FU-653SEA-2M27 概述
Optoelectronic Device 其他光电器件
FU-653SEA-2M27 规格参数
生命周期: | Obsolete | Reach Compliance Code: | unknown |
HTS代码: | 8541.40.80.00 | 风险等级: | 5.84 |
光电设备类型: | OPTOELECTRONIC DEVICE | Base Number Matches: | 1 |
FU-653SEA-2M27 数据手册
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PDF下载TZ7-01-239B(1/7)
June 13, 2002
APPROVED
APPROVED
APPROVED
T.Onodera
Specification of 10Gb/s EML module
Module type:
FU-653SEA-2M series
(Dispersion 800ps/nm)
FU-653SEA-3M series ##
(Dispersion 1600ps/nm)
# # Under development
A
B
x
C
D
DATE
Approved
14.June ‘02 T.Nambara
TZ7-01-239B(2/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55 mm EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
DESCRIPTION
Module type FU-653SEA-1Mx is a 1.55mm EA
modulator integrated DFB-LD module with single-
mode optical fiber.
This module is suitable to a light source for use in
10Gb/s digital optical communication systems.
FEATURES
l
l
l
l
l
l
l
l
l
Input impedance is 50W
Integrated Electro-absorption Modulator
Distributed feed-back(DFB) Laser Diode
Emission wavelength is 1.55mm band
Single mode optical fiber pigtail
Built-in optical isolator
Built-in thermoelectric cooler
7-pin Butterfly package with GPO connector
For DWDM application
APPLICATION
STM-64, OC192 application
ABSOLUTE MAXIMUM RATINGS
Item
Laser diode
Symbol
Pf
Condition
Rating
10
200
2
5
1
20
2
1.5
Unit
mW
mA
V
V
V
V
mA
A
V
°C
°C
Optical output power
CW
CW
CW
Forward current
Reverse voltage
Reverse voltage
Forward voltage
Reverse voltage
Forward current
If
Vrl
Modulator
Vrm
Vfm
Vrd
Ifd
Ipe
Vpe
Tc
-
-
-
-
-
-
-
-
Photodiode for
monitoring
Thermoelectric Current
cooler(Note1)
Voltage
3
Operating case temperature
Storage temperature
-20~70
-40~85
Tstg
Note1
Even if the thermoelectric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or
operation without heat sink may easily damage the module by exceeding the storage temperature range.
Thermistor resistance should be properly monitored by the feedback circuit during TEC operation to avoid the
catastrophic damage.
TZ7-01-239B(3/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55 mm EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
1. ELECTRICAL/OPTICAL CHARACTERISTICS (Tc=25°C,chip temperature=Tld, unless otherwise noted)
Item
Symbol
Ith
Iop
Vop
Zin
Condition(Note2)
CW,Vm=0V
CW,Vm=0V
CW, If=Iop, Vm=0V
If=Iop
Min.
5
50
-
-
Typ.
Max.
30
100
1.7
-
Unit
mA
mA
V
W
dBm
Threshold current
Operating current
Operating voltage
Input impedance
Optical output power
from fiber end
Side mode
suppression ratio
Relative intensity
noise
-
70
-
50
-
Pf
(Note 3,4)
-2
-
Sr
(Note 3,4)
35
-
40
-
-
dB
RIN
Pp
CW, If=Iop, Vm=0V,10GHz
-135
dB/Hz
Power penalty
(Note 3,4,), 800ps/nm
(Note 3,4,6), 1600ps/nm
(Note 3,4)
(Note 3,4),20-80%
If=Iop,Vm=-1V
If=Iop,Vm=-1V, f£5GHz
If=Iop,Vm=-1V, f£10GHz
If=Iop,Tc=-20~70°C, Note 5
If=Iop,Vrd=-5V
Vrd=-5V
-
-
10
-
11
10
5
-
-
-
-
-
2.0
2.0
-
45
-
dB
dB
dB
ps
Extinction ratio
Rise/fall time
Cutoff frequency
RF return loss
Ex
tr/tf
fc
GHz
dB
dB
dB
mA
mA
pF
dB
dB
°C
S11
15
7
0.3
-
-
10
-
-
-
Tracking error
Er
Imon
Id
Ct
Iso
-
0.5
1.5
0.1
-
-
-
Monitor current
Dark current(PD)
Capacitance(PD)
Optical isolation
0.1
-
-
35
23
15
Vrd=-5V
Tc=25°C
Tc=-20~70°C
-
-
-
Tld
35
Laser diode
temperature
Note 2 : Vm is EAM bias voltage at CW condition, Vpp and Voff are EAM amplitude and EAM high level
offset voltage respectively at modulation condition.
