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15-47-7714 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating; 2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 14电路, 0.76μm ( 30μ ),金(Au )选择性电镀
15-47-7714
型号: 15-47-7714
厂家: Molex    Molex
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54毫米( .100 )间距C- Grid®头,通孔,双排,垂直,高温,罩,用PEG , 14电路, 0.76μm ( 30μ ),金(Au )选择性电镀

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15-47-7716

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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7 MOLEX

15-47-7718

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

15-47-7720

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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15-47-7722

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

15-47-7724

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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11 MOLEX

15-47-7726

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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15-47-7728

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15-47-7730

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits

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15-47-7732

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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15-47-7734

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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7 MOLEX

15-47-7736

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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15-47-7740

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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15-47-7742

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15-47-7744

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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15-47-7746

2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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15-47-7750

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2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating

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