0015800423 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits; 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路42
0015800423
型号: 0015800423
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路42

连接器 集管和边缘连接器
文件: 总7页 (文件大小:1221K)
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0015800425

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

0015800441

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

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9 MOLEX

0015800441_17

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical

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0 MOLEX1

0015800443

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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9 MOLEX

0015800445

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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10 MOLEX

0015800449

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature

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18 MOLEX

0015800461

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating

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9 MOLEX

0015800463

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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7 MOLEX

0015800465

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 154
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9 MOLEX

0015800481

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating

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12 MOLEX

0015800483

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 154
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14 MOLEX

0015800485

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits

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9 MOLEX

0015800489

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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6 MOLEX

0015-80-0489

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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3 MOLEX

001580-0489

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating

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0 MOLEX