Note 3 : 9.95328Gbps, NRZ, PRBS2^23-1, If=Iop,Vpp=2.5V,Voff=0V to –1V
Note 4 : Optical return loss of the connectors should be greater than 40dB in order to get specified performance.
Note 5 : Er=10´ log[Pf(Tc)/Pf(25°C)]
Note 6 : Under development
TZ7-01-239B(4/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55 mm EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
THERMAL CHARACTERISTICS
Limits
Parameter
Symbol
Conditions
(Note2)
Unit
Min.
Typ.
10
3950
-
0.6
1.2
Max.
10.5
-
Thermistor resistance
B constant of Rth
Cooling capacity
Cooler current
Rth
B
DT
Ipe
Vpe
Tc=Tld=25°C,
9.5
-
45
-
W
K
°C
A
-
Tld=25°C
If=Iop, Tc=70°C,Tld=25°C
If=Iop, Tc=70°C,Tld=25°C
-
1.2
2.5
Cooler voltage
-
V
FIBER PIGTAIL SPECIFICATIONS
Parameter
Unit
Specification
SM
Type
-
Mode field diameter
Cladding diameter
Secondary coating outer diameter
Connector
9.5±1
125±2
mm
mm
mm
0.9±0.1
See OUTLINE DIAGRAM
40(min)
Optical return loss of connector
dB
DOCUMENTATION
× Threshold current (Ith)
× Laser forward current (Iop)
× Monitor current (Imon)
× Central wavelength (l c)
× Laser set temperature(Tld)
× Extinction ratio
× Offset voltage
TZ7-01-239B(5/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55 mm EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
Wavelength table
Extension
Wavelength(nm)
Extension
Wavelength(nm)
Dispersion Dispersion
800ps/nm 1600ps/nm
Dispersion Dispersion
800ps/nm 1600ps/nm
-2M11
-2M12
-2M13
-2M14
-2M15
-2M16
-2M17
-2M18
-2M19
-2M20
-2M21
-2M22
-2M23
-2M24
-2M25
-2M26
-2M27
-2M28
-2M29
-2M30
-2M31
-2M32
-2M33
-2M34
-2M35
-2M36
-2M37
-2M38
-2M39
-2M40
-2M41
-2M42
-2M43
-2M44
-2M45
-2M46
-2M47
-2M48
-2M49
-2M50
-2M51
-2M52
-3M11
-3M12
-3M13
-3M14
-3M15
-3M16
-3M17
-3M18
-3M19
-3M20
-3M21
-3M22
-3M23
-3M24
-3M25
-3M26
-3M27
-3M28
-3M29
-3M30
-3M31
-3M32
-3M33
-3M34
-3M35
-3M36
-3M37
-3M38
-3M39
-3M40
-3M41
-3M42
-3M43
-3M44
-3M45
-3M46
-3M47
-3M48
-3M49
-3M50
-3M51
-3M52
1530.33
1530.72
1531.12
1531.51
1531.90
1532.29
1532.68
1533.07
1533.47
1533.86
1534.25
1534.64
1535.04
1535.43
1535.82
1536.22
1536.61
1537.00
1537.40
1537.79
1538.19
1538.58
1538.98
1539.37
1539.77
1540.16
1540.56
1540.95
1541.35
1541.75
1542.14
1542.54
1542.94
1543.33
1543.73
1544.13
1544.53
1544.92
1545.32
1545.72
1546.12
1546.52
-2M53
-2M54
-2M55
-2M56
-2M57
-2M58
-2M59
-2M60
-2M61
-2M62
-2M63
-2M64
-2M65
-2M66
-2M67
-2M68
-2M69
-2M70
-2M71
-2M72
-2M73
-2M74
-2M75
-2M76
-2M77
-2M78
-2M79
-2M80
-2M81
-2M82
-2M83
-2M84
-2M85
-2M86
-2M87
-2M88
-2M89
-2M90
-2M91
-2M92
-2M93
-
-3M53
-3M54
-3M55
-3M56
-3M57
-3M58
-3M59
-3M60
-3M61
-3M62
-3M63
-3M64
-3M65
-3M66
-3M67
-3M68
-3M69
-3M70
-3M71
-3M72
-3M73
-3M74
-3M75
-3M76
-3M77
-3M78
-3M79
-3M80
-3M81
-3M82
-3M83
-3M84
-3M85
-3M86
-3M87
-3M88
-3M89
-3M90
-3M91
-3M92
-3M93
-
1546.92
1547.32
1547.72
1548.11
1548.51
1548.91
1549.32
1549.72
1550.12
1550.52
1550.92
1551.32
1551.72
1552.12
1552.52
1552.93
1553.33
1553.73
1554.13
1554.54
1554.94
1555.34
1555.75
1556.15
1556.55
1556.96
1557.36
1557.77
1558.17
1558.58
1558.98
1559.39
1559.79
1560.20
1560.61
1561.01
1561.42
1561.83
1562.23
1562.64
1563.05
-
All wavelengths are referred to vacuum.
