0736443017 [MOLEX]
2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A; 2.00毫米（ .079 “ ）间距HDM板对板背板头，垂直， SMC ，踩飞度，导柱位置一
| 型号： | 0736443017 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A |
| 文件： | 总4页 (文件大小：168K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0736443016
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-
Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits
Documents:
3D Model
Drawing (PDF)
Test Summary (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
Agency Certification
CSA
UL
LR19980
E29179
EU RoHS
RoHS Compliant by
Exemption
REACH SVHC
Not Reviewed
Halogen-Free
Status
Not Reviewed
Need more information on product
environmental compliance?
General
Product Family
Series
Application
Comments
Component Type
Overview
Backplane Connectors
73644
Backplane
Standard Press-Fit, Tin/Lead (SnPb)
PCB Header
hdm
HDM®
N/A
Product Name
Style
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Circuits (Loaded)
144
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Flammability
144
Black, Natural
250
No
Please visit the Contact Us section for any
non-product compliance questions.
94V-0
Guide to Mating Part
Keying to Mating Part
Material - Metal
Yes
None
Search Parts in this Series
73644Series
Phosphor Bronze, Stainless Steel
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Gold
Tin
Mates With
High Temperature Thermoplastic
24
Open Pin Field
6
73632 HDM PLUS® Board-to-Board
Daughtercard Receptacle. 73780 HDM®
Board-to-Board Daughtercard Receptacle
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Vertical
0.138 In
3.50 mm
No
Application Tooling | FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Yes
0.098 In
2.50 mm
Tube
Global
Description
Product #
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
15
0.375
Flat Rock Tooling for 0622013700
Pneumatic Press
HDM® Backplane
Insertion Signal
Contact Tool
0621001400
HDM® Backplane
Insertion Head for
144 Positions
0622005703
Polarized to PCB
No
Extraction Tool
0621001000
Stackable
No
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Yes
-55°C to +105°C
Through Hole - Compliant Pin
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
1A
1.0 Gbps
75
No
Voltage - Maximum
250V AC
Material Info
Reference - Drawing Numbers
Packaging Specification
Sales Drawing
PK-70873-0818
SDA-73644-****
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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