HSBA3 [MMD]

6.0mm x 3.5 mm x1.2mm Ceramic Package; 6.0毫米个3.5mm x1.2mm陶瓷封装
HSBA3
元器件型号: HSBA3
生产厂家: MMD COMPONENTS    MMD COMPONENTS
描述和应用:

6.0mm x 3.5 mm x1.2mm Ceramic Package
6.0毫米个3.5mm x1.2mm陶瓷封装

PDF文件: 总1页 (文件大小:96K)
下载文档:  下载PDF数据表文档文件
型号参数:HSBA3参数

HSB-A550I

Onboard AMD® G-Series T16R Processor

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30 AAEON

HSB-A550i-A10-G2

Onboard AMD® G-Series T16R Processor

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16 AAEON

HSB-ARA62-S115A

Telecom and Datacom Connector, 6 Contact(s), Female, Right Angle, Surface Mount Terminal, Receptacle

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0 DDK

HSB-ARA62-SN15A

For IEEE-1394 High Performance Serial Bus Connectors

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18 ETC

HSB-ARA62-SN15A

Telecom and Datacom Connector, Right Angle, Receptacle

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0 DDK

HSB-ARA62-T115A

Telecom and Datacom Connector, Right Angle, Receptacle

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1 DDK

HSB-ARA62-T115A

Telecom and Datacom Connector, Right Angle, Receptacle

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0 DDK

HSB-ARA62-TN15A

Telecom and Datacom Connector, 6 Contact(s), Female, Right Angle, Solder Terminal, Receptacle

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0 DDK

HSB-ARA6-S

Telecom and Datacom Connector

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2 DDK

HSB-ARA6-S

Telecom and Datacom Connector

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0 DDK

HSB-ARA6-T

Telecom and Datacom Connector

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0 DDK

HSB-ARA6-T

Telecom and Datacom Connector

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0 DDK

HSB-ARB62-T

Telecom and Datacom Connector

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0 DDK

HSB-ARB62-T215A

Telecom and Datacom Connector, Right Angle, Receptacle

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0 DDK

HSB-ARB62-T315A

Telecom and Datacom Connector, Right Angle, Receptacle

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2 DDK