Extension -3Mseries(dispersion =1600ps/nm) is under development.
TZ7-01-239B(6/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55 mm EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
.
OUTLINE DIAGRAM
Unit : mm
FU-653SEA-2Mxx/3Mxx
Identical type number Dispersion
Connector type
No connector
FU-653SEA-2Mxx
FU-653SEA-3Mxx
FU-653SEA-W2Mxx
FU-653SEA-W3Mxx
FU-653SEA-V2Mxx
FU-653SEA-V3Mxx
800ps/nm
1600ps/nm
800ps/nm
1600ps/nm
800ps/nm
1600ps/nm
SC/PC
FC/PC
Pin7
Pin1
Pin No. Pin No.
1 Thermistor
PD
2 Thermistor
3 LD bias (Anode)
4 Monitor PD (Anode)
5 Monitor PD (Cathode)
6 Cooler (Anode)
7 Cooler (Cathode)
EA M/LD
GPO connector
TZ7-01-239B(7/7)
June 13, 2002
MITSUBISHI (OPTICAL DEVICES)
FU-653SEA-2Mxx
FU-653SEA-3Mxx
1.55 mm EA MODULATOR INTEGRATED DFB-LD MODULE
(7 PIN PACKAGE WITH GPO CONNECTOR, 10GB/s DIGITAL APPLICATION)
For additionally informations please contact:
Internet: www.mitsubishichips.com
Japan:
Overseas Marketing Division, Semicondoctor Group, Mitsubishi Electric Corporation, 2-2-3, Marunouchi,
Chiyoda-Ku, Tokyo 100-8310, Japan,
Americas: Tel:+81 (03) 3218-3472, FAX: +81(03) 3218-2724
Europe: Tel:+81 (03) 3218-2863, FAX: +81(03) 3218-2894
Asia, Pacific: Tel:+81 (03) 3218-3199, FAX: +81(03) 3218-2723
China: Tel:+81 (03) 3218-2796, FAX: +81(03) 3218-2722
Europe:
U.S.A.:
Mitsubishi Electric Europe B.V., German Branch, Gothaer Str.8, D-40880 Ratingen, Germany,
Tel:+49 2102-486-0, FAX:+049 2102-486-367
Mitsubishi Electric and Electronics USA, Inc, Electronic Device Group, 1050 East Arques Avenue, Sunnyvale,
CA 94086 , Tel:+41 (408) 730-5900, FAX:+41 (408) 732-9382
China:
Ke Ling Electric (Shanghai) Co.,Ltd, Room 1601/1602, OOCL Plaza No.841 Yan An Road(M), Jin An
District,
Shanghai 2000 40, China, Tel: +86 21-6289-4430, FAX:+86-21-6289-4440
HongKong: Mitsubishi Electric (H.K.) Co. Ltd Semiconductor Division, 41st Floor, Manulife Tower, 169 Electric
Road,
North Point, Hong Kong, Tel: +852-2510-0555, FAX:+852-2510-9822
Taiwan:
Mitsubishi Electric Taiwan Co., Ltd. Semiconductor Department, 9th Floor, 88 Sec.6,
Chung shan North Road, Taipei, Taiwan, Tel:+ 886-2-2836-5288, FAX:+ 886-2-2833-9793
Mitsubishi Electric Asia Pte. Ltd. Semiconductor Division, 307 Alexandra Road #05-01/02,
Singapore:
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without
notice. No liability is assumed as a result of their use or application.
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