0010897260 [MOLEX]

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating; 2.54毫米( .100“ )间距C- Grid®分离针座,双排,垂直,高温, 26电路, 0.76μm ( 30μ ”),金(Au )选择性电镀
0010897260
元器件型号: 0010897260
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
2.54毫米( .100“ )间距C- Grid®分离针座,双排,垂直,高温, 26电路, 0.76μm ( 30μ ”),金(Au )选择性电镀

PDF文件: 总4页 (文件大小:425K)
下载文档:  下载PDF数据表文档文件
型号参数:0010897260参数

0010897260_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897261

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 26 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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17 MOLEX

0010897261_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897262

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating

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27 MOLEX

0010897262_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897263

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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14 MOLEX

0010897263_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897280

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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14 MOLEX

0010897280_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897281

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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14 MOLEX

0010897282

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail

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12 MOLEX

0010897282_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897300

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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12 MOLEX

0010897300_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature,

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0 MOLEX1

0010897301

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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7 MOLEX