0878346021 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing; 2.54毫米( .100 )间距C- Grid®头,双排,低调,垂直,罩,PCB定位器,带尾窗, 0.13微米( 5μ ),金(Au )闪镀,尼龙房
0878346021
元器件型号: 0878346021
生产厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述和应用:

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing
2.54毫米( .100 )间距C- Grid®头,双排,低调,垂直,罩,PCB定位器,带尾窗, 0.13微米( 5μ ),金(Au )闪镀,尼龙房

PC
PDF文件: 总3页 (文件大小:128K)
下载文档:  下载PDF数据表文档文件
型号参数:0878346021参数

0878346041

2.54mm (.100) Pitch C-Grid® Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

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11 MOLEX

0878350842

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

0878351042

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

0878351043

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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5 MOLEX

0878351242

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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6 MOLEX

0878351442

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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9 MOLEX

0878351642

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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12 MOLEX

0878351643

2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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8 MOLEX

0878352042

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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10 MOLEX

0878352043

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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9 MOLEX

0878352442

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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11 MOLEX

0878352642

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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8 MOLEX

0878353442

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

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11 MOLEX

0878354042

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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11 MOLEX

0878354043

2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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7 MOLEX