FU-68SDF-V802M69B [MITSUBISHI]
Optoelectronic Device;型号: | FU-68SDF-V802M69B |
厂家: | Mitsubishi Group |
描述: | Optoelectronic Device 光电 |
文件: | 总6页 (文件大小:86K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
WZ700001B (1/6)
MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-x8xxMxxB
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
DESCRIPTION
Module type FU-68SDF-x802MxxB/-x810MxxB is a
1.55µm DFB-LD module with polarization maintaining
optical fiber.
This module is suitable to a directly modulated light
source for use in 2.5Gb/s digital optical communication
systems.
This module is prepared in accordance with ITU-T
recommendation wavelength channel plan for Dense-
WDM transmission..
FEATURES
O Input impedance is 25Ω
O Multi quantum wells (MQW) DFB Laser Diode
module
O Emission wavelength is in full C and L band
O Single mode optical fiber pig-tail
O Built-in optical isolator
PIN INFORMATION
O Built-in thermal electric cooler
O Butterfly package
O With photodiode for optical output monitor
APPLICATION
High speed transmission systems (~2.5Gb/s)
Dense-WDM systems
PIN
1
FUNCTION
Thermistor
2
Thermistor
3
4
LD DC Bias (Cathode)
PD Anode
5
6
7
8
PD Cathode
Cooler Anode
Cooler Cathode
GND
9
GND
10
11
12
13
14
NC
LD Anode, GND
LD RF Input (Cathode)
LD Anode, GND
NC
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
WZ700001B (2/6)
MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-x8xxMxxB
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
ABSOLUTE MAXIMUM RATINGS (Tld=Tset)
Parameter
Symbol
Pf
Conditions
CW x802MxxB
Rating
6
Unit
mW
Laser diode
Optical output
power
x810MxxB
15
Forward current
Reverse voltage
Reverse voltage
Forward current
Cooler current
Cooler voltage
If
Vrl
Vrd
Ifd
Ipe
Vpe
CW
150
2
20
2
1.3
3.1
mA
V
V
mA
A
V
-
-
-
-
-
Photodiode
Thermo-
electric cooler
(Note)
Operating case temperature
Storage temperature
Tc
Tstg
-
-
-20 ~ 70
-40 ~ 85
°C
°C
Note) Even if the thermo-electric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or
operation without heatsink may easily damage the module by exceeding the storage temperature range.
Thermistor resistance should be properly monitored by the feedback circuit during TEC operation to avoid the
catastrophic damage.
ELECTRICAL/OPTICAL CHARACTERISTICS (Tld=Tset, Tc=25°C unless otherwise noted)
Parameter
Symbol
Test Conditions
Limits
Typ.
2
Unit
mW
Min.
Max.
Optical output
P0
CW,If=Iop
-x802MxxB
-x810MxxB
10
Threshold current
Optical output power
at threshold current
Ith
Pth
CW
CW, If=Ith
-
-
10
-
25
100
mA
µW
-x802MxxB
-x810MxxB
-x802MxxB
-x810MxxB
-
-
-
-
-
-
150
65
95
1.8
-
Operating current
Iop
CW, Pf=P0
40
50
1.3
25
mA
Operating voltage
Input impedance
Light-emission central
wavelength
Vop
Zin
λc
CW, Pf=P0
Pf= P0
(Note 1)
V
Ω
nm
See Ordering Information
and Table 1
Central wavelength drift with
case temp.
