0877910120 [MOLEX]

2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free; 2.00毫米( 0.079 )间距板对板可拆卸面板,PCB插座,表面贴装,电路20 ,金(Au )选择性电镀,纸盒包装,无铅
0877910120
元器件型号: 0877910120
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Receptacle, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00毫米( 0.079 )间距板对板可拆卸面板,PCB插座,表面贴装,电路20 ,金(Au )选择性电镀,纸盒包装,无铅

插座 PC
PDF文件: 总3页 (文件大小:133K)
下载文档:  下载PDF数据表文档文件
型号参数:0877910120参数

0877921114

2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 14 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap

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12 MOLEX

0877921116

2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

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6 MOLEX

0877921120

2.00mm (.079) Pitch Board-to-Board Panel Detachable, PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

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11 MOLEX

0877922116

2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 16 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap

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5 MOLEX

0877922120

2.00mm (.079) Pitch Board-to-Board Panel Detachable PCB Header, Surface Mount, 20 Circuits, Gold (Au) Selective Plating, with Pick-and-Place Cap

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5 MOLEX

0877940001

2.50mm (.098) / 3.00mm (.118) Pitch Wire-to Board Receptacle Housing with Fuse, with Bottom Flange, 16 Circuits

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5 MOLEX

0877940002

2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse, with Side Flange, 16 Circuits

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6 MOLEX

0877970010

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging

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6 MOLEX

0877970032

Board Stacking Connector

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0 MOLEX

0877970040

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54μm (100μ) Tin (Sn) Plating, 14.22mm (.560) Stacking Height

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6 MOLEX

0877970045

Board Stacking Connector, 34 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, LOW HALOGEN, ROHS AND REACH COMPLIANT

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0 MOLEX

0877970602

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, 25.60mm (1.043) Stacking Height

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11 MOLEX

0877971001

2.54MM C-GRID DRDW T/H HDR 10CKT

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0 MOLEX

0877971200

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height

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19 MOLEX

0877971800

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging

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25 MOLEX