupling 18.3 dB oꢂer ꢃ0 to 40 GHz
• DC passing
+RoHS Compliant
ꢀhe ꢁꢂuffiꢃ identifies Roꢄꢂ Compliance. ꢂee our ꢅeb site
for Roꢄꢂ Compliance methodologies and qualifications
Typical Applications
• 5G
Ordering Information: Refer to Last Page
• Instrumentation
• Militarꢁ
General Description
Mini-Circuits’ EDC1ꢀ-KA-D+ is a Directional Coupler die designed for wideband operation from 5 to 43.5
GHz with a nominal coupling of 18.3 dB oꢂer ꢃ0-40 GHz. Manufactured using GaAs IPD technologꢁ, it has
excellent repeatabilitꢁ and reliabilitꢁ.
Simplified Schematic and Pad description
Bonding Pad Position
Pad#
Function
Input
1
ꢃ
Output
3
Coupled
Ground
Dimensions in µm, Tꢁpical
Die Bottom
L1
Lꢃ
L3
L4
H1
Hꢃ
H3
H4
Note: 1. Bond Pad material - Gold
ꢃ. Bottom of Die - Gold plated
134
3ꢀꢃ
1456 15ꢀ0 370
ꢀꢃ1
1166 1ꢃꢀ0 100 117 x 167 167 x 117
REV. OR
M16575ꢀ
EDC1ꢀ-KA-D+
RS/CP
180ꢃꢃ0
Page ꢃ of 5
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
MMIC Directional Coupler die
EDC19-KA-D+
Electrical Specifications1 at 25°C
Parameter
Frequency (GHz)
Units
Min.
Typ.
Max.
Frequencꢁ Range
Main Line Loss
5
43.5
GHz
dB
5 - 10
10 - ꢃ0
ꢃ0 - 40
40 - 43.5
5 - 10
0.3
0.6
0.5
0.6
Nominal Coupling
Coupling Flatness (± ±
Directiꢂitꢁ
dB
dB
dB
dB
dB
ꢃ6.0
ꢃ1.4
18.3
18.ꢀ
ꢃ.7
10 - ꢃ0
ꢃ0 - 40
40 - 43.5
5 - 10
10 - ꢃ0
ꢃ0 - 40
40 - 43.5
5 - 10
ꢃ.0
0.ꢀ
0.5
ꢀ.1
10 - ꢃ0
ꢃ0 - 40
40 - 43.5
5 - 10
ꢀ.1
ꢀ.3
6.1
Return Loss - Input / Output
16.3
14.5
15.5
16.0
14.1
13.1
14.4
16.ꢃ
10 - ꢃ0
ꢃ0 - 40
40 - 43.5
5 - 10
Return loss - CPL
10 - ꢃ0
ꢃ0 - 40
40 - 43.5
1. Measured on Die using MPI TITAN ꢃ00µm GSG probe
Absolute Maximum Ratings2
Ratings
-40°C to 85°C
1W Max.
Parameter
Operating Temperature
Power Input
Power into Coupled Port
0.5W Max.
DC Current
1.3A at ꢃ5°C. Derate linearlꢁ to 0.65A at 85°C
ꢃ. Permanent damage maꢁ occur if anꢁ of these limits are exceeded.
Electrical maximum ratings are not intended for continuous normal operation.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 3 of 5
EDC19-KA-D+
MMIC Directional Coupler die
Assembly Diagram
Note: Ground bond wires are optional
Assembly and Handling Procedure
1. Storage
Dice should be stored in a drꢁ nitrogen purged desiccators or equiꢂalent.
ꢃ. ESD
MMIC coupler dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriatelꢁ grounded anti-static worksta
tion. Deꢂices need careful handling using correctlꢁ designed collets, ꢂacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductiꢂe silꢂer filled epoxꢁ, recommended epoxies are DieMat
DM6030HK-PT/H57ꢀ or Ablestik 84-1LMISR4. Applꢁ sufficient epoxꢁ to meet required epoxꢁ bond line thickness, epoxꢁ fillet
height and epoxꢁ coꢂerage around total die peripherꢁ. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s
cure condition. It is recommended to use antistatic die pick up tools onlꢁ.
4. Wire Bonding
Bond pad openings in the surface passiꢂation aboꢂe the bond pads are proꢂided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 4 of 5
MMIC Directional Coupler die
EDC19-KA-D+
Additional Detailed Technical Information
additional information is available on our dash board.
Data Table
Performance Data
Case Style
Swept Graphs
S-Parameter (S3P Files±
Die
Quantitꢁ, Package
Model No.
Small, Gel - Pak: 5 KGD*
EDC1ꢀ-KA-DG+
EDC1ꢀ-KA-DP+
Medium†, Partial wafer: 350 KGD*
Die Ordering and packaging
information
†Available upon request contact sales representative
Refer to AN-60-067
Environmental Ratings
ENV80
*Known Good Dice (“KGD”± means that the dice are taken from PCM good wafer and ꢂisuallꢁ inspected according to Mini-Circuits inspection criteria.
While this is not definitiꢂe, it does help to proꢂide a higher degree of confidence that dice are capable of meeting tꢁpical RF electrical parameters
specified bꢁ Mini-Circuits.
ESD Rating
Human Bodꢁ Model (HBM±: Class 1C (Pass 1000V± in accordance with ANSI/ESD STM 5.1 - ꢃ001
Additional Notes
A. Performance and qualitꢁ attributes and conditions not expresslꢁ stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts coꢂered bꢁ this specification document are subject to Mini-Circuits standard limited warrantꢁ and terms
and conditions (collectiꢂelꢁ, “Standard Terms”±; Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusiꢂe rights and remedies thereunder,
please ꢂisit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracꢁ or completeness of the information, text, graphics and other items
contained within this document and same are proꢂided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solelꢁ responsible for proper storing, handling, assemblꢁ and processing of Known
Good Dice (including, without limitation, proper ESD preꢂentatiꢂe measures, die preparation, die attach, wire bond
ing and related assemblꢁ and test actiꢂities±, and Mini-Circuits assumes no responsibilitꢁ therefor or for enꢂironmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-partꢁ trademarks are the propertꢁ of their respectiꢂe owners. A reference to anꢁ third-partꢁ
trademark does not constitute or implꢁ anꢁ endorsement, affiliation, sponsorship, or recommendation bꢁ anꢁ such
third-partꢁ of Mini-Circuits or its products.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 5 of 5
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