0737820200 [MOLEX]
2.00mm (.079") Pitch HDM Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 72 Circuits; 2.00毫米（ .079 “ ）间距HDM板对板堆垛头，高层垂直， SMC ，闭端选项， 72电路
| 型号： | 0737820200 |
| 厂家： | 
Molex |
| 描述： | 2.00mm (.079") Pitch HDM Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 72 Circuits |
| 文件： | 总5页 (文件大小：197K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0737820200
Active
hdm
Overview:
Description:
2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical,
SMC, Closed End Option, 72 Circuits
Documents:
3D Model
Drawing (PDF)
Product Specification PS-73780-999 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
Agency Certification
CSA
UL
LR19980
E29179
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Not Reviewed
Halogen-Free
Status
China RoHS
General
Product Family
Series
Application
Component Type
Overview
Backplane Connectors
73782
Backplane, Mezzanine
PCB Header
hdm
Not Reviewed
Product Name
Style
HDM®
N/A
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Physical
Circuits (Loaded)
72
72
Circuits (maximum)
Color - Resin
Black
200
No
94V-0
Please visit the Contact Us section for any
non-product compliance questions.
Durability (mating cycles max)
First Mate / Last Break
Flammability
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
No
None
Phosphor Bronze
Gold
Tin-Lead
High Temperature Thermoplastic
Search Parts in this Series
73782Series
Mates With
Number of Columns
Number of Pairs
Number of Rows
12
73632 HDM PLUS® Board-to-Board
Daughtercard Receptacle. 73780 HDM®
Board-to-Board Daughtercard Receptacle
Open Pin Field
6
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Retention
Vertical
0.079 In
2.00 mm
None
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.055 In
1.40 mm
Tube
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.079 In
2.00 mm
30
0.75
100
2.5
No
Stackable
Yes
Surface Mount Compatible (SMC)
Temperature Range - Operating
Yes
-55°C to +105°C
Termination Interface: Style
Through Hole
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Voltage - Maximum
1A
1.0 Gbps
72
100V AC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
5
Wave Capable (TH only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
260
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
PK-70873-0875
PS-73780-999
SD-73782-001
Sales Drawing
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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