0877614408 [MOLEX]

2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, 12.50mm (.492) Stacking; 2.00毫米( 0.079 )间距的Milli-电网™头,双排双体,通孔,垂直, 44电路, 0.76μm ( 30μ ),金(Au )选择性电镀, 12.50毫米( 0.492 )堆叠
0877614408
型号: 0877614408
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, 12.50mm (.492) Stacking
2.00毫米( 0.079 )间距的Milli-电网™头,双排双体,通孔,垂直, 44电路, 0.76μm ( 30μ ),金(Au )选择性电镀, 12.50毫米( 0.492 )堆叠

文件: 总3页 (文件大小:98K)
下载:  下载PDF数据表文档文件

0877615000

Board Connector, 50 Contact(s), 2 Row(s), Straight, 0.079 inch Pitch, Solder Terminal, Locking,

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0 MOLEX

0877615001

2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height

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12 MOLEX

0877615021

2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height

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25 MOLEX

0877615022

2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height

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25 MOLEX

0877620006

2MM MGRID 24 CKT DRDW SMT 38UM

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0 MOLEX

0877620010

2MM MGRID 26 CKT DRDW SMT 38UM

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0 MOLEX

0877621633

2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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4 MOLEX

0877730005

3-Pin Header, Staggered, Vertical, Through Hole, Lead-free

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7 MOLEX

0877751001

1.00mm (.039) Pitch DDR2 DIMM Socket, Through Hole, 0.76μm (30μ) Gold (Au), 2.67mm (0.109) Soldertail, 276 Circuits, Lead free

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5 MOLEX

0877751011

1.00mm (.039) Pitch DDR2 DIMM Socket, Through Hole, 0.76μm (30μ) Gold (Au), 3.18mm (0.125) Soldertail, 276 Circuits, Lead free

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14 MOLEX

0877751101

1.00mm (.039) Pitch DDR2 DIMM Socket, Through Hole, 0.76μm (30μ) Gold (Au), 4.00mm (0.157) Soldertail, 276 Circuits, Lead free

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7 MOLEX

0877791001

1.27mm (.050) Pitch Serial ATA Backplane Receptacle, Through Hole, Vertical, SIL, Standard Height, 0.76μm (30μ) Gold (Au) Selective, 22 Circuits, Leadfree

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8 MOLEX

0877801001

1.27mm (.050) Pitch Serial ATA Host Receptacle, Press-fit, Vertical, Extended Height, 0.76μm (30μ) Gold (Au) Selective, 22 Circuits, Leadfree

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10 MOLEX

0877811001

1.27mm (.050) Pitch Serial ATA Host Receptacle, Surface Mount, Vertical, Extended Height, 0.76μm (30μ) Gold (Au) Selective, 22 Circuits, Leadfree

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10 MOLEX

0877822001

0.60mm (.024) Pitch miniDIMM DDR2, Socket, Surface Mount, Vertical, 1.8V Voltage Key, 244 Circuits, 0.76μm (30μ) Gold (Au) Plating, Off- White Latches

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15 MOLEX