0737802157 [MOLEX]
2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669"), Pin Length 3.50mm (.138"),; 2.00毫米( .079 “ )间距HDM®板对板子卡插座,垂直, SignalModule , 72电路,安装高度17.00毫米( 0.669 ” ) ,引脚长度3.50毫米( 0.138 “ ) ,型号: | 0737802157 |
厂家: | Molex |
描述: | 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669"), Pin Length 3.50mm (.138"), |
文件: | 总3页 (文件大小:202K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0737802153
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal
Module, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 3.50mm (.138"),
Press Fit
Documents:
3D Model
Drawing (PDF)
Test Summary (PDF)
Product Specification PS-73780-999 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
EU RoHS
RoHS Compliant by
Exemption
China RoHS
General
Product Family
Series
Backplane Connectors
73780
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Halogen-Free
Need more information on product
environmental compliance?
Application
Comments
Component Type
Overview
Product Name
Style
Daughtercard, Mezzanine
Press Fit Tail
PCB Receptacle
hdm
HDM®
N/A
Physical
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Circuits (Loaded)
72
72
Black
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
250
No
No
None
Please visit the Contact Us section for any
non-product compliance questions.
Copper-Nickel-Tin
Material - Plating Mating
Material - Plating Termination
Material - Resin
Gold
Tin-Lead
High Temperature Thermoplastic
Search Parts in this Series
73780Series
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
12
Mates With
Open Pin Field
6
Vertical
0.138 In
3.50 mm
No
HDM® Board-to-Board Backplane Header
73642 , 73643 , 73644 , 73942 , 73943 ,
73944 , 74349 , 74428. HDM® Board-to-
Board Stacking Header 73769 , 73770 ,
73782 , 73783 , 73771
PC Tail Length (mm)
PCB Locator
PCB Retention
None
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.063 In
1.60 mm
Tube
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
35
0.88
No
Stackable
Yes
Surface Mount Compatible (SMC)
Yes
Temperature Range - Operating
Termination Interface: Style
-55°C to +105°C
Through Hole - Compliant Pin
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
15A, 1A
1.0 Gbps
75
No
Voltage - Maximum
250V AC
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-73780-999
SD-73780-001
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/25/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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