001580-0307 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating; 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层
001580-0307
元器件型号: 001580-0307
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层

PDF文件: 总7页 (文件大小:1222K)
下载文档:  下载PDF数据表文档文件
型号参数:001580-0307参数

0015800307-ND

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

0015800309

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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10 MOLEX

0015800309

Board Connector, 30 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, LOW HALOGEN, ROHS AND REACH COMPLIANT

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0 MOLEX

0015800309_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800321

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating

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9 MOLEX

0015800323

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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9 MOLEX

0015800323

Board Connector, 32 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, LOW HALOGEN, ROHS AND REACH COMPLIANT

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-
0 MOLEX

0015800323_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800325

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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14 MOLEX

0015800325_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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-
0 MOLEX1

0015800329

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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-
8 MOLEX

0015800329_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800341

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating

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12 MOLEX

0015800341_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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-
0 MOLEX1

0015800343

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

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11 MOLEX