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0015800207 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 20电路，锡（Sn ）镀层

0015800207


元器件型号：	0015800207
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 20电路，锡（Sn ）镀层连接器集管和边缘连接器
PDF文件：	总7页 (文件大小：1222K)
下载文档：	下载PDF数据表文档文件
型号参数：0015800207参数

0015800207_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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0 MOLEX1

0015800209

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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11 MOLEX

0015800209_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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0 MOLEX1

0015800221

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating

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10 MOLEX

0015800221_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row

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0 MOLEX1

0015800223

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,

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19 MOLEX

0015800225

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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20 MOLEX

0015800225_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800229

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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10 MOLEX

0015800229_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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0 MOLEX1

0015800241

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating

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13 MOLEX

0015800241_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800243

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits

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16 MOLEX

0015800243_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical,

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0 MOLEX1

0015800245

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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18 MOLEX

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