1717222002 [MOLEX]

zQuad Small Form Factor Pluggable Plus (zQSFP) Stacked Integrated 2-by-2;
1717222002
型号: 1717222002
厂家: Molex    Molex
描述:

zQuad Small Form Factor Pluggable Plus (zQSFP) Stacked Integrated 2-by-2

文件: 总2页 (文件大小:42K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This document was generated on 11/17/2017  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
1717221001  
Active  
zQSFP+® Interconnect System  
Overview:  
Description:  
zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-1,  
Connector and Cage with EMI Spring Finger, 76 Circuit, Gold (Au) Over Nickel Plated,  
No Light Pipe  
Documents:  
3D Model  
Drawing (PDF)  
Application Specification AS-171565-0002-001 (PDF)  
Packaging Specification PK-171565-0001 (PDF)  
Series image - Reference only  
Product Specification PS-171565-0001-001 (PDF)  
Product Specification TS-171565-0001-001 (PDF)  
RoHS Certificate of Compliance (PDF)  
Product Literature (PDF)  
EU ELV  
Not Relevant  
Agency Certification  
UL  
E29179  
EU RoHS  
China RoHS  
Compliant  
General  
REACH SVHC  
Not Contained Per -  
ED/30/2017 (7 July  
2017)  
Halogen-Free  
Status  
Low-Halogen  
Need more information on product  
environmental compliance?  
Product Family  
Series  
Application  
Component Type  
Electrical Model  
Overview  
Product Literature Order No  
Product Name  
Type  
I/O Connectors  
171722  
Board-to-Board, Module-to-Board, Wire-to-Board  
Receptacle  
Yes  
zQSFP+® Interconnect System  
987650-5391  
zQSFP Plus, zQSFP+  
N/A  
UPC  
887191235868  
Email productcompliance@molex.com  
Please visit the Contact Us section for any  
non-product compliance questions.  
Physical  
Circuits (Loaded)  
76  
Circuits (maximum)  
Color - Resin  
Durability (mating cycles max)  
Flammability  
76  
Black  
100  
94V-0  
China ROHS  
ELV  
RoHS Phthalates  
Green Image  
Not Relevant  
Not Contained  
Keying to Mating Part  
Lock to Mating Part  
Material - Metal  
None  
Yes  
Copper Alloy  
Search Parts in this Series  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Net Weight  
Number of Rows  
Gold  
Matte Tin  
High Temperature Thermoplastic  
33.623/g  
2
171722 Series  
Mates With  
QSFP Cable Assembly 74757  
Orientation  
PC Tail Length  
PCB Locator  
Right Angle  
1.20mm  
Yes  
PCB Retention  
Yes  
PCB Thickness - Recommended  
Packaging Type  
1.57mm  
Tray  
Panel Mount  
N/A  
Pitch - Mating Interface  
Plating min - Mating  
Plating min - Termination  
Polarized to Mating Part  
Polarized to PCB  
0.80mm  
0.762µm  
0.762µm  
Yes  
Yes  
Ports  
2
Surface Mount Compatible (SMC)  
Temperature Range - Operating  
No  
-40°C to +85°C  
Termination Interface: Style  
Through Hole - Compliant Pin  
Electrical  
Current - Maximum per Contact  
Grounding to Panel  
Shield Type  
0.5A  
Yes  
EMI Fingers  
30V AC (RMS)/DC  
Voltage - Maximum  
Solder Process Data  
Lead-freeProcess Capability  
N/A  
Material Info  
Reference - Drawing Numbers  
Application Specification  
Electrical Model Document  
Packaging Specification  
Product Specification  
S-Parameter Model  
AS-171565-0002-001  
EE-171081-3000  
PK-171565-0001  
PS-171565-0001-001, TS-171565-0001-001  
SP-171081-3000  
Sales Drawing  
SD-171722-2000  
Signal Integrity Report  
Symbol/Footprint Data  
SI-171565-0001  
SYM-171722-1000  
This document was generated on 11/17/2017  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  

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