0702462501 [MOLEX]

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void; 2.54毫米( .100“ )间距C- Grid®头,低调,双排,垂直,罩, 26电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,锡(Sn ) PC端脚镀层,太虚
0702462501
型号: 0702462501
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded,26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, Void
2.54毫米( .100“ )间距C- Grid®头,低调,双排,垂直,罩, 26电路, 0.38μm ( 15μ ”),金(Au )选择性电镀,锡(Sn ) PC端脚镀层,太虚

连接器 集管和边缘连接器 PC
文件: 总4页 (文件大小:179K)
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0702462601

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

0702462602

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 154
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8 MOLEX

0702462604

2.54mm (.100) Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating

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11 MOLEX

0702463001

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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4 MOLEX

0702463002

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

0702463004

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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9 MOLEX

0702463401

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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9 MOLEX

0702463402

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 154
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8 MOLEX

0702463404

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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7 MOLEX

0702464001

2.54mm (.100") Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits

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7 MOLEX

0702464002

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 154
-
7 MOLEX

0702464004

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 40Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC Tail Plating

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7 MOLEX

0702464401

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

0702464402

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Warning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 154
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8 MOLEX

0702465001

2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 50Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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-
8 MOLEX