15-82-1596 [MOLEX]
Card Edge Connector, 40 Contact(s), 1 Row(s), Female, Right Angle, 0.05 inch Pitch, Solder Terminal, Latch, Black Insulator, Socket;![15-82-1596](http://pdffile.icpdf.com/pdf2/p00235/img/icpdf/15-82-1516_1376590_icpdf.jpg)
型号: | 15-82-1596 |
厂家: | ![]() |
描述: | Card Edge Connector, 40 Contact(s), 1 Row(s), Female, Right Angle, 0.05 inch Pitch, Solder Terminal, Latch, Black Insulator, Socket |
文件: | 总5页 (文件大小:479K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
1.27mm (.050") Pitch
SIMM Socket
FEATURES AND SPECIFICATIONS
Features and Benefits
Zero insertion force contacts improve socket and module Voltage: 250V
Electrical
contact life and provide for fast on-line assembly
Guaranteed 2 points of contact per readout with standard Contact Resistance: 30mΩ max.
Current: 1.0A
78968
JEDEC module
Dielectric Withstanding Voltage: 1000V AC
Right Polarization
Right Angle, Single Row
Plastic Latch
Anti-overstress latch feature provides extra protection
during module removal
Polarization posts provide orientation for proper loading of
socket into printed circuit board
Polarization rib properly orients module to socket
EIA standard dimensions
Insulation Resistance: 5000 MΩ min.
Mechanical
Normal Force: 1.47N average
Durability: 25 cycles
Physical
Housing: Black LCP, UL 94V-0
Contact: Phosphor Bronze Alloy
Plating: See Table
Reference Information
Product Specification: PS-78968
Packaging: Tray
Operating Temperature: -40 to +85˚C
UL File No.: E29179
CSA File No.: LR19980
Mates With: JEDEC modules
Designed In: Inches
CATALOG DRAWING (FOR REFERENCE ONLY)
L
Please refer to corresponding JEDEC standard MO-116 page for board
dimensions and module PCB layout
ORDERING INFORMATION AND DIMENSIONS
Order No.
Dimension
.250
.290
F = 7.37mm (.290")
E = 12.40mm (.488")
Tin
Circuits
F = 6.35mm (.250")
E = 11.38mm (.448")
A
B
C
D
Tin
Gold
64
72
15-82-0314
15-82-0320
105.41 (4.150)
115.57 (4.550)
85.09 (3.350)
95.25 (3.750)
101.60 (4.000)
111.76 (4.400)
39.37 (1.550)
44.45 (1.750)
15-82-1519
15-82-1592
Plating: Post plate 200µ" min. Tin/Lead over 50µ" min. Nickel overall or post plate 30µ" min. Gold on contact area
and 150µ" min. Tin/Lead on solder tails, all over 75µ" min. Nickel
L-32
MX01
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