PMA3-83LN-DP+ [MINI]
Monolithic Amplifier Die;
| 型号： | PMA3-83LN-DP+ |
| 厂家： | 
MINI-CIRCUITS |
| 描述： | Monolithic Amplifier Die |
| 文件： | 总6页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Low Noise, Wideband, High IP3
PMA3-83LN-D+
Monolithic Amplifier Die
50Ω
0.5 to 8.0 GHz
The Big Deal
• Flat gain over wideband
• Low noise figure, 1.2 dB
• High IP3, up to +37 dBm
Product Overview
The PMA3-83LN-D+ is a PHEMT based wideband, low noise MMIC amplifier die with a unique
combination of low noise, high IP3, and flat gain over wideband making it ideal for sensitive, high-
dynamic-range receiver applications. This design operates on a single 5V or 6V supply and is well
matched to 50Ω.
Key Features
Feature
Advantages
Low noise, 1.2 dB at 2 GHz
Enables lower system noise figure performance.
High IP3
• +36.8 dBm at 2 GHz and 6V
• +29.9 dBm at 8 GHz and 6V
Combination of low noise and high IP3 makes this MMIC amplifier ideal for use in low
noise receiver front end (RFE) as it gives the user advantages of sensitivity and two-
tone IM performance at both ends of the dynamic range.
Low operating voltage, 5V/6V.
Wide bandwidth with flat gain
Achieves high IP3 using low voltage.
Enables a single amplifier to be used in many wideband applications including defense,
instrumentation and more.
•
•
0.9 dB over 0.5 to 7 GHz
1.2 dB over 0.5 to 8 GHz
Unpackaged Die
Enables users to integrate amplifiers directly into hybrids
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 1 of 6
Low Noise, Wideband, High IP3
PMA3-83LN-D+
Monolithic Amplifier Die
50Ω
0.5 to 8.0 GHz
Product Features
• Low Noise figure, 1.2 dB at 2 GHz
• High IP3, 35 dBm typ. at 2 GHz
• High Pout, P1dB 20.7 dBm typ. at 2 GHz and 6V
• Excellent Gain flatness, 0.9 dB over 0.5 to 7 GHz and 6V
Typical Applications
• WiFi
+RoHS Compliant
ꢀhe ꢁꢂꢃꢄꢄiꢅ idenꢆiꢄies ꢇoHꢂ ꢈoꢉꢊꢋianꢌeꢍ ꢂee oꢃꢎ web siꢆe
ꢄoꢎ ꢇoHꢂ ꢈoꢉꢊꢋianꢌe ꢉeꢆhodoꢋogies and ꢏꢃaꢋiꢄiꢌaꢆions
• WLAN
• UMTS
Ordering Information: Refer to Last Page
• LTE
• WiMAX
• S-band Radar
• C-band Satcom
General Description
The PMA3-83LN-D+ is a PHEMT based wideband, low noise MMIC amplifier die with a unique
combination of low noise, high IP3, and flat gain over wideband making it ideal for sensitive, high-
dynamic-range receiver applications. This design operates on a single 5V or 6V supply and is well
matched to 50Ω.
Simplified Schematic and Pad description
Function
Description (See Figure 1)
Connects to RF input and to ground via L1
RF-IN
(optional blocking capacitor of 100pF may be used)
Connects to RF out via C3 and VDD via L2
Bottom of die
RF-OUT & DC-IN
Ground
REV. OR
M153154
PMA3-83LN-D+
RS/CP
171226
Page 2 of 6
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Monolithic E-PHEMT MMIC Amplifier Die
PMA3-83LN-D+
Electrical Specifications1 at 25°C and 5V, unless noted
Parameter
Condition
(GHz)
VDD=6.0
Typ.
VDD=5.0
Typ.
Units
Min.
Max.
