0736510033 [MOLEX]
2.00mm (.079") Pitch HDM Board-to-Board Daughterboard Power Module, Right Angle, SMC, 3-Blade Module, 3 Circuits; 2.00毫米（ .079 “ ）间距HDM板对板子板电源模块，直角， SMC ， 3 -Blade的模块， 3电路
| 型号： | 0736510033 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM Board-to-Board Daughterboard Power Module, Right Angle, SMC, 3-Blade Module, 3 Circuits |
| 文件： | 总5页 (文件大小：212K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0736510033
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Daughterboard Power Module, Right
Angle, SMC, 3-Blade Module, 3 Circuits
Documents:
3D Model
Packaging Specification (PDF)
Drawing (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
Agency Certification
CSA
UL
LR19980
E29179
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Not Reviewed
Halogen-Free
Status
General
Product Family
Series
Application
Component Type
Overview
Backplane Connectors
73651
Daughtercard
Power Receptacle
hdm
Not Reviewed
Product Name
Style
HDM®
N/A
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Circuits (Loaded)
3
3
Circuits (maximum)
Color - Resin
Black
250
No
94V-0
Please visit the Contact Us section for any
non-product compliance questions.
Durability (mating cycles max)
First Mate / Last Break
Flammability
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
No
None
Search Parts in this Series
73651Series
High Performance Alloy (HPA)
Gold
Tin
High Temperature Thermoplastic
Mates With
Number of Columns
Number of Pairs
Number of Rows
1
73656 HDM® Board-to-Board Backplane
Power Module
Open Pin Field
3
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Right Angle
0.079 In
2.00 mm
Yes
PCB Retention
None
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.062 In
1.60 mm
Tube
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.157 In
4.00 mm
0.118 In
3.00 mm
30
0.75
100
2.5
No
Stackable
No
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
No
-55°C to +105°C
Through Hole
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
15A
1.0 Gbps
19
No
Voltage - Maximum
500V
Material Info
Reference - Drawing Numbers
Packaging Specification
Sales Drawing
PK-70873-0820
SDA-73651-****
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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