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0702800453 [MOLEX]

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail; 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 90电路， 0.38μm （ 15μ ”），金（Au ）选择性电镀，锡（Sn ） PC尾

0702800453


元器件型号：	0702800453
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 90电路， 0.38μm （ 15μ ”），金（Au ）选择性电镀，锡（Sn ） PC尾 PC
PDF文件：	总4页 (文件大小：287K)
下载文档：	下载PDF数据表文档文件
型号参数：0702800453参数

0702800454

2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 92 Circuits, 0.38um

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5 MOLEX

0702800455

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 94 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail

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5 MOLEX

0702800456

2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 96 Circuits

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10 MOLEX

0702800457

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 98 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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12 MOLEX

0702800458

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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6 MOLEX

0702800459

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 82 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail

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5 MOLEX

0702800460

2.54mm (.100) Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 84 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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7 MOLEX

0702800461

2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 86 Circuits

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8 MOLEX

0702800462

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 88 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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8 MOLEX

0702800463

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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7 MOLEX

0702800464

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 92 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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7 MOLEX

0702800465

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 94 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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7 MOLEX

0702800466

2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 96 Circuits

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6 MOLEX

0702800467

2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 98 Circuits

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9 MOLEX

0702800468

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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14 MOLEX

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