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15-47-7530 [MOLEX]

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating; 2.54毫米（ .100 ）间距C- GridÂ®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层

15-47-7530


元器件型号：	15-47-7530
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating 2.54毫米（ .100 ）间距C- GridÂ®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层连接器集管和边缘连接器 PC
PDF文件：	总4页 (文件大小：381K)
下载文档：	下载PDF数据表文档文件
型号参数：15-47-7530参数

15-47-7532

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, Tin (Sn) Plating

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10 MOLEX

15-47-7534

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, Tin (Sn) Plating

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8 MOLEX

15-47-7534

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7536

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7536

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, Tin (Sn) Plating

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9 MOLEX

15-47-7538

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits, Tin (Sn) Plating

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7 MOLEX

15-47-7538

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7540

2.54mm (.100) Pitch C-GridÂ® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7540

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, Tin (Sn) Plating

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6 MOLEX

15-47-7542

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, Tin (Sn) Plating

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5 MOLEX

15-47-7544

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, Tin (Sn) Plating

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7 MOLEX

15-47-7546

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits

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5 MOLEX

15-47-7548

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, Tin (Sn) Plating

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1 MOLEX

15-47-7548

Board Connector, 48 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle,

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0 MOLEX

15-47-7550

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, Tin (Sn) Plating

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7 MOLEX

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