15-80-0387 [MOLEX]
2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating; 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层型号: | 15-80-0387 |
厂家: | Molex |
描述: | 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating |
文件: | 总7页 (文件大小:1222K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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15-80-0401
2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) PlatingWarning: Undefined variable $rtag in /www/wwwroot/www.icpdf.com/pdf/pdf/index.php on line 174
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15-80-0407
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15-80-0427
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