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010-89-7741 [MOLEX]

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 74 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length; 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 74电路，锡（Sn ）镀层， 2.72毫米（ 0.107 ” ） PCB焊脚长度

010-89-7741


元器件型号：	010-89-7741
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 74 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 74电路，锡（Sn ）镀层， 2.72毫米（ 0.107 ” ） PCB焊脚长度连接器集管和边缘连接器 PC
PDF文件：	总4页 (文件大小：425K)
下载文档：	下载PDF数据表文档文件
型号参数：010-89-7741参数

010-89-7742

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 74 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating

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1 MOLEX

010-89-7742

2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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1 MOLEX

010-89-7743

2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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1 MOLEX

010-89-7760

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 76 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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1 MOLEX

010-89-7760

2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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1 MOLEX

010-89-7761

2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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5 MOLEX

010-89-7761

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 76 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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0 MOLEX

010-89-7761

Board Connector, 76 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Black Insulator, Receptacle,

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0 MOLEX

010-89-7762

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 76 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail

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1 MOLEX

010-89-7762

2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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1 MOLEX

010-89-7763

2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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4 MOLEX

010-89-7780

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 78 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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7 MOLEX

010-89-7780

2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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3 MOLEX

010-89-7780

Board Connector, 78 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Black Insulator, Receptacle,

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0 MOLEX

010-89-7781

2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length

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6 MOLEX

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