-1
-
0
∆λc/∆Tc Tc=-20~70°C
pm/°C
Laser operating temperature
Spectral width
Side mode suppression ratio
Dispersion penalty
Tset
∆λ
Sr
-
20
-
33
-
-
0.2
40
-
35
0.4
-
°C
nm
dB
dB
(Note 1), -20dB
(Note 1)
Pp
(Note 1), at 10-10 BER,
+1800ps/nm
2
Cutoff frequency
(-1.5dB optical)
Rise and fall time
(10~90%)
fc
Pf= P0
3.5
-
-
-
-
GHz
psec
tr, tf
(Note 2)
150
Relative intensity noise
Tracking error
Nr
Er
CW, Pf= P0, f =0.5~3GHz
Tc=-20~70°C, APC, ATC
-
-
-155
-
-145
0.5
dB/Hz
dB
(Note 2)
Differential efficiency
CW
Pf= P0
-x802MxxB
-x810MxxB
0.057
0.07
0.15
mW/
mA
η
0.15
-20
0.25
-
0.35
20
Linearity
CW, Pf= P0 x0.1~ P0x1.2
(Note 3)
CW, Pf= P0,
Vrd=5V
Tc=25°C
Tc=-20~70°C
%
mA
dB
∆η
Monitor current
Optical isolation
Imon
-x802MxxB
-x810MxxB
0.1
0.2
35
23
-
-
-
-
-
-
-
2
3
-
Iso
-
Dark current (PD)
Capacitance (PD)
Id
Ct
0.1
10
Vrd=5V, Tc=-20~70°C
Vrd=5V, f=1MHz
µA
pF
-
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
WZ700001B (3/6)
MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-x8xxMxxB
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
THERMAL CHARACTERISTICS (Tld=Tset, Tc=-20~70°C)
Parameter
Symbol
Test Conditions
Limits
Typ.
10
3950
-
Unit
Min.
9.5
-
50
-
Max.
10.5
-
-
1
2
Thermistor resistance
B constant of Rth
Cooling capacity
Cooler current
Rth
B
∆T
Ipe
Vpe
Tld=25°C
kΩ
K
°C
A
-
Pf=Po, Tc=70°C
Pf=Po, Tc=70°C, Tld=Tset
Pf=Po, Tc=70°C, Tld=Tset
0.6
1.2
Cooler voltage
-
V
FIBER PIGTAIL SPECIFICATIONS
Parameter
Type
Limits
SM
Unit
-
Mode field diameter
Cladding diameter
Secondary coating outer diameter
Connector
9.5+/-1
125+/-2
0.9+/-0.1
(Note 4)
40 (min)
µm
µm
mm
-
Optical return loss of connector
dB
Note 1) 2.48832Gb/s NRZ, 223-1, Pf_ave= P0 x 0.5, Extinction ratio 10dB, optical return loss of the connectors should
be greater than 40dB in order to ensure the specified performance.
Note 2) Er=max|10×log(Pf / Pf@25°C)|
Note 3) Variation of the differential efficiency from the straight line between P0 x0.1~ P0x1.2
Note 4) SC/PC and FC/PC are available. Other connectors are also available for large quantities.
ORDERING INFORMATION
FU-68SDF- W 8 02 M 59 B
λ Code (See Table 1)
Output Power Code
Connector Code
Output power
2mW
02
10
10mW
Connector Code
Connector Code
Connector type
SC/PC
W
V
Standard
Optional
FC/PC
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
WZ700001B (4/6)
MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-x8xxMxxB
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
Table 1.
