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0879141001 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free; 2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直， 10电路， 0.38μm （ 15μ ），金（Au ），电镀，包装纸盒，无铅

0879141001


元器件型号：	0879141001
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直， 10电路， 0.38μm （ 15μ ），金（Au ），电镀，包装纸盒，无铅连接器集管和边缘连接器
PDF文件：	总11页 (文件大小：762K)
下载文档：	下载PDF数据表文档文件
型号参数：0879141001参数

0879141016

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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6 MOLEX

0879141216

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 12 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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12 MOLEX

0879141405

Board Connector,

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0 MOLEX

0879141416

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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8 MOLEX

0879141616

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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4 MOLEX

0879141816

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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18 MOLEX

0879142016

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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10 MOLEX

0879142216

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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16 MOLEX

0879142226

Board Connector, 22 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator

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0 MOLEX

0879142406

Board Connector,

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0 MOLEX

0879142416

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 24 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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15 MOLEX

0879142616

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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11 MOLEX

0879142815

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free

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8 MOLEX

0879142816

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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19 MOLEX

0879143016

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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9 MOLEX

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