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0010897582 [MOLEX]

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 58 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail; 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 58电路， 0.38μm （ 15μ ”），金（Au ）选择性电镀，锡（Sn ） PC端脚镀层， 2.72毫米（ 0.107 “ ）的PC尾

0010897582


元器件型号：	0010897582
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 58 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 58电路， 0.38μm （ 15μ ”），金（Au ）选择性电镀，锡（Sn ） PC端脚镀层， 2.72毫米（ 0.107 “ ）的PC尾 PC
PDF文件：	总4页 (文件大小：425K)
下载文档：	下载PDF数据表文档文件
型号参数：0010897582参数

0010897600

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 60 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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12 MOLEX

0010897601

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 60 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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7 MOLEX

0010897601_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897602

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 60 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating

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12 MOLEX

0010897620

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 62 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail

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17 MOLEX

0010897620_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897621

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 62 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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10 MOLEX

0010897621_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897622

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 62 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail

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9 MOLEX

0010897640

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 64 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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10 MOLEX

0010897640_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897641

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 64 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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9 MOLEX

0010897641_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

0010897642

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 64 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC TailPlating, 2.72mm (.107") PC Tail

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14 MOLEX

0010897642_17

2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature

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0 MOLEX1

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