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0702472654 [MOLEX]

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC TailPlating; 2.54毫米（ .100“ ）间距C- Grid®头，双排，超薄，直角， Shrouded26电路， 0.127μm （ 5μ ”），金（Au ）镀层，锡（Sn ） PC TailPlating

0702472654


元器件型号：	0702472654
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC TailPlating 2.54毫米（ .100“ ）间距C- Grid®头，双排，超薄，直角， Shrouded26电路， 0.127μm （ 5μ ”），金（Au ）镀层，锡（Sn ） PC TailPlating PC
PDF文件：	总4页 (文件大小：165K)
下载文档：	下载PDF数据表文档文件
型号参数：0702472654参数

0702473051

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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5 MOLEX

0702473052

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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7 MOLEX

0702473054

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC TailPlating

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2 MOLEX

0702473451

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded34 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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10 MOLEX

0702473452

2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded,34 Circuits, 0.76um

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10 MOLEX

0702473454

2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 34 Circuits, 0.127um

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6 MOLEX

0702474051

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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7 MOLEX

0702474052

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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7 MOLEX

0702474054

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded,40 Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC TailPlating

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16 MOLEX

0702474451

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded44 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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12 MOLEX

0702474851

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded48 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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6 MOLEX

0702475051

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded,50 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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10 MOLEX

0702475052

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

0702475054

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.127μm (5μ") Gold (Au) Plating, Tin(Sn) PC TailPlating

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13 MOLEX

0702475652

2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded56 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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8 MOLEX

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