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0702800475 [MOLEX]

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 94 Circuits, Tin (Sn) Plating, 2.79mm (.110") PC Tail Length; 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 94电路，锡（Sn ）镀层， 2.79毫米（ 0.110 ” ） PCB焊脚长度

0702800475


元器件型号：	0702800475
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 94 Circuits, Tin (Sn) Plating, 2.79mm (.110") PC Tail Length 2.54毫米（ .100“ ）间距C- Grid®分离针座，双排，垂直，高温， 94电路，锡（Sn ）镀层， 2.79毫米（ 0.110 ” ） PCB焊脚长度连接器集管和边缘连接器 PC
PDF文件：	总4页 (文件大小：287K)
下载文档：	下载PDF数据表文档文件
型号参数：0702800475参数

0702800476

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 96 Circuits, Tin (Sn) Plating, 2.79mm (.110") PC Tail Length

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4 MOLEX

0702800477

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 98 Circuits, Tin (Sn) Plating, 2.79mm (.110") PC Tail Length

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8 MOLEX

0702800478

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, Tin (Sn) Plating, 2.79mm (.110") PC Tail Length

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4 MOLEX

0702800479

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 82 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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3 MOLEX

0702800480

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 84 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC TailPlating, 2.79mm (.110") PC Tail

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13 MOLEX

0702800481

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 86 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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6 MOLEX

0702800482

2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 88 Circuits

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6 MOLEX

0702800483

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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9 MOLEX

0702800484

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 92 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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8 MOLEX

0702800485

2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 94 Circuits

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4 MOLEX

0702800486

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 96 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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6 MOLEX

0702800487

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 98 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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4 MOLEX

0702800488

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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5 MOLEX

0702800489

2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 56 Circuits, 8.13mm (.320") Mating Pin Length, Tin (Sn) Plating

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3 MOLEX

0702800490

2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 84 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail

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3 MOLEX

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