This document was generated on 06/01/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0877156000
Planned for Obsolescence
1.00mm (.039") Pitch, PCI Express* Connector, 36 Circuits, Nylon 6/6 Glass-filled,
Black Housing, Phosphor Bronze, Gold (Au) Flash, with Plastic Pegs, 2.54mm (.100")
Soldertail, Lead Free
Description:
Documents:
3D Model
Drawing (PDF)
Product Specification PS-87715-200 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
China RoHS
Agency Certification
CSA
UL
LR19980
E29179
EU RoHS
ELV and RoHS
Compliant
General
REACH SVHC
Not Reviewed
Halogen-Free
Status
Product Family
Series
Comments
Component Type
Product Name
Edge Card Connectors
87715
PCI 1 lane
Edgecard to PCB
PCI Express*
Halogen-Free
Need more information on product
environmental compliance?
Physical
Circuits (Loaded)
36
36
Email productcompliance@molex.com
Circuits (maximum)
For a multiple part number RoHS Certificate of
Compliance, click here
Circuits Detail
Durability (mating cycles max)
Entry Angle
All Signal
50
Vertical (Top Entry)
94V-0
Yes
Gold
Please visit the Contact Us section for any
non-product compliance questions.
Flammability
Keying to Mating Part
Material - Plating Mating
Material - Plating Termination
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Tin
0.100 In
2.54 mm
Yes
Search Parts in this Series
87715Series
PCB Retention
Yes
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
0.062 In
1.60 mm
Tray
Mates With
PCI Express Card
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Polarized to Mating Part
Temperature Range - Operating
Termination Interface: Style
0.039 In
1.00 mm
0.039 In
1.00 mm
Yes
-55°C to +85°C
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
1.1A
50V AC (RMS)/DC
Solder Process Data
Lead-free Process Capability
Process Temperature max. C
Wave Capable (TH only)
245
Material Info
Reference - Drawing Numbers
晶体管架构变迁：Planar FET 至 MBCFET 的演变历程
SiC 陷入囚徒困境，五大路径助力行业破局
存算一体技术新突破：我国科研团队解决排序难题
功率 MOS 管烧毁的背后：开关原理、损耗机制及预防措施
概述
规格参数
数据手册