f [THz]
f [THz]
f [THz]
λc [nm] λ code
λc [nm] λ code
λc [nm] λ code
196.30 1527.22
196.20 1527.99
196.10 1528.77
196.00 1529.55
3
5
7
9
192.80 1554.94 73
192.70 1555.75 75
192.60 1556.55 77
192.50 1557.36 79
192.40 1558.17 81
192.30 1558.98 83
192.20 1559.79 85
192.10 1560.61 87
192.00 1561.42 89
191.90 1562.23 91
191.80 1563.05 93
191.70 1563.86 95
191.60 1564.68 97
191.50 1565.50 99
191.40 1566.31 101
191.30 1567.13 103
191.20 1567.95 105
191.10 1568.77 107
191.00 1569.59 109
190.90 1570.42 111
190.80 1571.24 113
190.70 1572.06 115
190.60 1572.89 117
190.50 1573.71 119
190.40 1574.54 121
190.30 1575.37 123
190.20 1576.20 125
190.10 1577.03 127
190.00 1577.86 129
189.90 1578.69 131
189.80 1579.52 133
189.70 1580.35 135
189.60 1581.18 137
189.50 1582.02 139
189.40 1582.85 141
189.30 1583.69 143
189.20 1584.53 145
189.10 1585.36 147
189.00 1586.20 149
188.90 1587.04 151
188.80 1587.88 153
188.70 1588.73 155
188.60 1589.57 157
188.50 1590.41 159
188.40 1591.26 161
188.30 1592.10 163
188.20 1592.95 165
188.10 1593.79 167
188.00 1594.64 169
187.90 1595.49 171
187.80 1596.34 173
187.70 1597.19 175
187.60 1598.04 177
187.50 1598.89 179
187.40 1599.75 181
187.30 1600.60 183
187.20 1601.46 185
187.10 1602.31 187
187.00 1603.17 189
186.90 1604.03 191
186.80 1604.88 193
186.70 1605.74 195
186.60 1606.60 197
186.50 1607.47 199
186.40 1608.33 201
186.30 1609.19 203
186.20 1610.06 205
186.10 1610.92 207
186.00 1611.79 209
195.90 1530.33 11
195.80 1531.12 13
195.70 1531.90 15
195.60 1532.68 17
195.50 1533.47 19
195.40 1534.25 21
195.30 1535.04 23
195.20 1535.82 25
195.10 1536.61 27
195.00 1537.40 29
194.90 1538.19 31
194.80 1538.98 33
194.70 1539.77 35
194.60 1540.56 37
194.50 1541.35 39
194.40 1542.14 41
194.30 1542.94 43
194.20 1543.73 45
194.10 1544.53 47
194.00 1545.32 49
193.90 1546.12 51
193.80 1546.92 53
193.70 1547.72 55
193.60 1548.51 57
193.50 1549.32 59
193.40 1550.12 61
193.30 1550.92 63
193.20 1551.72 65
193.10 1552.52 67
193.00 1553.33 69
192.90 1554.13 71
All wavelengths are referred to vacuum. Tolerance is λc+/-0.05nm.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
WZ700001B (5/6)
MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-x8xxMxxB
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
OUTLINE DIAGRAM
Unit : mm
Tolerances unless noted ±0.5
Identified type number
FU-68SDF-W8xxMxxB
FU-68SDF-V8xxMxxB
Connector type
SC/PC
L
35REF
28REF
FC/PC
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
WZ700001B (6/6)
MITSUBISHI (OPTICAL DEVICES)
FU-68SDF-x8xxMxxB
1.55 µm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL
Safety Cautions for Use of Optoelectronic Devices
General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with
semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents
that results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is
recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements
must be strictly observed.
Warning!
1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IR-
viewer, or other appropriate instruments.
2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if
made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in
one's mouth or swallow it.
3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general
industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices
1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or
electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for
installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability.
(2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains,
vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi
Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes
upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical
fiber, or other problems.
(2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices.
(3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing.
Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on.
The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority
over the following general cautions):
(1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30 C, and humidity between 40~60 percent
RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in
case of long-term storage for six months or more.
(2) The atmosphere should be particularly free from toxic gases and dust.
(3) Do not apply any load on the product.
(4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead
causing soldering problems in the customer’s assembling process.
(5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided
for storing. Temperature in storage locations should be stable.
(6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the
atmosphere.
(7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products
require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the
generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly
lower the reliability, but also may lead to serious accidents.
(2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested
to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When
handling this product, please observe the following countermeasures:
<Countermeasures against Static Electricity and Surge>
To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line:
(1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with
hot plates, solder irons and other items for which the commercial power supplies are prone to leakage.
(2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at
work is highly recommended.
(3) Use conductive materials for this product’s container, etc.
(4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work
area, etc.
(5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.),
pay close attention to the static electricity in those parts. ESD may damage the product.
(6) Humidity in working environment should be controlled to be 40 percent RH or higher.
These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this
product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein
without notice. No liability is assumed as a result of their use or application.
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