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22-29-2251 [MOLEX]

2.54mm (.100") Pitch KK Wire-to-Board Header, Vertical, with Friction Lock, 25 Circuits, Gold (Au) Plating; 2.54毫米（ .100“ ）间距KK线对板头，垂直，用摩擦锁， 25电路，金（Au ）镀层

22-29-2251


元器件型号：	22-29-2251
生产厂家：	Molex Electronics Ltd.
描述和应用：	2.54mm (.100") Pitch KK Wire-to-Board Header, Vertical, with Friction Lock, 25 Circuits, Gold (Au) Plating 2.54毫米（ .100“ ）间距KK线对板头，垂直，用摩擦锁， 25电路，金（Au ）镀层连接器集管和边缘连接器 PC
PDF文件：	总6页 (文件大小：428K)
下载文档：	下载PDF数据表文档文件
型号参数：22-29-2251参数

22-29-2261

2.54mm (.100") Pitch KK Wire-to-Board Header, Vertical, with Friction Lock, 26 Circuits, Gold (Au) Plating

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8 MOLEX

22-29-2261

Board Connector, 26 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Polarized Lck, Red Insulator, Receptacle

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0 MOLEX

22-29-2281

2.54mm (.100") Pitch KK Wire-to-Board Header, Vertical, with Friction Lock, 28 Circuits

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7 MOLEX

22-29-2281

Board Connector, 28 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Polarized Lck, Red Insulator, Receptacle

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0 MOLEX

22292A

UltraNAND? Flash for Code Storage Applications

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22 ETC

222-93-306-41-001100

IC Socket, DIP6, 6 Contact(s),

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0 MILL-MAX

222-93-308-41-001

IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Wire Wrap,

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0 MILL-MAX

222-93-314-41-001

IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Wire Wrap,

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0 MILL-MAX

222-93-314-41-001

IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Wire Wrap,

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0 MILL-MAX

222-93-314-41-001000

IC Socket, DIP14, 14 Contact(s),

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0 MILL-MAX

222-93-314-41-001000

IC Socket, DIP14, 14 Contact(s),

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-

0 MILL-MAX

222-93-314-41-001100

IC Socket, DIP14, 14 Contact(s),

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-

0 MILL-MAX

222-93-314-41-001100

IC Socket, DIP14, 14 Contact(s),

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-

0 MILL-MAX

222-93-316-41-001100

IC Socket, DIP16, 16 Contact(s),

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0 MILL-MAX

222-93-318-41-001

IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Wire Wrap,

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0 MILL-MAX

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