XHF-14M-D [MINI]
High Pass Filter Die;
| 型号： | XHF-14M-D |
| 厂家： | 
MINI-CIRCUITS |
| 描述： | High Pass Filter Die |
| 文件： | 总5页 (文件大小：273K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMIC
REFLECTIONLESS FILTERS DICE
50Ω DC to 26 GHz
The Big Deal
• High Stopband rejection, up to 41 dB
• Patented design terminates stopband signals
• Pass band cut off up to 11 GHz
• Pass band up to 26 GHz
• Excellent repeatability through IPD* process
Product Overview
Mini-Circuits’ X-Series of reflectionless filters now includes two-section models, giving you ultra-high
rejection in the stopband – up to 41 dB! Reflectionless filters employ a patented filter topology which
absorbs and terminates stopband signals internally rather than reflecting them back to the source. This
new capability enables unique applications for filter circuits beyond those suited to traditional approaches.
Traditional filters are reflective in the stopband, sending signals back to the source at 100% power. These
reflections interact with neighboring components and often result in intermodulation and other interfer-
ences. By eliminating stopband reflections, reflectionless filters can readily be paired with sensitive devices
and used in applications that otherwise require circuits such as isolation amplifiers or attenuators.
Key Features
Easy integration with sensitive reflective
components, e.g. mixers, multipliers
Advantages
Reflectionless filters absorb unwanted signals, preventing reflections back to the
source. This reduces generation of additional unwanted signals without the need
for extra components like attenuators, improving system dynamic range and sav-
ing board space.
High stopband rejection, up to 41 dB
Ideal for applications where suppression of strong spurious signals and intermod-
ulation products is needed.
Enables stable integration of wideband
amplifiers
Because reflectionless filters maintain good impedance in the stopband; they
can be integrated with high gain, wideband amplifiers without the risk of creating
instabilities in these out of band regions.
Cascadable
Reflectionless filters can be cascaded in multiple sections to provide sharper and
higher attenuation, while also preventing any standing waves that could affect
passband signals. Low & highpass filters can be cascaded to realize bandpass
filters.
Excellent power handling in a tiny surface
mount device up to 1W in passband
High power handling extends the usability of these filters to the transmit path for
inter-stage filtering.
Excellent repeatability of RF performance
Through semiconductor IPD process, X-series filters are inherently repeatable for
large volume production.
Excellent stability over temperature
With 0.ꢀ dB variation over temperature ideal for use in wide temperature range
applications without the need for additional temperature compensation.
Operating temperature up to 105˚C
Unpackaged die
Suitable for operation close to high power components.
Enables the user to integrate the filter directrly into hybrid.
*IPD – Integrated Passive Device, is a GaAs semiconductor process
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 1 of 5
HReiflgechtionPleassss Filter Die
XHF-14M-D+
50Ω
9900 to 26000 MHz
Features
• Match to 50Ω in the stop band, eliminates undesired reflections
• Cascadable
• Excellent stopband rejection, 41 dB typ.
• Temperature stable, up to 105°C
• Protected by US Patents 8,ꢀ92,495; 9,705,467, additional patent pending
• Protected by China Patent 201080014266.1
• Protected by Taiwan Patent I581494
ꢀꢁꢂꢃS ꢄꢂꢅꢆꢇiꢈꢉꢊ
ꢀhe ꢁSuffix identifies RoHS ꢂompliance. See our ꢃeb site
for RoHS ꢂompliance methodologies and qualifications
Applications
• Fixed satellite
• Mobile
Ordering Information: Refer to Last Page
• Space research
General Description
Mini-Circuits’ XHF-14M-D+ two-section reflectionless filter Die employs a novel filter topology which
absorbs and terminates stop band signals internally rather than reflecting them back to the source. This
new capability enables unique applications for filter circuits beyond those suited to traditional approaches.
Traditional filters are reflective in the stop band, sending signals back to the source at 100% of the power
level. These reflections interact with neighboring components and often result in inter-modulation and
other interferences. Reflectionless filters eliminate stop band reflections, allowing them to be paired with
sensitive devices and used in applications that otherwise require circuits such as isolation amplifiers or
attenuators.
Simplified Schematic and Pad description
Bonding Pad Position
Pad#
Description
RF-IN
2
5
RF-OUT
Ground
Ground
Dimensions in µm, Typical
1,ꢀ,4,6
Die bottom
L1
80
L2
Lꢀ
H1
H2
Hꢀ
H4
Thickness Bond pad size
100 78 x 78
Note: 1. Bond Pad material - Gold
2. Bottom of Die - Gold plated
1420 1500
200
ꢀ00
400
1ꢀ00
REV. OR
M167791
®
XHF-14M-D+
WP/RS/CP
180802
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 2 of 5
MMIC Reflectionless High Pass Filter Die
XHF-14M-D+
Electrical Specifications1 at 25°C
Parameter
F#
Frequency (MHz)
Min.
