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0015477508 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直，高温，罩，用PEG ， 8回路，锡（Sn ）镀层

0015477508


元器件型号：	0015477508
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直，高温，罩，用PEG ， 8回路，锡（Sn ）镀层连接器集管和边缘连接器
PDF文件：	总4页 (文件大小：381K)
下载文档：	下载PDF数据表文档文件
型号参数：0015477508参数

0015477508_17

2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

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0 MOLEX1

0015477510

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating

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8 MOLEX

0015477510_17

2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

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0 MOLEX1

0015477512

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits

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7 MOLEX

0015477512_17

2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

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0 MOLEX1

0015477514

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating

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20 MOLEX

0015477514_17

2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

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0 MOLEX1

0015477516

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, Tin (Sn) Plating

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7 MOLEX

0015477516_17

2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

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0 MOLEX1

0015477518

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, Tin (Sn) Plating

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10 MOLEX

0015477520

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, Tin (Sn) Plating

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16 MOLEX

0015477522

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 22 Circuits, Tin (Sn) Plating

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6 MOLEX

0015477524

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, Tin (Sn) Plating

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8 MOLEX

0015477526

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

0015-47-7526

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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9 MOLEX

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