Frequency range
Noise figure
0.5
8.0
0.5-8.0
1.8
GHz
dB
0.5
2.0
4.0
8.0
0.5
2.0
4.0
8.0
0.5
2.0
4.0
8.0
0.5
2.0
4.0
8.0
0.5
2.0
4.0
8.0
0.5
2.0
4.0
8.0
1.8
1.2
1.2
1.3
1.4
1.6
1.7
Gain
dB
dB
21.7
21.9
21.4
19.8
14.5
15.6
12.7
8.1
20.8
21.1
20.6
19.3
13.3
16.4
11.8
7.8
Input return loss
Output return loss
Output power at 1dB compression2
Output IP3
dB
12.4
10.8
20.9
11.0
18.6
21.2
19.0
17.7
34.7
36.8
32.5
29.9
6.0
13.5
12.0
23.9
10.7
16.1
19.6
16.9
16.7
29.6
30.5
27.8
26.7
5.0
dBm
dBm
Device operating voltage (VDD
)
—
—
—
V
Device operating current (IDD
)
77
94
60
mA
Device current variation vs. voltage
0.016
40
0.019
40
mA/mV
°C/W
Thermal resistance, junction-to-ground lead
1. Measured on Mini-Circuits Characterization test board. See Characterization Test Circuit (Fig. 1)
2. Current increases at P1dB to 109 mA typ. at +6V VDD and 88mA typ. at +5V VDD
Absolute Maximum Ratings3,4
Parameter
Ratings
-40°C to 85°C
150°C
Operating Temperature
Junction Temperature
Total Power Dissipation
0.95 W
+19 dBm (5 minutes max.)
+16 dBm (continuous)
Input Power (CW), Vd=5,6V
DC Voltage
7 V
3.Permanent damage may occur if any of these limits are exceeded.
Electrical maximum ratings are not intended for continuous normal operation.
4. Die performance measured in industry standard 3x3 mm 12-lead MCLP package.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 3 of 6
Monolithic E-PHEMT MMIC Amplifier Die
Recommended Application and Characterization Test Circuit
PMA3-83LN-D+
Component Value
Size
0402
0402
0402
0402
0402
C1
C2
C3
L1
L2
0.01µF
10pF
100pF
18nH
39nH
Fig 1. Application and Characterization circuit
Gain, Return loss, Output power at 1dB compression (P1 dB), output IP3 (OIP3) and noise figure measured using Keysight’s
N5242A PNA-X microwave network analyzer.
Conditions:
1. Gain and Return loss: Pin= -25dBm
2. Output IP3 (OIP3): Two tones, spaced 1 MHz apart, 0 dBm/tone at output.
Die Layout
Bonding Pad Position
(Dimensions in µm, Typical)
Fig 2. Die Layout
Fig 3. Bonding Pad Positions
Critical Dimensions
Parameter
Values
100
Die Thickness, µm
Die Width, µm
660
Die Length, µm
962
Bond Pad Size, µm
100 X 200
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 4 of 6
PMA3-83LN-D+
Monolithic E-PHEMT MMIC Amplifier Die
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC Gallium Arsenide (GaAs) amplifier dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta
tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet
height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s
cure condition. It is recommended to use antistatic die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
Assembly Diagram
Recommended Wire Length, Typical
Wire
Wire Length (mm)
Wire Loop Height (mm)
RF-IN
0.5
0.5
0.15
0.15
RF-OUT & DC IN
RF Reference Plane - No port extension
RF Reference Plane
Material: Roger 4350B 10 Mil
Dielectric Constant: 3.5
Copper thickness: 0.5 Oz
Finishing: ENIG
VDD
GRD
DUT
RF reference plane
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 5 of 6
Monolithic E-PHEMT MMIC Amplifier Die
PMA3-83LN-D+
Additional Detailed Technical Information
additional information is available on our dash board.
Data Table
Performance Data
Case Style
Swept Graphs
S-Parameter (S2P Files) Data Set with and without port extension(.zip file)
Die
Quantity, Package
Model No.
Small, Gel - Pak: 5,10,50,100 KGD* PMA3-83LN-DG+
Medium†, Partial wafer: KGD*<5K
Large†, Full Wafer
†Available upon request contact sales representative
PMA3-83LN-DP+
PMA3-83LN-DF+
Die Ordering and packaging
information
Refer to AN-60-067
Environmental Ratings
ENV-80
*Known Good Dice (“KGD”) means that the dice in question have been subjected to Mini-Circuits DC test performance criteria and measurement
instructions and that the parametric data of such dice fall within a predefined range. While DC testing is not definitive, it does help to provide a higher
degree of confidence that dice are capable of meeting typical RF electrical parameters specified by Mini-Circuits.
ESD Rating**
Human Body Model (HBM): Class 1A (250 to <500V) in accordance with ANSI/ESD STM 5.1 - 2001
Machine Model (MM): Class M1 (Pass 50V) in accordance with ANSI/ESD STM5.2-1999
** Tested in industry standard 12-lead, 3x3 mm MCLP package.
Additional Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms
and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder,
please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items
contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known
Good Dice (including, without limitation, proper ESD preventative measures, die preparation, die attach, wire bond
ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party
trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such
third-party of Mini-Circuits or its products.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 6 of 6
相关型号：
©2020 ICPDF网 联系我们和版权申明