0015800663 [MOLEX]
2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating; 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 66电路, 0.38μm ( 15μ ),金(Au )选择性电镀型号: | 0015800663 |
厂家: | Molex |
描述: | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating |
文件: | 总7页 (文件大小:1222K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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