0901362108 [MOLEX]
2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Right Angle, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni); 2.54毫米( .100 )间距C-电网III ™头,单排,直角,带罩, 8电路,为4μm ( 160μ )锡/铅(Sn )在镍(Ni )![0901362108](http://pdffile.icpdf.com/pdf1/p00138/img/icpdf/0901362102_762931_icpdf.jpg)
型号: | 0901362108 |
厂家: | ![]() |
描述: | 2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Right Angle, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni) |
文件: | 总5页 (文件大小:258K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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This document was generated on 03/31/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0901362102
Active
C-Grid III™
Overview:
Description:
2.54mm (.100") Pitch C-Grid III™ Header, Single Row, Right Angle, Shrouded, 2
Circuits, 4µm (160µ") Tin/Lead (Sn) over Nickel (Ni)
Documents:
3D Model
RoHS Certificate of Compliance (PDF)
Drawing (PDF)
Series
image - Reference only
General
Product Family
Series
PCB Headers
90136
EU RoHS
China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Application
Overview
Product Name
Wire-to-Board
C-Grid III™
C-Grid III™
Physical
Breakaway
No
Not Halogen-Free
Circuits (Loaded)
2
Circuits (maximum)
Color - Resin
2
Need more information on product
environmental compliance?
Black
No
No
No
None
Yes
Brass
Tin
Tin
Polyester
1
Right Angle
0.114 In
2.90 mm
No
First Mate / Last Break
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
90136Series
Mates With
90123 C-Grid III™ Modular Crimp Housing.
90156 C-Grid III™ Crimp Housing
PCB Retention
None
0.062 In
1.60 mm
Tray
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
0.100 In
2.54 mm
120
3
120
3
No
Shrouded
Fully
Stackable
No
Temperature Range - Operating
Termination Interface: Style
-55°C to +125°C
Through Hole
Electrical
Current - Maximum per Contact
Voltage - Maximum
3A
350V
Solder Process Data
Lead-free Process Capability
Wave Capable (TH only)
Material Info
Reference - Drawing Numbers
Sales Drawing
SDA-90136
This document was generated on 03/31/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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