15-47-7616 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating; 2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 16电路, 0.38μm ( 15μ ),金(Au )选择性电镀
15-47-7616
型号: 15-47-7616
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 16电路, 0.38μm ( 15μ ),金(Au )选择性电镀

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15-47-7618

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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4 MOLEX

15-47-7618

Board Connector, 18 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Receptacle,

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0 MOLEX

15-47-7620

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7620

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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16 MOLEX

15-47-7622

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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7 MOLEX

15-47-7624

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7624

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded

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11 MOLEX

15-47-7626

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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11 MOLEX

15-47-7626

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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1 MOLEX

15-47-7628

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7628

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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14 MOLEX

15-47-7630

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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3 MOLEX

15-47-7630

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7632

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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0 MOLEX

15-47-7632

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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4 MOLEX