Typ.
Max.
Unit
DC - F’
F’ - F1
DC - 5000
5000 - 7000
41
ꢀ2
Rejection
dB
Stop Band
Pass Band
Frequency Cut-off
VSWR
F2
8800
ꢀ.ꢀ
DC - F’
F’ - F1
DC - 5000
5000 - 7000
1.1
1.4
:1
Insertion Loss
Fꢀ - F4
F4 - F5
9900 - 15000
15000 - 26000
1.2
0.6
dB
Fꢀ - F4
F4 - F5
9900 - 15000
15000 - 26000
1.4
1.2
VSWR
:1
1 Measured on die using MPI titan series 100µm pitch GSG probe.
SPECIFICATION DEFINITION
Absolute Maximum Ratings4
Parameter
Ratings
-55°C to +105°C
1W at 25°C
Operating Temperature
RF Power Input, Passband (Fꢀ-F5)2
RF Power Input, Stopband (DC-Fꢀ)ꢀ
1.25W at 25°C
2 Passband rating derates linearly to 0.5W at 105°C ambient
ꢀ Stopband rating derates linearly to 0.6ꢀW at 105°C ambient
4 Permanent damage may occur if any of these limits are exceeded.
DC F’ F1 F2 F3
F4
F5
FREQUENCY (MHz)
Typical Performance Data at 25°C
Frequency
(MHz)
Insertion Loss
VSWR
(:1)
(dB)
10
100
500
6ꢀ.02
60.77
ꢀ9.57
ꢀ0.07
27.46
4ꢀ.81
ꢀ8.00
ꢀꢀ.16
25.ꢀ8
ꢀ.28
1.8ꢀ
1.4ꢀ
1.06
0.8ꢀ
0.59
0.59
0.55
0.55
1.02
1.02
1.06
1.1ꢀ
1.ꢀ2
1.ꢀ9
1.27
1.25
1.41
1.22
1.59
1.66
1.41
1.21
1.07
1.19
1.28
1.ꢀ1
1.26
1.2ꢀ
1000
2000
ꢀ000
4000
5000
7000
8800
9900
11000
1ꢀ000
15000
17000
19000
21000
2ꢀ000
25000
26000
0.5ꢀ
0.52
XHF-14M-D+
VSWR
XHF-14M-D+
INSERTION LOSS
100
2.0
1.8
1.6
1.4
1.2
1.0
80
60
40
20
0
0
5200
10400
15600
20800
26000
0
5200
10400
15600
20800
26000
FREQUENCY (MHz)
FREQUENCY (MHz)
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page ꢀ of 5
MMIC Reflectionless High Pass Filter Die
XHF-14M-D+
Assembly Diagram
Note: Ground bond wires are optional.
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC Gallium Arsenide (GaAs) filter dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta
tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
ꢀ. Die Attach
The Die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM60ꢀ0Hk-PT/H579/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy
fillet height and epoxy coverage around total Die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufac
turer’s cure condition. It is recommended to use antistatic Die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the Die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 4 of 5
MMIC Reflectionless High Pass Filter Die
XHF-14M-D+
Additional Detailed Technical Information
additional information is available on our dash board.
Data Table
Performance Data
Case Style
Swept Graphs
S-Parameter (S2P Files) Data Set with and without port extension(.zip file)
Die
Quantity, Package
Small, Gel - Pak: 5,10,50,100 KGD* XHF-14M-DG+
Medium†, Partial wafer: KGD*<925
XHF-14M-DP+
Model No.
Die Ordering and packaging
information
†Available upon request contact sales representative
Refer to AN-60-067
ENV-80
Environmental Ratings
*Known Good Dice (“KGD”) means that the dice are taken from PCM good wafer and visually inspected in question have been subjected to Mini-Cir-
cuits while this is not definitive, it does help to provide a higher degree of confidence that dice are capable of meeting typical RF electrical parameters
specified by Mini-Circuits.
ESD Rating**
Human Body Model (HBM): Class 2 (Pass 2000V) in accordance with ANSI/ESD STM 5.1 - 2001
** Tested in industry standard MCLP ꢀxꢀ mm, 12-lead package.
Additional Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms
and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusive rights and remeDies thereunder,
please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items
contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known
Good Dice (including, without limitation, proper ESD preventative measures, Die preparation, Die attach, wire bond
ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party
trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such
third-party of Mini-Circuits or its products.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Page 5 of 5
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